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MCF5274VM166

NXP Semiconductors

MCF5274VM166 by NXP Semiconductors

NXP Semiconductors' MCF5274VM166 microprocessor features 32-bit architecture, 83 MHz clock frequency, and integrated cache. Ideal for commercial applications requiring low power mode, with a temperature range of 0-70°C.

Median Price

$35.927

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$35.927

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Anansix

USA . 1,467 parts In-Stock

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Vyrian

USA . 1,448 parts In-Stock

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Flip Electronics

USA . 422 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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Bristol Electronics

USA . 149 parts In-Stock

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ComSIT Distribution GmbH

Germany . 49 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,101 parts In-Stock

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$7.000

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One Stop Electronics

USA . 2,239 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 386 parts In-Stock

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$10.201

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Corohmni

South Africa . 53 parts In-Stock

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$22.853

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Aranea Global

USA . 100 parts In-Stock

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$35.208

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$33.800

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Continental Prestige Electronics

USA . 899 parts In-Stock

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$35.927

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$35.208

899

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$35.208

Advanced Electronics

New Zealand . 750 parts In-Stock

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$36.645

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$36.645

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$36.645

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$36.645

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Vigor

Singapore . 1,424 parts In-Stock

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$42.875

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Aztec Data Supply Inc.

USA . 1,310 parts In-Stock

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$44.351

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Microchip USA

USA . 2,851 parts In-Stock

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$75.446

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Component Stockers USA

USA . 149 parts In-Stock

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$510.910

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Lixinc

USA . 9,869 parts In-Stock

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UNI Independent Distributors

Spain . 6,882 parts In-Stock

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Argo Parts USA

USA . 1,736 parts In-Stock

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Corphita

USA . 289 parts In-Stock

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iodParts Technologies Inc.

India . 49 parts In-Stock

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Overview

Unleash the power of innovation with the MCF5274VM166 by NXP Semiconductors. This cutting-edge microprocessor offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With integrated cache and low power mode, this product delivers exceptional performance while maximizing energy efficiency. Experience seamless operation and superior functionality with NXP Semiconductors' advanced technology. Upgrade your projects today and discover the endless possibilities with the MCF5274VM166.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a cost-effective choice.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency, making it ideal for handling demanding tasks.

Surface Mount: YES

The surface mount design allows for easy installation and saves space on the circuit board.

Maximum Supply Voltage: 1.6 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations without risking damage.

Address Bus Width: 24

The wide address bus width allows for efficient data transfer and processing capabilities.

Package Shape: SQUARE

The square package shape simplifies the design and layout process, making it easier to integrate into various systems.

Bit Size: 32

The 32-bit architecture provides faster data processing speeds and better overall performance.

No. of Terminals: 256

With a high number of terminals, this microprocessor can support multiple functions and connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers a compact design for applications with limited space.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage helps to conserve energy and reduce power consumption.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows this microprocessor to function reliably in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures performance in cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance for enhanced reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and improves thermal management for optimal performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact design that is suitable for space-constrained applications.

Width: 17 mm

The 17mm width makes this microprocessor compatible with standard board sizes, simplifying integration into existing systems.

Technical Specifications

Microprocessors MCF5274VM166 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

83 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

166 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF5274VM166 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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