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MCF5272CVM66

NXP Semiconductors

MCF5272CVM66 by NXP Semiconductors

The NXP Semiconductors MCF5272CVM66 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 66 MHz. It is designed for industrial applications requiring low power consumption, with a temperature range from -40 to 85°C. The package style is grid array, making it suitable for surface mount assembly in various electronic devices.

Median Price

$47.671

Lifecycle Status

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15

In-Stock Inventory

1k+

MCF5272CVM66 by NXP Semiconductors
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Verical

USA . 135,924 parts In-Stock

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$48.832

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DigiKey

USA . 21,500 parts In-Stock

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$46.510

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$46.510

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$46.510

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$46.510

$46.510

Flip Electronics (Authorized)

USA . 21,500 parts In-Stock

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21,500

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Nova Conductors

Japan . 500 parts In-Stock

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$5.748

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Flip Electronics

USA . 21,500 parts In-Stock

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Vyrian

USA . 21,091 parts In-Stock

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Digiode

USA . 4,491 parts In-Stock

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Chip Stock

USA . 3,600 parts In-Stock

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Sensible Micro Corp

USA . 3,308 parts In-Stock

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Anansix

USA . 2,749 parts In-Stock

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J2 Sourcing AB

Sweden . 398 parts In-Stock

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Bristol Electronics

USA . 7 parts In-Stock

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ComSIT Distribution GmbH

Germany . 7 parts In-Stock

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NexGen Digital

USA . 2 parts In-Stock

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Prism Electronics

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Continental Prestige Electronics

USA . 6,563 parts In-Stock

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$5.748

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$5.633

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$5.748

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Netroflash

USA . 2,000 parts In-Stock

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$5.748

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$5.461

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$5.346

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$5.748

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$5.346

Ampacity Inc.

Singapore . 21,351 parts In-Stock

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$39.530

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One Stop Electronics

USA . 21,000 parts In-Stock

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$39.530

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Vigor

Singapore . 2,000 parts In-Stock

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$45.690

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Microchip USA

USA . 131 parts In-Stock

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$67.902

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Corohmni

South Africa . 243 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,785 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Glotronic Ltd.

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Argo Parts USA

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S.R.D Solutions

India . 500 parts In-Stock

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UNI Independent Distributors

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iodParts Technologies Inc.

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Kepictronics

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Assy Fe

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Overview

Experience the power of innovation with the NXP Semiconductors MCF5272CVM66 microprocessor. Designed with cutting-edge technology and high-quality materials, this versatile component offers exceptional performance for a wide range of applications. From industrial automation to consumer electronics, the MCF5272CVM66 delivers reliable processing power, efficient operation, and seamless integration. Trust NXP Semiconductors to provide you with a superior solution that exceeds your expectations. Upgrade your products today with the MCF5272CVM66 and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microprocessor lightweight and durable.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by providing faster access to frequently used data.

Surface Mount: YES

Being surface mount compatible allows for easy installation and space-saving in electronic devices.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for better power management and can handle higher loads.

Address Bus Width: 23

The wider address bus width enables the microprocessor to access a larger memory space efficiently.

Package Shape: SQUARE

The square package shape provides a compact form factor for better integration into electronic systems.

Bit Size: 32

Having a 32-bit architecture allows the microprocessor to process data in larger chunks for improved performance.

No. of Terminals: 196

With a higher number of terminals, the microprocessor can connect to various external components for enhanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical connectivity for reliable operation.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the microprocessor to operate efficiently even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microprocessor can function reliably in cold environments.

Terminal Finish: TIN SILVER COPPER

The use of multiple finishes provides better conductivity and corrosion resistance for the terminals.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the installation process and improves thermal dissipation.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim design and facilitates compact device assembly.

Width: 15 mm

The compact width measurement offers versatility in design and allows for the microprocessor to be used in various applications.

Boundary Scan: YES

Supporting boundary scan enables easier testing and debugging of the microprocessor during manufacturing and operation.

External Data Bus Width: 32

The wider external data bus width allows for faster data transfer between the microprocessor and external devices.

Maximum Clock Frequency: 66 MHz

The high maximum clock frequency ensures the microprocessor can handle data processing tasks quickly and efficiently.

Maximum Time At Peak Reflow Temperature (s): 40

The specified time at peak reflow temperature helps in ensuring proper soldering and assembly of the microprocessor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and assembly processes.

Length: 15 mm

The compact length measurement offers flexibility in design and integration of the microprocessor in electronic systems.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the microprocessor is designed to operate reliably in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor allows for efficient processing of instructions and enhances performance.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: BALL

The ball terminal form provides reliable connectivity and ease of installation for the microprocessor.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures compatibility with standard power sources and stable operation.

Terminal Pitch: 1 mm

The narrow terminal pitch allows for high-density routing and compact PCB design when integrating the microprocessor.

Format: FIXED POINT

Having a fixed-point format simplifies mathematical operations and enhances the microprocessor's processing capabilities.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microprocessor has moderate sensitivity to moisture during storage and handling.

Speed: 66 rpm

With a speed of 66 rpm, the microprocessor can efficiently carry out instruction execution and data processing tasks.

Low Power Mode: YES

The presence of a low power mode allows the microprocessor to conserve energy during periods of low processing demands.

Technical Specifications

Microprocessors MCF5272CVM66 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5272CVM66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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