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OSD3358-512M-ICB

Octavo Systems

OSD3358-512M-ICB by Octavo Systems

OSD3358-512M-ICB by Octavo Systems is a Microprocessor with 16-bit Address Bus, 8-bit External Data Bus, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode and boundary scan feature.

Median Price

$66.830

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 408 parts In-Stock

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$48.670

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$44.880

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DigiKey

USA . 405 parts In-Stock

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$66.830

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$56.300

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405

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Mouser Electronics

USA . 336 parts In-Stock

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$66.830

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336

$66.830

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Nova Conductors

Japan . 85 parts In-Stock

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$81.161

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Vyrian

USA . 276 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$46.356

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$44.038

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$44.038

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$44.038

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Aztec Data Supply Inc.

USA . 382 parts In-Stock

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$62.907

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Continental Prestige Electronics

USA . 1,594 parts In-Stock

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$73.405

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$71.937

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Microchip USA

USA . 2,074 parts In-Stock

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$83.670

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Argo Parts USA

USA . 3,070 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$79.538

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$77.103

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$75.480

100

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$79.538

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$75.480

Overview

Unleash the power of innovation with the OSD3358-512M-ICB from Octavo Systems, a leading manufacturer in the field of microprocessors. This cutting-edge product offers integrated cache and a wide range of applications, making it perfect for industrial use. With a compact package body material and a high temperature grade, this microprocessor provides exceptional performance and reliability. Experience the benefits of low power mode and high-speed processing, all in a convenient square package style. Upgrade your technology with the OSD3358-512M-ICB and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and heat resistance, making the product suitable for various industrial applications.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, enhancing overall performance of the microprocessor.

Surface Mount: YES

Surface mount capability ensures easy installation and space-saving design, ideal for compact electronic devices.

Address Bus Width: 16

With a 16-bit address bus width, the microprocessor can handle large amounts of memory data efficiently.

Package Shape: SQUARE

Square package shape allows for better thermal dissipation and compact integration within electronic systems.

No. of Terminals: 400

Having 400 terminals enables the microprocessor to connect with various external devices and components for versatile functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers increased reliability and signal integrity, ensuring stable performance in demanding environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microprocessor can withstand high temperature conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes the microprocessor suitable for use in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB mounting and secure connectivity, enhancing overall reliability.

Maximum Seated Height: 2.6 mm

Low seated height enables compact design and efficient heat dissipation, making the microprocessor suitable for space-constrained applications.

Width: 27 mm

With a width of 27mm, the microprocessor can be easily integrated into various electronic systems without occupying excessive space.

Boundary Scan: YES

Boundary scan feature allows for comprehensive testing and debugging of the microprocessor, ensuring high reliability and reduced time-to-market.

External Data Bus Width: 8

An 8-bit external data bus width facilitates efficient data transfer between the microprocessor and external devices, improving overall system performance.

Peak Reflow Temperature °C: 245

High peak reflow temperature of 245°C ensures reliable soldering and assembly of the microprocessor onto PCBs.

Length: 27 mm

Compact length of 27mm enables easy integration of the microprocessor into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the microprocessor suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture ensures fast and efficient execution of instructions, enhancing overall performance of the microprocessor in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable operation of the microprocessor in various electronic systems.

Nominal Supply Voltage: 1.1 V

Low nominal supply voltage of 1.1V reduces power consumption and heat generation, making the microprocessor energy-efficient and suitable for portable devices.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm allows for high-density packaging and compact design, ideal for miniaturized electronic devices.

Format: FIXED POINT

Fixed-point format enables fast and efficient arithmetic operations, enhancing overall performance of the microprocessor in mathematical computations.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the microprocessor can withstand exposure to high humidity levels during storage and assembly, ensuring long-term reliability.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can execute instructions quickly and efficiently, improving overall system performance.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation, extending battery life and reducing power consumption in portable electronic devices.

Technical Specifications

Microprocessors OSD3358-512M-ICB attributes and parameters. Explore more Microprocessors devices from Octavo Systems

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B400

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.6 mm

Speed:

1000 rpm

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

OSD3358-512M-ICB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Octavo Systems

Octavo Systems, LLC was founded by three former Texas Instruments senior leaders. It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry. They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst. What they realized was that Moore’s Law was taking on a new interpretation, moving from the concept of integrating on silicon (SoC) to integrating with silicon (SiP). As we have grown, we have strengthened our team and built a world class organization. To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality System-in-Package solutions. Pursuit of our mission will bring new technologies and new integration paths to innovative companies around the globe. By creating SiP devices we are allowing the idea behind Moore’s law to continue as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through our technology and design innovations we are making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products. The transition to System in Package will provide system designers a host of advantages including: Quicker Time to Market Smaller Size Lower Total Cost of Ownership We want to make sure this new era of integration is available to everyone and we strive to do everything we can to make sure you achieve your mission. Everything from the design of our products, to our sales channel, to our support has been developed to make this technology accessible and to ensure your success.

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