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LS1012ASN7KKB

NXP Semiconductors

LS1012ASN7KKB by NXP Semiconductors

LS1012ASN7KKB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, operating at a max clock frequency of 25 MHz. It features an external data bus width of 16 and low power mode, suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and very thin profile, it offers efficient performance in space-constrained environments.

Median Price

$33.558

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,574 parts In-Stock

1+ parts

$38.540

100+ parts

$29.547

1k+ parts

$26.376

10k+ parts

-

1,574

$38.540

$29.547

$26.376

-

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$38.540

100+ parts

$29.550

1k+ parts

$26.370

10k+ parts

-

90

$38.540

$29.550

$26.370

-

Rochester

USA . 32,210 parts In-Stock

1+ parts

-

100+ parts

$22.860

1k+ parts

$20.450

10k+ parts

$19.250

32,210

-

$22.860

$20.450

$19.250

Verical

USA . 31,538 parts In-Stock

1+ parts

-

100+ parts

$28.575

1k+ parts

$25.563

10k+ parts

$24.063

31,538

-

$28.575

$25.563

$24.063

Flip Electronics (Authorized)

USA . 523 parts In-Stock

1+ parts

-

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523

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Distributors (In-Stock)

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Digiode

USA . 3,321 parts In-Stock

1+ parts

$20.112

100+ parts

-

1k+ parts

-

10k+ parts

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3,321

$20.112

-

-

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Vyrian

USA . 995 parts In-Stock

1+ parts

$21.170

100+ parts

-

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-

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995

$21.170

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-

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Anansix

USA . 566 parts In-Stock

1+ parts

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566

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Flip Electronics

USA . 229 parts In-Stock

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229

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Bristol Electronics

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,524 parts In-Stock

1+ parts

$19.053

100+ parts

-

1k+ parts

-

10k+ parts

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3,524

$19.053

-

-

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$36.000

100+ parts

-

1k+ parts

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10k+ parts

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2,500

$36.000

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Microchip USA

USA . 1,769 parts In-Stock

1+ parts

$96.830

100+ parts

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1,769

$96.830

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Lixinc

USA . 10,534 parts In-Stock

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10,534

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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UNI Independent Distributors

Spain . 6,704 parts In-Stock

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6,704

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Perfect Parts

USA . 376 parts In-Stock

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376

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A-Z Elektronik GmbH

Germany . 168 parts In-Stock

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168

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Overview

Unlock the power of cutting-edge technology with the LS1012ASN7KKB by NXP Semiconductors. This microprocessor offers seamless integration, advanced performance, and unbeatable reliability for a wide range of applications. With its innovative design and top-notch quality, this product is guaranteed to exceed your expectations. Experience the next level of efficiency and productivity with the LS1012ASN7KKB - the perfect solution for all your processing needs.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves performance by storing frequently accessed data and instructions closer to the processor, reducing latency and improving overall speed.

Surface Mount: YES

Surface mount technology allows for a more compact and efficient packaging of the microprocessor, making it suitable for small form factor devices and saving space on the motherboard.

Maximum Supply Voltage: 0.93 V

Operating at a maximum supply voltage of 0.93V indicates low power consumption, making the microprocessor energy efficient and suitable for battery-powered devices.

Address Bus Width: 16

A wider address bus allows for access to a larger memory space, enabling the microprocessor to work with more data and instructions simultaneously.

Package Shape: SQUARE

The square package shape offers better thermal dissipation and easier mounting on the motherboard, ensuring efficient heat management and secure attachment.

Bit Size: 64

With a 64-bit architecture, the microprocessor can handle larger chunks of data at a time, improving processing speed and overall performance.

No. of Terminals: 211

Having 211 terminals allows for efficient connectivity with other components, peripherals, and external devices, enabling versatile usage and expandability.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style of grid array with a very thin profile and fine pitch design ensures a high level of integration and space-saving on the motherboard, ideal for compact devices.

Minimum Supply Voltage: 0.87 V

Operating at a minimum supply voltage of 0.87V indicates flexibility in power management and the ability to operate at lower power levels without sacrificing performance.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microprocessor can withstand high temperatures and maintain reliability under demanding conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures versatility in usage across different environmental conditions, from cold to hot environments.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the mounting process and improves connectivity, making it easier to integrate the microprocessor into various types of PCB layouts.

Maximum Seated Height: 0.925 mm

The low maximum seated height of 0.925mm allows for a slim and compact design, making the microprocessor suitable for thin devices or tight spaces.

Width: 9.6 mm

With a width of 9.6mm, the microprocessor offers a balance between compactness and connectivity, making it versatile for different form factors and applications.

Boundary Scan: YES

Having boundary scan capability enables easy testing and debugging of the microprocessor during production, ensuring high quality and reliability of the final product.

External Data Bus Width: 16

An external data bus width of 16 bits allows for efficient data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz indicates a balance between performance and power efficiency, suitable for a variety of applications that require moderate processing speed.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures reliable soldering during manufacturing, contributing to the durability and longevity of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes without being damaged, ensuring quality assembly.

Length: 9.6 mm

With a length of 9.6mm, the microprocessor offers a compact form factor while maintaining adequate connectivity and performance capabilities for a wide range of applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture, it provides efficient processing of instructions, leading to improved performance and speed.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and high-speed operation, making the microprocessor energy-efficient and reliable for various applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing and assembly process, ensuring a reliable connection and reducing the risk of damage during handling and soldering.

Nominal Supply Voltage: 0.9 V

Operating at a nominal supply voltage of 0.9V indicates a balance between performance and energy efficiency, making the microprocessor suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microprocessor offers efficient connectivity and integration, allowing for a compact design while maintaining reliable connections with other components.

Format: FIXED POINT

Utilizing a fixed-point format allows for efficient arithmetic operations and simplified programming, making the microprocessor suitable for applications that require precise calculations and real-time processing.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring standard precautions to prevent damage to the microprocessor.

Speed: 1000 rpm

Operating at a speed of 1000 revolutions per minute (rpm) indicates efficient processing capabilities and responsiveness, suitable for applications that require high-speed data processing.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to operate at reduced power levels when not performing intensive tasks, extending battery life and reducing energy consumption.

Technical Specifications

Microprocessors LS1012ASN7KKB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XBGA-N211

Length:

9.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

211

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.925 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9.6 mm

Peripheral IC Type:

Trade Compliance

LS1012ASN7KKB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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