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AM3358BZCZ80

Texas Instruments

AM3358BZCZ80 by Texas Instruments

AM3358BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$17.490

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,163 parts In-Stock

1+ parts

$13.459

100+ parts

$11.757

1k+ parts

$8.108

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2,163

$13.459

$11.757

$8.108

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Mouser Electronics

USA . 251 parts In-Stock

1+ parts

$21.520

100+ parts

$14.220

1k+ parts

$13.060

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-

251

$21.520

$14.220

$13.060

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Distributors (In-Stock)

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Digiode

USA . 531 parts In-Stock

1+ parts

$12.786

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-

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531

$12.786

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Nova Conductors

Japan . 10 parts In-Stock

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$15.859

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10

$15.859

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Chip Stock

USA . 4,700 parts In-Stock

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4,700

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VNN

France . 4,400 parts In-Stock

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4,400

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Vyrian

USA . 3,895 parts In-Stock

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3,895

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$11.440

100+ parts

-

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-

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951

$11.440

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Semicontronic

India . 883 parts In-Stock

1+ parts

$11.440

100+ parts

$11.154

1k+ parts

$11.097

10k+ parts

-

883

$11.440

$11.154

$11.097

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Corphita

USA . 2,765 parts In-Stock

1+ parts

$12.113

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-

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2,765

$12.113

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Continental Prestige Electronics

USA . 6,868 parts In-Stock

1+ parts

$14.538

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-

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-

10k+ parts

$14.247

6,868

$14.538

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-

$14.247

Netroflash

USA . 100 parts In-Stock

1+ parts

$15.859

100+ parts

$15.542

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-

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100

$15.859

$15.542

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Component Stockers USA

USA . 264 parts In-Stock

1+ parts

$16.930

100+ parts

$13.220

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-

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264

$16.930

$13.220

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Corohmni

South Africa . 724 parts In-Stock

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$35.895

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724

$35.895

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Microchip USA

USA . 1,465 parts In-Stock

1+ parts

$38.860

100+ parts

$38.300

1k+ parts

$38.020

10k+ parts

$37.740

1,465

$38.860

$38.300

$38.020

$37.740

Advanced Electronics

New Zealand . 93 parts In-Stock

1+ parts

$58.099

100+ parts

$55.194

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$55.194

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93

$58.099

$55.194

$55.194

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Parana Technologies

USA . 1,941 parts In-Stock

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$75.670

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1,941

$75.670

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DigiPath Technology Company

USA . 1,300 parts In-Stock

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$83.322

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$83.322

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$85.022

100+ parts

$80.771

1k+ parts

$76.520

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1,872

$85.022

$80.771

$76.520

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ChromeModa Solutions

Germany . 44 parts In-Stock

1+ parts

$85.022

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$69.718

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44

$85.022

$69.718

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Lixinc

USA . 13,932 parts In-Stock

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13,932

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Argo Parts USA

USA . 2,365 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$24.514

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$22.700

10k+ parts

$22.700

500

-

$24.514

$22.700

$22.700

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$24.514

1k+ parts

$22.700

10k+ parts

$22.700

500

-

$24.514

$22.700

$22.700

Overview

Experience unparalleled performance and reliability with the AM3358BZCZ80 by Texas Instruments, a leading manufacturer in the industry. This microprocessor is ideal for a wide range of applications, offering integrated cache and a robust package body material. With advanced features like boundary scan and low power mode, this product provides exceptional value and benefits to customers looking for top-notch quality and efficiency in their devices. Upgrade to the AM3358BZCZ80 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during handling and installation.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing the average time to access memory, resulting in faster data retrieval and processing.

Maximum Supply Voltage: 1.326 V

A higher maximum supply voltage allows for better performance and stability under heavy workloads without risking damage to the microprocessor.

On Chip Data RAM Width: 8

A wider data RAM width allows for more data to be processed simultaneously, improving overall performance and efficiency.

Address Bus Width: 28

A wider address bus width enables the microprocessor to access a larger range of memory addresses, enhancing its capability to handle complex computations and tasks.

Package Shape: SQUARE

The square package shape provides better stability during installation and reduces the risk of damage, ensuring the microprocessor remains intact and operational.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data at once, leading to improved processing speed and efficiency.

Power Supplies (V): 0.95/1.1

Having multiple power supply options allows for flexibility in different operating conditions, ensuring the microprocessor can adapt to varying power requirements.

No. of Terminals: 324

A higher number of terminals allows for more connectivity options and interfaces, facilitating better integration and communication with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and lightweight design, ideal for space-constrained applications while maintaining high-speed performance with fine pitch connections.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this microprocessor suitable for a wide range of environments, ensuring reliable performance even in demanding conditions.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency allows the microprocessor to execute instructions at a faster rate, leading to improved overall performance and responsiveness.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC architecture enables efficient processing of instructions with reduced execution time, making this microprocessor suitable for high-performance computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this microprocessor energy-efficient and suitable for mobile devices or battery-powered applications.

Maximum Supply Current: 400 mA

The maximum supply current indicates the power consumption of the microprocessor, allowing for efficient power management and optimization in different operating conditions.

Low Power Mode: YES

Having a low power mode option enables the microprocessor to conserve energy and reduce power consumption when idle or under light workloads, prolonging battery life in mobile devices.

Technical Specifications

Microprocessors AM3358BZCZ80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3358BZCZ80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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