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P1020NXN2HFB

NXP Semiconductors

P1020NXN2HFB by NXP Semiconductors

The NXP Semiconductors P1020NXN2HFB microprocessor features 32-bit architecture, 16-bit address bus width, and integrated cache. Ideal for RISC-based applications, it has a max supply voltage of 1.05 V and supports boundary scan technology.

Median Price

$82.270

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1 parts In-Stock

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$79.721

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$74.972

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Rochester

USA . 1 parts In-Stock

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$84.820

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$75.890

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$71.420

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$75.890

$71.420

Distributors (In-Stock)

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Digiode

USA . 948 parts In-Stock

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$89.518

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Vyrian

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Component Sense

UK . 1,346 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,080 parts In-Stock

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Anansix

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Bristol Electronics

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Flip Electronics

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 880 parts In-Stock

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$19.340

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$19.340

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Aztec Data Supply Inc.

USA . 3,164 parts In-Stock

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$49.130

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One Stop Electronics

USA . 98 parts In-Stock

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$80.100

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Ampacity Inc.

Singapore . 98 parts In-Stock

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Corphita

USA . 1,575 parts In-Stock

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$84.807

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Component Stockers USA

USA . 787 parts In-Stock

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$99.990

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Semicontronic

India . 50 parts In-Stock

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$100.120

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$97.617

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Microchip USA

USA . 1,386 parts In-Stock

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Vigor

Singapore . 189 parts In-Stock

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UNI Independent Distributors

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Lixinc

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,469 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,402 parts In-Stock

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Futuretech Components

Singapore . 134 parts In-Stock

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Bastille Electronics

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Perfect Parts

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Overview

Unlock limitless possibilities with the NXP Semiconductors P1020NXN2HFB microprocessor. Built with cutting-edge technology, this powerful chip offers unparalleled performance and reliability. Perfect for a wide range of applications, from automotive to industrial automation, this microprocessor is a game-changer for your projects. Trust in NXP Semiconductors' reputation for excellence and innovation, and elevate your designs with the P1020NXN2HFB. Experience the value and benefits that this product brings to the table, and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of this microprocessor, making it suitable for multitasking applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps to minimize power consumption, making this microprocessor energy-efficient.

Address Bus Width: 16

The 16-bit address bus width allows for efficient memory addressing, improving overall performance and data access speed.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it easy to integrate into various devices.

Bit Size: 32

The 32-bit architecture of this microprocessor enables it to handle complex computations and data processing tasks seamlessly.

No. of Terminals: 689

With a high number of terminals, this microprocessor offers versatile connectivity options for various peripherals and devices.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable connections to the circuit board, reducing the risk of signal interference.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for flexible power management and energy-saving features in the microprocessor.

No. of External Interrupts: 12

The 12 external interrupts provide additional functionality and real-time event handling capabilities to the microprocessor.

Terminal Finish: TIN SILVER

The tin silver terminal finish enhances the conductivity and reliability of connections, ensuring stable performance of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and maintenance of the microprocessor on the circuit board, improving accessibility.

Maximum Seated Height: 2.46 mm

The low maximum seated height enables a slim and compact design for devices using this microprocessor, saving space and improving aesthetics.

Width: 31 mm

The moderate width of the microprocessor allows for easy integration into various devices without compromising performance or functionality.

Technical Specifications

Microprocessors P1020NXN2HFB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B689

JESD-609 Code:

e2

Length:

31 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

12

No. of Terminals:

689

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA689,29X29,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

31 mm

Peripheral IC Type:

Trade Compliance

P1020NXN2HFB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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