Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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X66AK2H12AAW2 by Texas Instruments is a microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in a compact form factor, such as embedded systems and IoT devices.
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This material provides durability and protection for the microprocessor, ensuring a longer lifespan.
Having integrated cache enhances the performance of the microprocessor by reducing the latency in accessing data.
Surface mount design allows for easy and secure installation onto circuit boards, saving space and improving reliability.
Operating at a maximum supply voltage of 1.05V ensures energy efficiency and prevents overheating.
A wider address bus width of 24 enhances the microprocessor's ability to handle memory addressing, improving overall performance.
Square package shape allows for efficient use of space on the circuit board, optimizing layout and airflow.
Having a high number of terminals allows for greater connectivity and functionality, making the microprocessor versatile in various applications.
Grid array package style provides secure connections and efficient heat dissipation, ensuring stable performance under high loads.
Operating at a minimum supply voltage of 0.95V allows for energy efficiency and extends the lifespan of the microprocessor.
Operating at a maximum temperature of 85°C ensures reliability and stability under varying environmental conditions.
Operating at a minimum temperature of 0°C ensures the microprocessor can function in cold environments without any issues.
Bottom terminal position allows for easy installation and connectivity on the circuit board, simplifying the assembly process.
With a low seated height of 3.75mm, the microprocessor can fit into compact spaces without obstructing airflow.
Compact width of 40mm allows for easy integration into various circuit board designs, saving space and enhancing overall system efficiency.
Having boundary scan capability allows for easy testing and debugging of the microprocessor during production, ensuring high quality and reliability.
A wider external data bus width of 16 allows for faster data transfer between the microprocessor and external devices, improving overall system performance.
Operating at a maximum clock frequency of 156.25MHz enables the microprocessor to handle complex tasks and computations quickly and efficiently.
Compact length of 40mm allows for easy integration into various circuit board designs, saving space and enhancing overall system efficiency.
Being a RISC microprocessor enables fast and efficient processing of instructions, making it ideal for high-performance computing applications.
CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and reliable.
Having ball terminal form provides secure connections and easy soldering, ensuring stable operation in various conditions.
Operating at a nominal supply voltage of 1V ensures energy efficiency and stability in operation, prolonging the lifespan of the microprocessor.
With a terminal pitch of 1mm, the microprocessor can fit into tight spaces on the circuit board, enabling compact and efficient system designs.
Operating in floating-point format allows for precise and efficient handling of decimal numbers and complex mathematical operations.
With a maximum speed of 1200rpm, the microprocessor can handle demanding tasks and computations swiftly, making it ideal for high-performance applications.
Having a low power mode option allows the microprocessor to conserve energy when idle or under light load, extending battery life in portable devices.
Microprocessors X66AK2H12AAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
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X66AK2H12AAW2 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
1N4148
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
Dc Components
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Eic Semiconductor
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
EU2B-YS3203C
Idec
ROTARY SWITCH;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FH8065301567313SR3UZ
Intel
Intel's FH8065301567313SR3UZ microprocessor features 64-bit size, 1170 terminals, and operates at speeds up to 1330 rpm. Suitable for industrial applications with a temperature range of -40 to 110 °C, this processor is designed for high-performance computing tasks requiring integrated cache and CMOS technology.
MIMXRT1165XVM5A
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
AM5748ABZXA
Texas Instruments
The Texas Instruments AM5748ABZXA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with low power mode support. The package style is grid array with 760 terminals in a square shape.
MCIMX6X2AVN08AB
Freescale Semiconductor
MICROPROCESSOR, RISC; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
MIMXRT1062DVN6B
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCIMX6X3CVO08AB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MPC8343VRADDB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
MCF5270VM100
The NXP Semiconductors MCF5270VM100 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. It is suitable for applications requiring low power consumption, such as embedded systems and industrial automation. The device has a terminal pitch of 1 mm and supports boundary scan testing for efficient debugging.
P1021NXE2FFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
AM3354BZCZA80
AM3354BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 64 DMA channels. It operates at a max clock frequency of 26 MHz and has low power mode for industrial applications.
N80C186XL20
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
MIMXRT1052DVJ6B
The NXP Semiconductors MIMXRT1052DVJ6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 105 mA supply current. Ideal for low power applications, it offers a max operating temperature of 95°C and integrated cache memory. This microprocessor is suitable for various embedded systems requiring high-speed processing in a compact form factor.
MCF5484CZP200
NXP Semiconductors MCF5484CZP200 is a 32-bit microprocessor with integrated cache, operating at max 66.67 MHz. Ideal for industrial applications, it features low power mode and boundary scan capability, with a package style of grid array and terminal pitch of 1 mm.
MCF5328CVM240J
MCF5328CVM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at max 80 MHz. It features a 24-bit address bus width and low power mode, suitable for industrial applications requiring high-speed processing in compact devices. The package style is grid array with dimensions of 17mm x 17mm and terminal pitch of 1mm.
ADSP-21489KSWZ-4B
Analog Devices
ADSP-21489KSWZ-4B by Analog Devices is a 40-bit microprocessor with integrated cache and a max clock frequency of 25 MHz. It is commonly used in applications requiring high-speed processing and floating-point calculations.
MIMXRT1011DAE5A
MICROPROCESSOR, RISC; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
MIMXRT595SFFOC
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MPC8347EVRAGDB
NXP Semiconductors' MPC8347EVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is suitable for applications requiring integrated cache, low power mode, and boundary scan capabilities. The package style is grid array with 620 terminals, making it ideal for high-performance computing systems.
MPC8280CZUUPEA
The NXP Semiconductors MPC8280CZUUPEA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 100 MHz, suitable for commercial-grade applications requiring high-speed processing. The package style is grid array, low profile, making it ideal for compact electronic devices.
ATSAMA5D22C-CNR
ATSAMA5D22C-CNR by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, thin profile, fine pitch with terminal finish of tin silver copper nickel.
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UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
X66AK2H06AAAW24
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
X66AK2H12AAWA2
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
X66AK2H12AAW24
X66AK2H06AAWA24
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Length: 40 mm;
X66AK2H12AAAWA24
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
X66AK2H06AAW24
X66AK2H06AAWA2
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
X66AK2H06XAAW2
X66AK2H06AXAAW2
X66AK2H06AAAWA2
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
X66AK2H12AAAWA2
X66AK2H12AAAW2
X66AK2H06AAW2
X66AK2H06AAAW2
X66AK2G01ZBB60
MICROPROCESSOR, RISC; Technology: CMOS;
X66AK2E05XABD25
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;
X66AK2G02ZBB60
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: LFBGA; Package Shape: SQUARE;
X66AK2H06AAAWA24
X66AK2H12AAAW24
Supply Digital Components
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