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P1024NXN5DFB

NXP Semiconductors

P1024NXN5DFB by NXP Semiconductors

The NXP Semiconductors P1024NXN5DFB is a RISC microprocessor with CMOS technology. It has a peak reflow temperature of 260°C and can withstand up to 40 seconds at this temperature. This high-performance chip is ideal for applications requiring advanced processing capabilities in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

P1024NXN5DFB by NXP Semiconductors
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Distributors (In-Stock)

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Vyrian

USA . 6,303 parts In-Stock

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Anansix

USA . 2,747 parts In-Stock

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Digiode

USA . 546 parts In-Stock

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Nova Conductors

Japan . 59 parts In-Stock

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Ampacity Inc.

Singapore . 1,447 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 1,172 parts In-Stock

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$8.670

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One Stop Electronics

USA . 1,357 parts In-Stock

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$16.000

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Corohmni

South Africa . 226 parts In-Stock

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Vigor

Singapore . 796 parts In-Stock

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Microchip USA

USA . 2,811 parts In-Stock

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Argo Parts USA

USA . 5,937 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,031 parts In-Stock

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Corphita

USA . 2,509 parts In-Stock

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Continental Prestige Electronics

USA . 1,419 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 823 parts In-Stock

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Kepictronics

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Overview

Unleash the power of cutting-edge technology with the P1024NXN5DFB microprocessor by NXP Semiconductors. Designed to deliver unparalleled performance and reliability, this RISC-based processor is perfect for a wide range of applications. With TIN SILVER terminal finish and CMOS technology, this chip ensures top-notch quality and efficiency. Experience seamless operation and unmatched speed with the P1024NXN5DFB, making it the ideal choice for your next project. Elevate your innovation with NXP Semiconductors and revolutionize the way you work.

Feature Benefit Bullets

Terminal Finish: TIN SILVER

TIN SILVER terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, this microprocessor is designed for efficient and quick soldering processes, saving time during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust solder joint formation, leading to increased durability and performance of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing RISC (Reduced Instruction Set Computing) architecture, this microprocessor delivers faster execution of instructions, leading to enhanced performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this microprocessor energy efficient and ideal for various portable and battery-powered devices.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this microprocessor can withstand moderate exposure to moisture during storage and assembly, ensuring reliability and functionality in different environmental conditions.

Technical Specifications

Microprocessors P1024NXN5DFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

P1024NXN5DFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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