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AM3517BZNC

Texas Instruments

AM3517BZNC by Texas Instruments

AM3517BZNC by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 54 MHz, suitable for applications requiring high-speed processing. The package style is grid array, low profile, fine pitch, making it ideal for compact designs in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,619 parts In-Stock

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Digiode

USA . 420 parts In-Stock

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420

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One Stop Electronics

USA . 453 parts In-Stock

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$6.000

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453

$6.000

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AZTECH Wire

Italy . 698 parts In-Stock

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$6.532

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698

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Native Components

USA . 438 parts In-Stock

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$23.930

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438

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Northwest PG Solutions

USA . 1,323 parts In-Stock

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$26.323

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$23.691

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1,323

$26.323

$23.691

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Parana Technologies

USA . 1,646 parts In-Stock

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$67.670

100+ parts

$6,284.210

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$60.903

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1,646

$67.670

$6,284.210

$60.903

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DigiPath Technology Company

USA . 1,930 parts In-Stock

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$74.513

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1,930

$74.513

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ChromeModa Solutions

Germany . 5,442 parts In-Stock

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$76.034

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$62.348

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5,442

$76.034

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IDEA Electronic Components Group

UK . 987 parts In-Stock

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$76.034

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$72.232

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$68.431

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987

$76.034

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$68.431

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Corphita

USA . 2,246 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM3517BZNC microprocessor by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers industry-leading products that exceed expectations. Ideal for a wide range of applications, this microprocessor offers unparalleled performance and reliability. Experience seamless functionality and enhanced efficiency with the AM3517BZNC. Elevate your projects with this top-of-the-line product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the package lightweight and durable, perfect for portable devices.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.6 V

The higher maximum supply voltage allows for greater flexibility in power management.

Address Bus Width: 26

A wider address bus width allows for increased memory addressing capabilities and improved performance.

Package Shape: SQUARE

The square package shape is compact and space-efficient, suitable for densely packed electronics.

Bit Size: 32

Being a 32-bit microprocessor, it can handle larger chunks of data at once, enhancing speed and efficiency.

No. of Terminals: 491

With a high number of terminals, this microprocessor can support a wide range of functionalities and connections.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of GRID ARRAY, LOW PROFILE, and FINE PITCH allows for easy integration into compact designs.

Minimum Supply Voltage: 0.5 V

The low minimum supply voltage helps in reducing power consumption and heat generation.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for soldering and provides better thermal management.

Maximum Seated Height: 1.3 mm

The low seated height makes this microprocessor suitable for slim and compact devices.

Width: 17 mm

The compact width of 17mm allows for efficient space utilization on the circuit board.

Boundary Scan: YES

Having boundary scan capability aids in testing and debugging the microprocessor during production.

External Data Bus Width: 16

The external data bus width of 16 allows for efficient data transfer between the microprocessor and external components.

Maximum Clock Frequency: 54 MHz

With a maximum clock frequency of 54 MHz, this microprocessor offers fast processing speeds for demanding applications.

Length: 17 mm

The short length of 17mm ensures the microprocessor can fit into compact devices.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is designed for handling various computational tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable.

Terminal Form: BALL

The terminal form of BALL ensures reliable electrical connections and easy soldering on the circuit board.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V strikes a balance between power efficiency and performance.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting and compact circuit board design.

Format: FLOATING POINT

With floating-point format support, this microprocessor is capable of handling complex mathematical calculations with precision.

Technical Specifications

Microprocessors AM3517BZNC attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

Length:

17 mm

Low Power Mode:

NO

No. of Terminals:

491

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

.5 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM3517BZNC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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