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X66AK2H06AAAW24

Texas Instruments

X66AK2H06AAAW24 by Texas Instruments

X66AK2H06AAAW24 by Texas Instruments is a Microprocessor with 24-bit Address Bus, 16-bit External Data Bus, and 156.25 MHz Clock Frequency. Ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,202 parts In-Stock

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Digiode

USA . 189 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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One Stop Electronics

USA . 1,045 parts In-Stock

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Ampacity Inc.

Singapore . 1,172 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 764 parts In-Stock

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Parana Technologies

USA . 649 parts In-Stock

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ChromeModa Solutions

Germany . 4,672 parts In-Stock

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$57.150

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$46.863

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IDEA Electronic Components Group

UK . 770 parts In-Stock

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$57.150

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$54.292

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$51.435

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Microchip USA

USA . 2,918 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,376 parts In-Stock

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Corphita

USA . 888 parts In-Stock

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Argo Parts USA

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DigiPath Technology Company

USA . 124 parts In-Stock

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Overview

Experience the next level of performance with the X66AK2H06AAAW24 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, offering seamless integration, fast processing speeds, and low power consumption. Unlock the full potential of your projects with this innovative solution. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product long-lasting and affordable.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by storing frequently accessed data closer to the CPU for faster access.

Maximum Supply Voltage: 1.05 V

A higher maximum supply voltage allows for better performance and stability under heavy workloads.

Address Bus Width: 24

A wider address bus width enables the microprocessor to access a larger memory space, enhancing its overall performance.

Package Shape: SQUARE

The square package shape makes the microprocessor easy to handle and install in various systems.

No. of Terminals: 1517

Having a large number of terminals allows for versatile connectivity options and compatibility with different systems.

Package Style (Meter): GRID ARRAY

A grid array package style provides secure and reliable connections for the microprocessor, ensuring efficient data transmission.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microprocessor can operate effectively under demanding conditions without overheating.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it is designed for high efficiency and performance, making it suitable for various computing applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors X66AK2H06AAAW24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1200 GHZ

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06AAAW24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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