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AM3505AZCNAC

Texas Instruments

AM3505AZCNAC by Texas Instruments

AM3505AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache, 8-bit RAM width, and 16-bit address bus. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power mode and floating point format.

Median Price

$32.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 642 parts In-Stock

1+ parts

$25.750

100+ parts

$22.889

1k+ parts

$16.830

10k+ parts

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642

$25.750

$22.889

$16.830

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Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$39.990

100+ parts

$27.860

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-

10k+ parts

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11

$39.990

$27.860

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 938 parts In-Stock

1+ parts

$24.462

100+ parts

-

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938

$24.462

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$28.140

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-

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50

$28.140

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Vyrian

USA . 5,591 parts In-Stock

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5,591

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VNN

France . 79 parts In-Stock

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79

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Distributors (Availability)

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AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$14.659

100+ parts

-

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392

$14.659

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-

-

Ampacity Inc.

Singapore . 327 parts In-Stock

1+ parts

$21.890

100+ parts

-

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327

$21.890

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Semicontronic

India . 327 parts In-Stock

1+ parts

$21.890

100+ parts

$21.343

1k+ parts

$21.233

10k+ parts

-

327

$21.890

$21.343

$21.233

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Corphita

USA . 693 parts In-Stock

1+ parts

$23.175

100+ parts

-

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693

$23.175

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Continental Prestige Electronics

USA . 5,586 parts In-Stock

1+ parts

$27.860

100+ parts

-

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10k+ parts

$27.303

5,586

$27.860

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-

$27.303

Netroflash

USA . 100 parts In-Stock

1+ parts

$28.140

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-

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100

$28.140

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Parana Technologies

USA . 2,303 parts In-Stock

1+ parts

$48.529

100+ parts

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2,303

$48.529

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DigiPath Technology Company

USA . 434 parts In-Stock

1+ parts

$53.436

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434

$53.436

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ChromeModa Solutions

Germany . 5,455 parts In-Stock

1+ parts

$54.527

100+ parts

$44.712

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5,455

$54.527

$44.712

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IDEA Electronic Components Group

UK . 2,144 parts In-Stock

1+ parts

$54.527

100+ parts

$51.801

1k+ parts

$49.074

10k+ parts

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2,144

$54.527

$51.801

$49.074

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Corohmni

South Africa . 900 parts In-Stock

1+ parts

$76.459

100+ parts

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900

$76.459

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Component Stockers USA

USA . 774 parts In-Stock

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774

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Argo Parts USA

USA . 455 parts In-Stock

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455

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Overview

Discover the cutting-edge AM3505AZCNAC microprocessor by Texas Instruments, setting new standards of innovation in the industry. With superior quality and reliability, Texas Instruments delivers unmatched performance and efficiency. Ideal for a wide range of applications, this microprocessor offers seamless integration and high-speed data processing. Elevate your projects with the AM3505AZCNAC's advanced features and unleash the full potential of your designs. Experience the value and benefits of this top-of-the-line product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the processor's speed and performance by reducing memory access times.

Maximum Supply Voltage: 1.248 V

Operating within this voltage range ensures stable and efficient performance of the processor.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and multitasking capabilities.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capacity, improving overall system performance.

Maximum Operating Temperature: 105 °C

Operating at high temperatures without performance degradation is essential for demanding applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables efficient instruction execution and faster processing speeds.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, making the processor energy-efficient.

Speed: 600 rpm

High speed ensures quick data processing and system responsiveness.

Low Power Mode: YES

The low power mode feature helps conserve energy and extend battery life in mobile devices.

Technical Specifications

Microprocessors AM3505AZCNAC attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

491

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.248 V

Minimum Supply Voltage:

1.152 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM3505AZCNAC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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