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LS1012ASE7EKB

NXP Semiconductors

LS1012ASE7EKB by NXP Semiconductors

LS1012ASE7EKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. It features integrated cache, low power mode, and boundary scan capabilities. Ideal for applications requiring high-speed processing in compact devices.

Median Price

$26.205

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 729 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

USA . 3,556 parts In-Stock

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Digiode

USA . 1,234 parts In-Stock

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Flip Electronics

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Anansix

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AZTECH Wire

Italy . 864 parts In-Stock

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$5.451

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Ampacity Inc.

Singapore . 630 parts In-Stock

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$22.000

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Continental Prestige Electronics

USA . 560 parts In-Stock

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$25.681

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Netroflash

USA . 100 parts In-Stock

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Vigor

Singapore . 2,680 parts In-Stock

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Corohmni

South Africa . 181 parts In-Stock

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Microchip USA

USA . 1,528 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,295 parts In-Stock

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UNI Independent Distributors

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Authorized Procurement Solutions

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Argo Parts USA

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Corphita

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Overview

Experience unmatched performance and efficiency with the LS1012ASE7EKB by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and reliability in their microprocessors. This cutting-edge product is perfect for a wide range of applications, offering customers incredible value and benefits. With integrated cache and low power mode, this microprocessor delivers exceptional speed and energy efficiency. Say goodbye to slow processing and hello to seamless performance with the LS1012ASE7EKB.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache improves the speed and efficiency of processing tasks, making this microprocessor a good choice for applications requiring fast data access.

Surface Mount: YES

The surface mount feature allows for easy and compact integration onto circuit boards, making it suitable for space-constrained designs.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making this microprocessor energy-efficient.

Address Bus Width: 16

With a wide address bus width of 16, this microprocessor can handle large amounts of memory addressing, making it suitable for tasks requiring high data processing capabilities.

Package Shape: SQUARE

The square package shape allows for efficient utilization of space on the circuit board, contributing to a compact and organized design.

Bit Size: 64

Having a 64-bit architecture enables the microprocessor to handle complex computational tasks and large datasets with high precision and efficiency.

No. of Terminals: 211

Having a high number of terminals allows for versatile connectivity options, making this microprocessor suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enables efficient heat dissipation and high-density mounting, making this microprocessor suitable for compact and high-performance designs.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage ensures stable operation and power efficiency, making this microprocessor reliable and suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microprocessor can withstand demanding thermal conditions, making it suitable for industrial and rugged applications.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliability in a wide range of environmental conditions, making this microprocessor suitable for diverse applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy connectivity and heat dissipation, contributing to a reliable and efficient performance of this microprocessor.

Maximum Seated Height: 0.925 mm

The low maximum seated height allows for a compact and slim design, making this microprocessor suitable for thin and space-saving applications.

Width: 9.6 mm

With a moderate width of 9.6 mm, this microprocessor can be easily integrated into various designs, balancing space constraints and connectivity requirements.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 16

The wide external data bus width of 16 facilitates fast data transfer between the microprocessor and other components, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this microprocessor can achieve high processing speeds, making it suitable for tasks requiring quick data processing.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand the peak reflow temperature for 40 seconds ensures reliable soldering during manufacturing, contributing to the overall durability of this microprocessor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables robust soldering connections, ensuring the mechanical and electrical stability of this microprocessor.

Length: 9.6 mm

With a compact length of 9.6 mm, this microprocessor can be easily accommodated in various designs, making it versatile for different applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor type allows for efficient and rapid execution of instructions, making it suitable for tasks requiring high performance and low power consumption.

Technology: CMOS

Utilizing CMOS (Complementary Metal-Oxide-Semiconductor) technology ensures low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly and enhances reliability, reducing the risk of solder joint failure and improving the overall quality of this microprocessor.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage of 0.9 V provides a balance between performance and power efficiency, making this microprocessor suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables a high-density layout and efficient signal transmission, contributing to the overall performance and reliability of this microprocessor.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency, making this microprocessor well-suited for tasks requiring precise numerical calculations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the degree of protection required during storage and handling, ensuring the reliability and longevity of this microprocessor.

Speed: 600 rpm

With a speed of 600 rpm, this microprocessor can execute instructions rapidly, making it suitable for applications requiring high performance and responsiveness.

Low Power Mode: YES

The ability to operate in a low power mode enhances energy efficiency and extends battery life, making this microprocessor suitable for portable and battery-powered devices.

Technical Specifications

Microprocessors LS1012ASE7EKB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XBGA-N211

Length:

9.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

211

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.925 mm

Speed:

600 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9.6 mm

Peripheral IC Type:

Trade Compliance

LS1012ASE7EKB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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