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AM3357BZCZA80

Texas Instruments

AM3357BZCZA80 by Texas Instruments

AM3357BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.

Median Price

$19.180

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 284 parts In-Stock

1+ parts

$15.770

100+ parts

$14.260

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-

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284

$15.770

$14.260

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Texas Instruments

USA . 16,020 parts In-Stock

1+ parts

$17.891

100+ parts

$15.628

1k+ parts

$10.778

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-

16,020

$17.891

$15.628

$10.778

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Arrow

USA . 68 parts In-Stock

1+ parts

$19.180

100+ parts

$15.080

1k+ parts

$13.940

10k+ parts

-

68

$19.180

$15.080

$13.940

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Verical

USA . 68 parts In-Stock

1+ parts

$19.180

100+ parts

-

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68

$19.180

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Element14

Singapore . 504 parts In-Stock

1+ parts

$22.969

100+ parts

$20.323

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-

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504

$22.969

$20.323

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Mouser Electronics

USA . 1,349 parts In-Stock

1+ parts

$25.090

100+ parts

$16.740

1k+ parts

$16.250

10k+ parts

-

1,349

$25.090

$16.740

$16.250

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Newark

USA . 284 parts In-Stock

1+ parts

$25.640

100+ parts

$21.740

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-

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284

$25.640

$21.740

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DigiKey

USA . 451 parts In-Stock

1+ parts

$25.670

100+ parts

$19.392

1k+ parts

$16.957

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451

$25.670

$19.392

$16.957

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Chip1Stop

Japan . 2,394 parts In-Stock

1+ parts

-

100+ parts

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$12.900

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2,394

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-

$12.900

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,882 parts In-Stock

1+ parts

$15.856

100+ parts

-

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4,882

$15.856

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Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$17.848

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54

$17.848

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Chip Stock

USA . 3,180 parts In-Stock

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3,180

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Vyrian

USA . 3,103 parts In-Stock

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3,103

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VNN

France . 2,970 parts In-Stock

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2,970

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ACDS - Activité Composants Distribution Service

France . 172 parts In-Stock

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172

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,555 parts In-Stock

1+ parts

$8.520

100+ parts

-

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3,555

$8.520

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Semicontronic

India . 3,387 parts In-Stock

1+ parts

$8.520

100+ parts

$8.307

1k+ parts

$8.264

10k+ parts

-

3,387

$8.520

$8.307

$8.264

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Corphita

USA . 1,621 parts In-Stock

1+ parts

$15.021

100+ parts

-

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1,621

$15.021

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Continental Prestige Electronics

USA . 504 parts In-Stock

1+ parts

$21.960

100+ parts

-

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504

$21.960

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$35.008

100+ parts

$33.257

1k+ parts

$33.257

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2,500

$35.008

$33.257

$33.257

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Parana Technologies

USA . 1,253 parts In-Stock

1+ parts

$36.676

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-

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1,253

$36.676

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DigiPath Technology Company

USA . 2,115 parts In-Stock

1+ parts

$40.385

100+ parts

$37.154

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2,115

$40.385

$37.154

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ChromeModa Solutions

Germany . 5,011 parts In-Stock

1+ parts

$41.209

100+ parts

$33.791

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5,011

$41.209

$33.791

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

1+ parts

$41.209

100+ parts

$39.149

1k+ parts

$37.088

10k+ parts

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1,645

$41.209

$39.149

$37.088

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Corohmni

South Africa . 474 parts In-Stock

1+ parts

$46.994

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474

$46.994

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Lixinc

USA . 15,460 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,968 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 4,211 parts In-Stock

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Perfect Parts

USA . 1,552 parts In-Stock

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1,552

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Futuretech Components

Singapore . 504 parts In-Stock

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504

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GreenTree Electronics

Israel . 172 parts In-Stock

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172

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Computer Components Inc. - USA

USA . 28 parts In-Stock

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28

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Overview

Unleash the power of cutting-edge technology with the AM3357BZCZA80 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are versatile and reliable. Perfect for a wide range of applications, this microprocessor offers enhanced performance and efficiency, making it a valuable asset to customers seeking innovative solutions. Experience seamless operation and optimized functionality with the AM3357BZCZA80, setting new standards in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in faster data access, improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.326 V

Higher maximum supply voltage allows for greater flexibility in power management and optimization.

On Chip Data RAM Width: 8

Wider data RAM width enables faster processing and data transfer speeds.

Address Bus Width: 28

Larger address bus width allows for accessing larger memory spaces, enhancing the capabilities of the microprocessor.

Package Shape: SQUARE

Square package shape enables efficient use of space on circuit boards, contributing to better overall design.

Bit Size: 32

32-bit architecture allows for handling larger chunks of data at once, improving efficiency and performance.

Power Supplies (V): 0.95/1.1

Having multiple power supply options allows for better power management and optimization based on specific usage scenarios.

No. of Terminals: 324

Higher number of terminals provide more connectivity options and flexibility in designing with the microprocessor.

Minimum Supply Voltage: 1.21 V

Lower minimum supply voltage helps in improving energy efficiency and reducing power consumption.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microprocessor can withstand intense processing tasks without overheating.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Seated Height: 1.4 mm

Low seated height allows for compact and space-efficient device designs.

RAM Words: 131072

Large RAM capacity enables handling of extensive data and multitasking capabilities.

Width: 15 mm

Compact width makes it suitable for integration in smaller devices and circuit layouts.

Boundary Scan: YES

Boundary scan feature facilitates testing and maintenance of the microprocessor, ensuring reliability and ease of troubleshooting.

External Data Bus Width: 16

Wider external data bus width enables faster data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 26 MHz

High clock frequency allows for quick processing of instructions and operations, enhancing overall performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor efficient and reliable.

Maximum Supply Current: 400 mA

Higher supply current capability allows for powering multiple peripherals and components without overloading the microprocessor.

Nominal Supply Voltage: 1.26 V

Stable nominal supply voltage ensures consistent performance and reliability of the microprocessor.

No. of DMA Channels: 64

Having 64 DMA channels enables efficient data transfer and communication with peripherals, enhancing overall system capabilities.

Terminal Pitch: 0.8 mm

Narrow terminal pitch provides finer connection points, enabling compact and high-density PCB layouts.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low-demand periods, improving energy efficiency.

Technical Specifications

Microprocessors AM3357BZCZA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3357BZCZA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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