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P1020NXE2FFB

NXP Semiconductors

P1020NXE2FFB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

Median Price

$102.112

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$81.690

1k+ parts

$73.090

10k+ parts

$68.790

27

-

$81.690

$73.090

$68.790

Farnell

UK . 27 parts In-Stock

1+ parts

-

100+ parts

$110.950

1k+ parts

-

10k+ parts

-

27

-

$110.950

-

-

Verical

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$102.112

1k+ parts

$91.362

10k+ parts

$85.987

27

-

$102.112

$91.362

$85.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 890 parts In-Stock

1+ parts

$86.440

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$86.440

-

-

-

Vyrian

USA . 7,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,864

-

-

-

-

Anansix

USA . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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397

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 579 parts In-Stock

1+ parts

$79.400

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$79.400

-

-

-

Corphita

USA . 1,571 parts In-Stock

1+ parts

$81.891

100+ parts

-

1k+ parts

-

10k+ parts

-

1,571

$81.891

-

-

-

One Stop Electronics

USA . 27 parts In-Stock

1+ parts

$168.330

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$168.330

-

-

-

Microchip USA

USA . 475 parts In-Stock

1+ parts

$200.905

100+ parts

-

1k+ parts

-

10k+ parts

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475

$200.905

-

-

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UNI Independent Distributors

Spain . 4,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,866

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-

-

Technical Specifications

Microprocessors P1020NXE2FFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B689

JESD-609 Code:

e2

Length:

31 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

12

No. of Terminals:

689

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA689,29X29,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

667 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

31 mm

Peripheral IC Type:

Trade Compliance

P1020NXE2FFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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