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MCF5307CAI66B

NXP Semiconductors

MCF5307CAI66B by NXP Semiconductors

The NXP Semiconductors MCF5307CAI66B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 33.33 MHz. It is suitable for applications requiring low power mode operation, such as embedded systems and industrial control. The device comes in a square package shape with 208 terminals, supporting boundary scan testing for enhanced reliability.

Median Price

$64.960

Lifecycle Status

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12

In-Stock Inventory

1k+

MCF5307CAI66B by NXP Semiconductors
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Rochester

USA . 24 parts In-Stock

1+ parts

$37.100

100+ parts

$34.870

1k+ parts

$31.540

10k+ parts

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24

$37.100

$34.870

$31.540

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Flip Electronics (Authorized)

USA . 12,673 parts In-Stock

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DigiKey

USA . 1,971 parts In-Stock

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$64.960

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1,971

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Verical

USA . 1,520 parts In-Stock

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$75.026

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1,520

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$75.026

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

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$25.430

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900

$25.430

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Digiode

USA . 4,080 parts In-Stock

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$35.245

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Flip Electronics

USA . 7,661 parts In-Stock

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Vyrian

USA . 7,230 parts In-Stock

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Chip Stock

USA . 2,887 parts In-Stock

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Anansix

USA . 2,222 parts In-Stock

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Component Sense

UK . 1,507 parts In-Stock

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ComSIT Distribution GmbH

Germany . 24 parts In-Stock

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Continental Prestige Electronics

USA . 1,238 parts In-Stock

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$25.430

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$24.921

1,238

$25.430

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$24.921

Ampacity Inc.

Singapore . 7,365 parts In-Stock

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$31.540

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Corphita

USA . 4,330 parts In-Stock

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$33.390

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$33.390

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Aztec Data Supply Inc.

USA . 1,940 parts In-Stock

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$36.295

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$36.295

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Microchip USA

USA . 482 parts In-Stock

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$58.780

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482

$58.780

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Vigor

Singapore . 119 parts In-Stock

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$61.220

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$61.220

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Corohmni

South Africa . 272 parts In-Stock

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$75.227

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Lixinc

USA . 14,801 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 5,279 parts In-Stock

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Argo Parts USA

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Futuretech Components

Singapore . 1,968 parts In-Stock

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Kepictronics

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Assy Fe

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Perfect Parts

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Overview

Unleash the power of the MCF5307CAI66B by NXP Semiconductors, a cutting-edge microprocessor designed for maximum performance and efficiency. With integrated cache and a wide range of applications in various industries, this product offers unmatched value to customers seeking top-notch quality and reliability. NXP Semiconductors' reputation for excellence ensures that you're getting a superior product that will exceed your expectations. Upgrade your technology with the MCF5307CAI66B and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable construction, ideal for portable electronic devices.

Integrated Cache: YES

Enhances processing speed and efficiency by storing frequently accessed data closer to the processor.

Maximum Supply Voltage: 3.6 V

Allows for reliable operation within a safe voltage range.

Address Bus Width: 32

Enables efficient data handling and memory addressing capabilities.

Package Shape: SQUARE

Optimizes space utilization and compatibility with various mounting configurations.

Power Supplies (V): 3.3

Operates within a common voltage standard for ease of integration into existing systems.

No. of Terminals: 208

Provides connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 70 °C

Ensures reliable performance under typical operating conditions.

Minimum Operating Temperature: 0 °C

Allows for operation in a wide range of environments.

Package Style (Meter): FLATPACK, FINE PITCH

Facilitates secure and precise mounting on circuit boards.

Maximum Clock Frequency: 33.33 MHz

Provides fast processing speeds for demanding applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizes a Reduced Instruction Set Computing architecture for streamlined operations.

Technology: CMOS

Employs Complementary Metal-Oxide-Semiconductor technology for efficient power consumption.

Nominal Supply Voltage: 3.3 V

Maintains consistent power input for reliable performance.

Low Power Mode: YES

Offers energy-saving capabilities for improved efficiency and battery life.

Technical Specifications

Microprocessors MCF5307CAI66B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

MCF5307CAI66B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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