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AM3517AZCN

Texas Instruments

AM3517AZCN by Texas Instruments

AM3517AZCN by Texas Instruments is a microprocessor with 16-bit address bus and 8-bit on-chip data RAM. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With integrated cache and boundary scan feature, it is ideal for embedded systems requiring high-speed processing in compact form factors.

Median Price

$21.240

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 90 parts In-Stock

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$21.100

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$18.700

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$18.700

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Arrow

USA . 43 parts In-Stock

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$21.240

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$21.240

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Verical

USA . 43 parts In-Stock

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$21.240

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Texas Instruments

USA . 521 parts In-Stock

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$23.499

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$20.888

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$15.359

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521

$23.499

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DigiKey

USA . 127 parts In-Stock

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$35.540

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$25.501

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$24.451

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127

$35.540

$25.501

$24.451

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Distributors (In-Stock)

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Digiode

USA . 2,971 parts In-Stock

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$19.190

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$19.190

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Nova Conductors

Japan . 600 parts In-Stock

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$28.120

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Vyrian

USA . 3,769 parts In-Stock

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Chip Stock

USA . 2,545 parts In-Stock

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VNN

France . 100 parts In-Stock

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Semtec, LLC

USA . 10 parts In-Stock

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10

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LWI Electronics Inc

India . 6 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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EMSNET

USA . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 651 parts In-Stock

1+ parts

$10.388

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651

$10.388

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Semicontronic

India . 146 parts In-Stock

1+ parts

$17.250

100+ parts

$16.819

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$16.732

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146

$17.250

$16.819

$16.732

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Ampacity Inc.

Singapore . 146 parts In-Stock

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$17.760

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146

$17.760

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Corphita

USA . 2,773 parts In-Stock

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$18.180

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Continental Prestige Electronics

USA . 3,340 parts In-Stock

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$28.120

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$27.558

3,340

$28.120

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$27.558

Corohmni

South Africa . 172 parts In-Stock

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$28.576

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172

$28.576

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$43.808

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$41.618

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$41.618

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$43.808

$41.618

$41.618

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Parana Technologies

USA . 510 parts In-Stock

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$50.279

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$50.279

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ChromeModa Solutions

Germany . 2,720 parts In-Stock

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$56.493

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$46.324

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$56.493

$46.324

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IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$56.493

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$53.668

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$50.844

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1,365

$56.493

$53.668

$50.844

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A-Z Elektronik GmbH

Germany . 7,571 parts In-Stock

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Perfect Parts

USA . 4,678 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,307 parts In-Stock

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Argo Parts USA

USA . 4,248 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Kepictronics

USA . 3,086 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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DigiPath Technology Company

USA . 1,835 parts In-Stock

1+ parts

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$50.934

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1,835

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$50.934

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$27.558

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$26.714

10k+ parts

$26.152

1,000

-

$27.558

$26.714

$26.152

Lixinc

USA . 478 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 19 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the AM3517AZCN microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in every product they create. Ideal for a wide range of applications, this microprocessor offers unmatched value, efficiency, and versatility to customers. Upgrade your devices with the AM3517AZCN and take your projects to the next level with ease. Trust in Texas Instruments to deliver exceptional products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the microprocessor suitable for a wide range of applications without adding unnecessary weight.

Integrated Cache: YES

Integrated cache helps improve the processing speed and overall performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.248 V

The maximum supply voltage of 1.248 V ensures safe operation of the microprocessor, protecting it from potential damage due to overvoltage.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the microprocessor can efficiently handle and process data in parallel, enhancing its performance speed.

Address Bus Width: 16

A wider address bus width of 16 allows the microprocessor to access a larger memory space, enabling it to handle more complex tasks and applications.

Package Shape: SQUARE

The square package shape makes the microprocessor easy to handle and install, fitting well into compact electronic devices while maintaining stability.

Bit Size: 16

With a bit size of 16, the microprocessor can process data in 16-bit units, enhancing its arithmetic and logic capabilities for faster and more efficient computing.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages (1.2V, 1.8V, 3.3V) provides flexibility in powering the microprocessor in various electronic devices, optimizing energy efficiency.

No. of Terminals: 491

High number of terminals (491) offers extensive connectivity options, allowing the microprocessor to interface with a wide range of external components for versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles ensures reliable connections, compact design, and easy installation of the microprocessor in tight spaces.

Minimum Supply Voltage: 1.152 V

The minimum supply voltage of 1.152 V ensures stable operation of the microprocessor even under low power conditions, making it suitable for energy-efficient devices.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C enables the microprocessor to withstand extended use under demanding conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the microprocessor to function effectively in cold environments, ensuring reliable performance in varying temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable connections and long-lasting performance of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and connections of the microprocessor, making it easier to integrate into electronic devices while ensuring secure and efficient operation.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm allows the microprocessor to be installed in compact devices with limited space, enabling efficient use of available real estate.

RAM Words: 65536

The large RAM capacity of 65536 words provides ample memory for storing and processing data, enabling the microprocessor to handle complex tasks and applications effectively.

Width: 17 mm

Compact width of 17 mm makes the microprocessor suitable for slim electronic devices where space is limited, ensuring a sleek and space-efficient design.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor, ensuring reliability and ease of maintenance during the product development and production stages.

External Data Bus Width: 16

An external data bus width of 16 facilitates high-speed data transfer between the microprocessor and external devices, improving overall system performance and responsiveness.

Maximum Clock Frequency: 26 MHz

High maximum clock frequency of 26 MHz enables the microprocessor to process instructions and data at a rapid pace, enhancing overall system speed and performance.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperature for up to 30 seconds, ensuring proper soldering and assembly during manufacturing processes for reliable and durable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient and effective soldering of the microprocessor during assembly, ensuring secure connections and robust performance.

Length: 17 mm

Compact length of 17 mm ensures the microprocessor can be easily integrated into electronic devices with limited space, optimizing design flexibility and overall form factor.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of RISC architecture in the microprocessor enhances performance by simplifying instruction processing, improving efficiency, and reducing power consumption for better overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the microprocessor suitable for a wide range of battery-powered and energy-efficient devices.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering during installation, ensuring secure and stable electrical connections for increased reliability and longevity.

Maximum Supply Current: 1500 mA

High maximum supply current of 1500 mA allows the microprocessor to handle power-intensive tasks and peripherals, ensuring stable operation under heavy workload conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides efficient power consumption and stable operation for the microprocessor, optimizing energy use and performance in various applications.

No. of DMA Channels: 32

Support for 32 DMA channels enables efficient data transfer and processing between the microprocessor and peripherals, enhancing overall system performance and responsiveness.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for compact design and efficient use of space on the microprocessor, making it suitable for miniature electronic devices and applications.

Format: FLOATING POINT

Floating-point format allows the microprocessor to handle decimal numbers and complex mathematical calculations with high precision and accuracy, making it ideal for scientific and computational applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring reliable performance in humid environments.

Speed: 600 rpm

High speed of 600 rpm enables the microprocessor to process instructions and data quickly, improving overall system performance and responsiveness for demanding applications.

Low Power Mode: YES

Low power mode feature allows the microprocessor to operate in an energy-efficient state when idle or under low workload, saving power consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors AM3517AZCN attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

491

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

1500 mA

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM3517AZCN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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