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OSD3358-512M-BCB

Octavo Systems

OSD3358-512M-BCB by Octavo Systems

OSD3358-512M-BCB by Octavo Systems is a microprocessor with 16-bit address bus, 8-bit external data bus, and integrated cache. Ideal for applications requiring low power mode, it features a CMOS technology with a nominal voltage of 1.1V and operates b/w temperatures of 0 to 85°C.

Median Price

$63.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$63.120

100+ parts

$54.880

1k+ parts

$54.880

10k+ parts

$54.880

5

$63.120

$54.880

$54.880

$54.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$69.645

100+ parts

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38

$69.645

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Vyrian

USA . 394 parts In-Stock

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394

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Inventory MP

USA . 33 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$32.337

100+ parts

$30.720

1k+ parts

$30.720

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-

500

$32.337

$30.720

$30.720

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Continental Prestige Electronics

USA . 3,036 parts In-Stock

1+ parts

$69.645

100+ parts

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$68.252

3,036

$69.645

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$68.252

Bastille Electronics

Australia . 15 parts In-Stock

1+ parts

$69.650

100+ parts

$66.168

1k+ parts

-

10k+ parts

$61.988

15

$69.650

$66.168

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$61.988

Aztec Data Supply Inc.

USA . 671 parts In-Stock

1+ parts

$70.513

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671

$70.513

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Argo Parts USA

USA . 3,854 parts In-Stock

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3,854

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Glotronic Ltd.

UK . 75 parts In-Stock

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Overview

Unlock the power of advanced technology with Octavo Systems' OSD3358-512M-BCB microprocessor. This cutting-edge product offers customers unparalleled performance and efficiency, making it ideal for a wide range of applications. With its integrated cache and low power mode, this microprocessor is designed to meet your needs while maximizing value. Trust in Octavo Systems' reputation for quality and innovation, and experience the difference that the OSD3358-512M-BCB can bring to your projects. Elevate your designs with this versatile and high-quality microprocessor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the microprocessor lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves processing speed and efficiency by reducing memory access times, making the microprocessor suitable for high-performance computing tasks.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling a compact design for the final product.

Address Bus Width: 16

With a 16-bit address bus width, the microprocessor can address a larger memory space, enabling it to handle complex tasks and data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal position allows for better heat dissipation and efficient cooling, ensuring optimal performance and reliability of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for faster execution of instructions, making it suitable for real-time processing and high-speed computing requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for extended operation.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can swiftly execute instructions and process data, enhancing overall system performance.

Technical Specifications

Microprocessors OSD3358-512M-BCB attributes and parameters. Explore more Microprocessors devices from Octavo Systems

Specs

Additional Features:

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B400

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.6 mm

Speed:

1000 rpm

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

OSD3358-512M-BCB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Octavo Systems

Octavo Systems, LLC was founded by three former Texas Instruments senior leaders. It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry. They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst. What they realized was that Moore’s Law was taking on a new interpretation, moving from the concept of integrating on silicon (SoC) to integrating with silicon (SiP). As we have grown, we have strengthened our team and built a world class organization. To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality System-in-Package solutions. Pursuit of our mission will bring new technologies and new integration paths to innovative companies around the globe. By creating SiP devices we are allowing the idea behind Moore’s law to continue as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through our technology and design innovations we are making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products. The transition to System in Package will provide system designers a host of advantages including: Quicker Time to Market Smaller Size Lower Total Cost of Ownership We want to make sure this new era of integration is available to everyone and we strive to do everything we can to make sure you achieve your mission. Everything from the design of our products, to our sales channel, to our support has been developed to make this technology accessible and to ensure your success.

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