Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors P1021NXE2FFB microprocessor features a 32-bit architecture, integrated cache, and max clock frequency of 100 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C and offers low power mode for energy efficiency.
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This material is lightweight and durable, making the product portable and rugged for various applications.
Having integrated cache improves the overall performance and speed of the microprocessor.
Operates efficiently at a relatively low maximum supply voltage, which can help in reducing power consumption.
The square shape helps in efficient placement and mounting of the microprocessor on circuit boards.
With a 32-bit size, this microprocessor can handle a wide range of data and perform complex calculations efficiently.
Having a higher number of terminals provides flexibility in connecting the microprocessor with other components and peripherals.
Can operate at a low minimum supply voltage, enabling energy efficiency and extending battery life in portable devices.
Can withstand high operating temperatures, making it suitable for industrial and automotive applications where heat can be a concern.
Being based on Reduced Instruction Set Computing (RISC) architecture, this microprocessor offers efficient processing and performance for various tasks.
Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high speed, and reliability in operation.
Microprocessors P1021NXE2FFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P1021NXE2FFB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Goodwork Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ07P6X
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
Daco Semiconductor
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Eic Semiconductor
Changzhou Starsea Electronics
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
XAM5728BABCXE
Texas Instruments
XAM5728BABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.
ATSAMA5D27C-LD2G-CUR22
Microchip Technology
ATSAMA5D27C-LD2G-CUR22 by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 51 DMA channels. It is used in applications requiring high-speed processing, such as industrial automation and robotics due to its low power mode and floating-point format support.
P2010NXN2KFC
NXP Semiconductors
The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.
KMPC8270CZQMIBA
Freescale Semiconductor
The Freescale Semiconductor KMPC8270CZQMIBA microprocessor features 32-bit address and external data bus width, with a max clock frequency of 266 MHz. It is suitable for applications requiring high-speed processing, such as networking equipment and embedded systems. The package style is grid array with 516 terminals in a square shape, making it ideal for surface mount assembly.
MIMXRT1015DAF5B
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
TDA4VM88TGBALFRQ1
TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.
ADSP-21489KSWZ-4B
ADSP-21489KSWZ-4B by Analog Devices is a 40-bit microprocessor with integrated cache and a max clock frequency of 25 MHz. It is commonly used in applications requiring high-speed processing and floating-point calculations.
AM3358BZCE60
AM3358BZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 26 MHz clock frequency. It features 16-bit external data bus width and low power mode, suitable for applications requiring high-speed processing in compact devices. Ideal for use in RISC-based systems with boundary scan capability.
AM3358BZCZ60
AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.
AM3354BZCZA60
AM3354BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 105 °C.
MCF54454CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
AM5706BCBDD
The Texas Instruments AM5706BCBDD microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 32 MHz. Suitable for use in various electronic devices requiring high-speed processing capabilities.
MCIMX6U5EVM10ACR
MCIMX6U5EVM10ACR by NXP Semiconductors is a 32-bit microprocessor with 64-bit external data bus width, operating at max 24 MHz clock frequency. Ideal for low power applications, it features integrated cache and boundary scan support. Its grid array package style makes it suitable for compact electronic devices.
MC68SEC000CFU20
Motorola
MC68SEC000CFU20 by Motorola is a 32-bit microprocessor with 24-bit address bus and 16-bit external data bus. Operating at max 20 MHz, it's ideal for industrial applications requiring low power mode. With a temp range of -40 to 85°C, this CMOS technology chip comes in a square flatpack package with gull wing terminals.
X66AK2H06AAAW24
X66AK2H06AAAW24 by Texas Instruments is a Microprocessor with 24-bit Address Bus, 16-bit External Data Bus, and 156.25 MHz Clock Frequency. Ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.
MPC860ENVR66D4
NXP Semiconductors' MPC860ENVR66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Suitable for low power mode applications, this RISC-based processor operates at 66 rpm speed and integrates cache memory.
MPC885VR133
The NXP Semiconductors MPC885VR133 microprocessor features 32-bit address and external data bus width, with integrated cache. It operates at a speed of 133 rpm and supports low power mode, making it ideal for applications requiring high performance and energy efficiency. The package style is grid array with 357 terminals, suitable for surface mount assembly.
MIMXRT1021DAG5B
NXP Semiconductors' MIMXRT1021DAG5B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 262144 RAM words. Ideal for low power applications with a max supply voltage of 1.3V, it offers integrated cache and 32 DMA channels for efficient data processing.
MCF54418CMJ250R
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
AM3357ZCZD72
AM3357ZCZD72 by Texas Instruments is a 32-bit microprocessor with integrated cache and 28-bit address bus width. It operates at a max clock frequency of 26 MHz, suitable for low power applications in grid array packages. With terminal pitch of 0.8 mm and bottom position, it offers high performance in compact designs.
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P1020NXN2HFB
The NXP Semiconductors P1020NXN2HFB microprocessor features 32-bit architecture, 16-bit address bus width, and integrated cache. Ideal for RISC-based applications, it has a max supply voltage of 1.05 V and supports boundary scan technology.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
P1021NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
P1021NXE2FFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
P1022NXN2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
P1024NXN5DFB
MICROPROCESSOR, RISC; Technology: CMOS; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40;
P1020NXE2HFA
P1020NSN2FFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;
P1020NXN2DFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.46 mm;
P1020NXE2FFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
P1020NSN2DFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P1020NXN2DFA
P1020NSE2FFB
P1020NXN2FFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
P1020NSE2DFB
P1020NSE2HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B689;
P1020NSN2HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: NO;
P1021NXE2HFA
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