Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors P1020NSE2DFB microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It is designed for applications requiring high-speed processing, such as networking equipment and industrial control systems. With a max supply voltage of 1.05 V and terminal pitch of 1 mm, it offers efficient performance in a compact package.
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Perfect Parts
Provides durability and protection for the microprocessor, making it resistant to physical damage.
Having integrated cache improves the performance of the microprocessor by reducing access latency for frequently used instructions and data.
Being surface mountable allows for easy and efficient placement on circuit boards, saving space and simplifying assembly.
Operates efficiently within a low voltage range, reducing power consumption and heat generation.
With a wide address bus, the microprocessor can access a larger memory space, enabling it to handle complex computations and tasks.
The square package shape provides uniformity and ease of handling during manufacturing and installation.
A 32-bit architecture allows the microprocessor to process data in 32-bit chunks, improving overall efficiency and speed.
Having a large number of terminals enables connectivity to a variety of external devices, expanding the microprocessor's versatility.
The grid array package style offers a high terminal count in a compact form factor, enhancing the microprocessor's integration capabilities.
Supports a low minimum supply voltage, allowing for energy-efficient operation and extending the lifespan of the microprocessor.
The presence of multiple external interrupts facilitates real-time responsiveness and multitasking capabilities in the microprocessor.
The tin silver terminal finish offers good conductivity and corrosion resistance, ensuring reliable electrical connections.
Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing interference.
The low seated height allows for a slim profile, making the microprocessor suitable for compact electronic devices.
Compact width dimension facilitates space-saving integration in electronic systems, ideal for designs with constrained layout requirements.
Boundary scan capability aids in debugging, testing, and diagnosing potential faults in the microprocessor and its connections.
A wide external data bus enables faster data transfer between the microprocessor and external peripherals, enhancing overall system performance.
Can withstand high reflow temperatures for a sufficient duration during manufacturing processes, ensuring reliable solder joints.
High peak reflow temperature tolerance allows for robust soldering and assembly processes, contributing to overall product reliability.
The moderate length dimension offers flexibility in mounting options and PCB layout, accommodating various design requirements.
Being a RISC microprocessor, it excels in handling specific tasks efficiently, making it suitable for applications requiring high throughput and performance.
Utilizing CMOS technology ensures low power consumption, high speed operation, and compatibility with modern electronic systems.
Ball terminals provide reliable electrical connections and enable fine-pitch spacing, enhancing the microprocessor's performance and reliability.
Stable nominal supply voltage simplifies power management and ensures consistent performance under varying load conditions.
Having multiple DMA channels enhances data transfer efficiency and offloads processing tasks from the microprocessor, improving overall system performance.
Fine terminal pitch allows for high-density mounting, enabling compact and efficient PCB designs with reduced signal interference.
Fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the microprocessor suitable for a wide range of applications.
MSL 3 rating indicates the microprocessor's resistance to moisture-related damage during storage and handling, ensuring product reliability.
With a high speed of 533 rpm, the microprocessor can execute instructions quickly, enabling rapid data processing and efficient system operation.
Microprocessors P1020NSE2DFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of External Interrupts:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P1020NSE2DFB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Nte Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Hitano Enterprise
Digitron Semiconductors
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
Hy Electronic
LH8066803102701SREKA
Intel
The Intel LH8066803102701SREKA microprocessor features 64-bit size, 1296 terminals, and operates at speeds up to 1800 rpm. It is designed for applications requiring high processing power in a compact form factor, such as servers, workstations, and high-performance computing systems.
MC8640DTHX1250HC
Freescale Semiconductor
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: BGA; Package Shape: SQUARE;
MCIMX31CVMN4C
NXP Semiconductors
The NXP Semiconductors MCIMX31CVMN4C microprocessor operates at 1.5V and 3.3V, with TIN SILVER COPPER terminal finish. It is a RISC-based MICROPROCESSOR compatible with I2C, SPI, UART, and USB buses. With 9 I/O lines, it finds applications in various embedded systems requiring high processing power and connectivity options.
ATSAMA5D35A-CU
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MIMXRT106ADVL6A
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
MPC880VR133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.8 V;
MPC860PCZQ50D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 50 MHz;
STM32MP157FAC1
MICROPROCESSOR, RISC;
AM1705DPTP4
Texas Instruments
AM1705DPTP4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 176 terminals. It operates at a max clock frequency of 50 MHz, suitable for low power applications. With a package style of flatpack and boundary scan capability, it is ideal for embedded systems requiring high performance in compact designs.
TDA4VM88TGBALFR
TDA4VM88TGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various embedded systems.
MPC8321EVRAFDCA
The NXP Semiconductors MPC8321EVRAFDCA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices.
SAM9X60T-V/DWB
SAM9X60T-V/DWB by Microchip Technology is a 32-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 48 MHz, suitable for industrial applications requiring low power mode and high-speed processing. With 16 DMA channels, this RISC-based processor offers efficient data transfer capabilities in a compact square package shape.
MIMXRT1064DVL6B
The NXP Semiconductors MIMXRT1064DVL6B microprocessor features 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for low power applications, it offers integrated cache memory and 196 terminals in a square package shape.
AM5746ABZXA
The Texas Instruments AM5746ABZXA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at a max clock frequency of 38.4 MHz with low power mode support.
MPC880ZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
MIMXRT1064DVJ6A
The NXP Semiconductors MIMXRT1064DVJ6A microprocessor features a 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for applications requiring low power consumption, it offers integrated cache memory and 32 DMA channels for efficient data processing in various electronic devices.
SPC5200CVR400BR2
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
T2080NXE8TTB
The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.
ATSAMA5D27C-D5M-CUR
ATSAMA5D27C-D5M-CUR by Microchip Technology is a 16-bit microprocessor with integrated cache, 65536 RAM words, and 24 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features 51 DMA channels and operates b/w -40 to 85 °C temperature range.
AM5708BCBDJ
The Texas Instruments AM5708BCBDJ microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 38.4 MHz. Suitable for use in various electronic devices requiring high-speed processing capabilities.
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P1020NXN2HFB
The NXP Semiconductors P1020NXN2HFB microprocessor features 32-bit architecture, 16-bit address bus width, and integrated cache. Ideal for RISC-based applications, it has a max supply voltage of 1.05 V and supports boundary scan technology.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
P1021NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
P1021NXE2FFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
P1022NXN2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
P1024NXN5DFB
MICROPROCESSOR, RISC; Technology: CMOS; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40;
P1020NXE2HFA
P1020NSN2FFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;
P1020NXN2DFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.46 mm;
P1020NXE2FFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
P1020NSN2DFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P1020NXN2DFA
P1020NSE2FFB
P1020NXN2FFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
P1020NSE2HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B689;
P1020NSN2HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: NO;
P1020NSE2DFB
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