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AM3358BZCZA80

Texas Instruments

AM3358BZCZA80 by Texas Instruments

AM3358BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.8 mm.

Median Price

$20.240

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 188 parts In-Stock

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$15.875

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$13.866

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$9.563

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188

$15.875

$13.866

$9.563

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DigiKey

USA . 260 parts In-Stock

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$20.240

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$15.138

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$13.159

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$20.240

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$13.159

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Mouser Electronics

USA . 83 parts In-Stock

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$20.240

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$13.880

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$13.150

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83

$20.240

$13.880

$13.150

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Distributors (In-Stock)

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Digiode

USA . 368 parts In-Stock

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$15.081

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368

$15.081

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Nova Conductors

Japan . 1,000 parts In-Stock

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$16.640

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Chip Stock

USA . 8,140 parts In-Stock

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Vyrian

USA . 4,818 parts In-Stock

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VNN

France . 1,235 parts In-Stock

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NexGen Digital

USA . 357 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 715 parts In-Stock

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$8.030

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$8.030

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Semicontronic

India . 319 parts In-Stock

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$13.490

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$13.153

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$13.085

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319

$13.490

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$13.085

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Ampacity Inc.

Singapore . 212 parts In-Stock

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$13.490

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$13.490

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Corphita

USA . 641 parts In-Stock

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$14.288

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Continental Prestige Electronics

USA . 983 parts In-Stock

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$15.253

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$14.948

983

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$14.948

Parana Technologies

USA . 1,992 parts In-Stock

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$54.173

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$54.173

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Advanced Electronics

New Zealand . 53 parts In-Stock

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$57.452

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$54.580

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$54.580

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$54.580

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DigiPath Technology Company

USA . 1,679 parts In-Stock

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$59.651

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ChromeModa Solutions

Germany . 6,853 parts In-Stock

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$60.868

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$49.912

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$60.868

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IDEA Electronic Components Group

UK . 846 parts In-Stock

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$60.868

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$57.825

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$54.781

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846

$60.868

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$54.781

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Corohmni

South Africa . 6 parts In-Stock

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$85.347

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Lixinc

USA . 19,850 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 1,764 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 388 parts In-Stock

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Metaverse IC Inc.

Canada . 170 parts In-Stock

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Overview

Experience the unmatched quality of Texas Instruments with the AM3358BZCZA80 microprocessor. This cutting-edge product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microprocessor delivers exceptional value, benefits, and advantages to customers looking for top-notch technology. Trust Texas Instruments for innovative solutions that push the boundaries of possibility.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling and installation.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by providing faster access to frequently used data, resulting in quicker processing times.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for efficient power delivery to the microprocessor, ensuring stable performance even under peak load conditions.

Address Bus Width: 28

The wide address bus width allows for efficient communication between the microprocessor and memory, enabling high-speed data transfer and processing.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data at a time, improving overall processing speed and efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that the microprocessor can function reliably even under extreme heat conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it offers simplified and efficient instruction sets, leading to faster execution of tasks and improved overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Technical Specifications

Microprocessors AM3358BZCZA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3358BZCZA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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