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X66AK2H06AAAWA2

Texas Instruments

X66AK2H06AAAWA2 by Texas Instruments

X66AK2H06AAAWA2 by Texas Instruments is a microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,619 parts In-Stock

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Digiode

USA . 2,573 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 595 parts In-Stock

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$11.532

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595

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One Stop Electronics

USA . 1,447 parts In-Stock

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$16.000

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Parana Technologies

USA . 1,348 parts In-Stock

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$37.726

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DigiPath Technology Company

USA . 974 parts In-Stock

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$41.541

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$38.218

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974

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

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$42.389

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$40.270

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$38.150

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1,324

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$38.150

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ChromeModa Solutions

Germany . 714 parts In-Stock

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$42.389

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$34.759

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714

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Component Stockers USA

USA . 280 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,305 parts In-Stock

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Microchip USA

USA . 1,540 parts In-Stock

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Corphita

USA . 553 parts In-Stock

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Overview

Experience the cutting-edge technology of the X66AK2H06AAAWA2 by Texas Instruments, a premium microprocessor that sets new standards in performance and efficiency. With its integrated cache and advanced CMOS technology, this processor delivers unmatched speed and power while maintaining low power consumption. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product offers reliability and durability that Texas Instruments is renowned for. Upgrade your systems with the X66AK2H06AAAWA2 and discover the seamless integration and high-quality performance that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability of the microprocessor, making it suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache helps in improving the overall performance and speed of the microprocessor by providing faster access to frequently used data.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures efficient power consumption and helps in reducing heat generation, making it an energy-efficient choice.

Address Bus Width: 24

With a wide address bus width of 24, this microprocessor is capable of handling large amounts of memory and data efficiently.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it ideal for applications where size is a constraint.

No. of Terminals: 1517

The high number of terminals allows for a greater connectivity and versatility in integrating the microprocessor into various systems.

Maximum Seated Height: 3.75 mm

The low maximum seated height of 3.75 mm enables easy installation and integration of the microprocessor into different devices or systems.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers improved performance, power efficiency, and scalability, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in the microprocessor ensures low power consumption and high reliability, making it an efficient choice for various applications.

Speed: 1200 rpm

With a speed of 1200 rpm, this microprocessor offers fast processing capabilities, making it suitable for demanding computational tasks.

Technical Specifications

Microprocessors X66AK2H06AAAWA2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06AAAWA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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