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X66AK2H12AAAWA24

Texas Instruments

X66AK2H12AAAWA24 by Texas Instruments

X66AK2H12AAAWA24 by Texas Instruments is a Microprocessor with 24-bit Address Bus, 16-bit External Data Bus, and 156.25 MHz Max Clock Frequency. It is ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature. The package style of this processor is grid array with 1517 terminals, making it suitable for surface mount assembly processes.

Median Price

$55.450

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$55.450

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87

$55.450

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Vyrian

USA . 6,608 parts In-Stock

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6,608

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Digiode

USA . 3,312 parts In-Stock

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3,312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 885 parts In-Stock

1+ parts

$10.000

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-

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885

$10.000

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AZTECH Wire

Italy . 395 parts In-Stock

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$13.130

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395

$13.130

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Parana Technologies

USA . 1,089 parts In-Stock

1+ parts

$30.350

100+ parts

$2,818.448

1k+ parts

$27.315

10k+ parts

-

1,089

$30.350

$2,818.448

$27.315

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DigiPath Technology Company

USA . 2,156 parts In-Stock

1+ parts

$33.419

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2,156

$33.419

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ChromeModa Solutions

Germany . 6,440 parts In-Stock

1+ parts

$34.101

100+ parts

$27.963

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6,440

$34.101

$27.963

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IDEA Electronic Components Group

UK . 876 parts In-Stock

1+ parts

$34.101

100+ parts

$32.396

1k+ parts

$30.691

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876

$34.101

$32.396

$30.691

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Microchip USA

USA . 1,706 parts In-Stock

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Corphita

USA . 118 parts In-Stock

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Overview

Experience the unparalleled performance and reliability of the X66AK2H12AAAWA24 microprocessor by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a variety of applications, this microprocessor offers seamless integration, high-speed processing, and low power consumption. Unlock new possibilities with the X66AK2H12AAAWA24 and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having an integrated cache enhances the performance of the microprocessor by reducing memory access times and improving overall processing speed.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation of the microprocessor onto a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures efficient power management and helps in optimizing energy consumption.

Address Bus Width: 24

A wider address bus width allows for accessing a larger memory space, enabling the microprocessor to handle more complex computations and tasks.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on a circuit board, allowing for compact and streamlined designs.

No. of Terminals: 1517

The high number of terminals provides connectivity for various input and output devices, enhancing the versatility and compatibility of the microprocessor.

Package Style (Meter): GRID ARRAY

The grid array package style offers reliable connections and improved thermal performance, ensuring stable operation of the microprocessor under demanding conditions.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for efficient power management and extends the battery life of devices using the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies the soldering process during installation, making it easier to integrate the microprocessor into electronic devices.

Maximum Seated Height: 3.75 mm

The low maximum seated height allows for slim and compact device designs, enabling the use of the microprocessor in thin and lightweight products.

Width: 40 mm

The moderate width of 40 mm strikes a balance between space efficiency and ease of handling, making the microprocessor suitable for a wide range of applications.

Boundary Scan: YES

Boundary scan support helps in testing and debugging the microprocessor more effectively, ensuring higher quality and reliability in the final product.

External Data Bus Width: 16

An external data bus width of 16 allows for fast data transfer between the microprocessor and external devices, improving overall system performance.

Maximum Clock Frequency: 156.25 MHz

The high maximum clock frequency of 156.25 MHz enables the microprocessor to execute instructions quickly and efficiently, enhancing its processing speed.

Length: 40 mm

The length of 40 mm complements the width of the microprocessor, providing a compact form factor that is suitable for integration into various electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring a RISC architecture, the microprocessor delivers high performance and efficiency in handling computing tasks, making it a preferred choice for demanding applications.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption and high speed operation, making it ideal for energy-efficient and high-performance devices.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and soldering, ensuring stable electrical connections and consistent performance of the microprocessor.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a balance between power efficiency and performance, ensuring optimal operation of the microprocessor in various applications.

Terminal Pitch: 1 mm

The small terminal pitch of 1 mm allows for high-density mounting of the microprocessor on a circuit board, enabling compact and efficient system designs.

Format: FLOATING POINT

The floating-point format supports advanced mathematical calculations and precision in computations, making the microprocessor suitable for scientific and engineering applications.

Speed: 1400 rpm

The operating speed of 1400 rpm indicates the processing capability of the microprocessor, allowing for swift execution of instructions and tasks in real-time.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption during idle or low-demand periods, improving the overall efficiency and battery life of devices utilizing the microprocessor.

Technical Specifications

Microprocessors X66AK2H12AAAWA24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1200 GHZ

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H12AAAWA24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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