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X66AK2H12AAAWA2

Texas Instruments

X66AK2H12AAAWA2 by Texas Instruments

X66AK2H12AAAWA2 by Texas Instruments is a Microprocessor with 24-bit Address Bus, 16-bit External Data Bus, and 156.25 MHz Clock Frequency. It is ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature. The package style of this processor is grid array with 1517 terminals, making it suitable for surface mount assembly processes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,390 parts In-Stock

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Digiode

USA . 2,112 parts In-Stock

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2,112

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Distributors (Availability)

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One Stop Electronics

USA . 867 parts In-Stock

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$1.000

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867

$1.000

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AZTECH Wire

Italy . 532 parts In-Stock

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$13.012

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$13.012

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Parana Technologies

USA . 162 parts In-Stock

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$63.075

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162

$63.075

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DigiPath Technology Company

USA . 509 parts In-Stock

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$69.454

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$63.897

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509

$69.454

$63.897

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ChromeModa Solutions

Germany . 2,644 parts In-Stock

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$70.871

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$58.114

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$70.871

$58.114

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$70.871

100+ parts

$67.327

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$63.784

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1,473

$70.871

$67.327

$63.784

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Corphita

USA . 3,528 parts In-Stock

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Microchip USA

USA . 2,857 parts In-Stock

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Overview

Unlock unprecedented performance with the X66AK2H12AAAWA2 microprocessor by Texas Instruments. Crafted with precision and expertise, this cutting-edge technology offers integrated cache, high clock frequency, and low power mode for optimal efficiency. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microprocessor delivers unparalleled speed and reliability. Experience the next level of innovation with Texas Instruments, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body helps in reducing the overall weight of the product, making it easier to handle and install.

Integrated Cache: YES

Having integrated cache enhances the processing speed and efficiency of the microprocessor, resulting in better performance.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures optimal power consumption and prevents overheating of the microprocessor.

Address Bus Width: 24

With a wider address bus width of 24, the microprocessor can handle larger amounts of data and perform complex calculations more efficiently.

No. of Terminals: 1517

Having a high number of terminals allows for more connectivity options and flexibility in integrating the microprocessor into different systems.

External Data Bus Width: 16

The 16-bit external data bus width enables faster data transfer between the microprocessor and other components, improving overall system performance.

Maximum Clock Frequency: 156.25 MHz

The high maximum clock frequency of 156.25 MHz ensures fast processing speeds and reliable operation of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor enables efficient processing of instructions, reducing latency and improving overall performance.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption and high reliability, making it an energy-efficient choice.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V is well within the safe operating range for the microprocessor, ensuring stable and efficient performance.

Technical Specifications

Microprocessors X66AK2H12AAAWA2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H12AAAWA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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