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MCIMX6U6AVM08AB

NXP Semiconductors

MCIMX6U6AVM08AB by NXP Semiconductors

MCIMX6U6AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a package style of grid array and terminal finish of tin silver copper.

Median Price

$49.695

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 30 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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$49.695

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Vyrian

USA . 7,188 parts In-Stock

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Anansix

USA . 1,893 parts In-Stock

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Digiode

USA . 530 parts In-Stock

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Chip Stock

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One Stop Electronics

USA . 5 parts In-Stock

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$9.000

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Ampacity Inc.

Singapore . 30 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 636 parts In-Stock

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$11.923

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Continental Prestige Electronics

USA . 5,648 parts In-Stock

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Microchip USA

USA . 1,934 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,507 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,474 parts In-Stock

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UNI Independent Distributors

Spain . 6,400 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,017 parts In-Stock

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Corphita

USA . 3,540 parts In-Stock

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Metaverse IC Inc.

Canada . 750 parts In-Stock

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Kepictronics

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Netroflash

USA . 100 parts In-Stock

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$48.701

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$47.210

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$46.216

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$46.216

Overview

Unleash the power of cutting-edge technology with the MCIMX6U6AVM08AB by NXP Semiconductors. As a leader in the industry, NXP Semiconductors delivers top-quality microprocessors that redefine possibilities. Designed for a wide range of applications, this microprocessor offers unparalleled value and benefits to customers seeking high performance and reliability. Experience seamless integration, advanced features, and outstanding efficiency with the MCIMX6U6AVM08AB - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the overall performance and efficiency of the microprocessor by reducing access times to frequently used data.

Address Bus Width: 16

A wider address bus allows for faster data transfer and processing capabilities, making this microprocessor suitable for handling complex tasks.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the microprocessor can withstand extensive use without overheating, enhancing its reliability.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making this microprocessor energy-efficient and suitable for a range of applications.

Technical Specifications

Microprocessors MCIMX6U6AVM08AB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U6AVM08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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