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X66AK2H12AAW2

Texas Instruments

X66AK2H12AAW2 by Texas Instruments

X66AK2H12AAW2 by Texas Instruments is a microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in a compact form factor, such as embedded systems and IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,958 parts In-Stock

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Vyrian

USA . 3,671 parts In-Stock

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3,671

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$6.793

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482

$6.793

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One Stop Electronics

USA . 324 parts In-Stock

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$25.000

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324

$25.000

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Parana Technologies

USA . 1,801 parts In-Stock

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$73.119

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$73.119

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DigiPath Technology Company

USA . 308 parts In-Stock

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$80.513

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308

$80.513

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ChromeModa Solutions

Germany . 1,816 parts In-Stock

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$82.156

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$67.368

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1,816

$82.156

$67.368

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IDEA Electronic Components Group

UK . 301 parts In-Stock

1+ parts

$82.156

100+ parts

$78.048

1k+ parts

$73.940

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301

$82.156

$78.048

$73.940

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Component Stockers USA

USA . 287 parts In-Stock

1+ parts

$99.990

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Corphita

USA . 2,446 parts In-Stock

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Microchip USA

USA . 1,757 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the X66AK2H12AAW2 microprocessor by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers exceptional performance and reliability in every component. Ideal for a variety of applications, this microprocessor offers integrated cache and a wide address bus width for seamless operation. With a maximum clock frequency of 156.25 MHz, this product provides unmatched speed and efficiency. Experience the value and benefits of Texas Instruments technology with the X66AK2H12AAW2 microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache enhances the performance of the microprocessor by reducing the latency in accessing data.

Surface Mount: YES

Surface mount design allows for easy and secure installation onto circuit boards, saving space and improving reliability.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V ensures energy efficiency and prevents overheating.

Address Bus Width: 24

A wider address bus width of 24 enhances the microprocessor's ability to handle memory addressing, improving overall performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and airflow.

No. of Terminals: 1517

Having a high number of terminals allows for greater connectivity and functionality, making the microprocessor versatile in various applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides secure connections and efficient heat dissipation, ensuring stable performance under high loads.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95V allows for energy efficiency and extends the lifespan of the microprocessor.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures reliability and stability under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the microprocessor can function in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position allows for easy installation and connectivity on the circuit board, simplifying the assembly process.

Maximum Seated Height: 3.75 mm

With a low seated height of 3.75mm, the microprocessor can fit into compact spaces without obstructing airflow.

Width: 40 mm

Compact width of 40mm allows for easy integration into various circuit board designs, saving space and enhancing overall system efficiency.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the microprocessor during production, ensuring high quality and reliability.

External Data Bus Width: 16

A wider external data bus width of 16 allows for faster data transfer between the microprocessor and external devices, improving overall system performance.

Maximum Clock Frequency: 156.25 MHz

Operating at a maximum clock frequency of 156.25MHz enables the microprocessor to handle complex tasks and computations quickly and efficiently.

Length: 40 mm

Compact length of 40mm allows for easy integration into various circuit board designs, saving space and enhancing overall system efficiency.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor enables fast and efficient processing of instructions, making it ideal for high-performance computing applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Having ball terminal form provides secure connections and easy soldering, ensuring stable operation in various conditions.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V ensures energy efficiency and stability in operation, prolonging the lifespan of the microprocessor.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, the microprocessor can fit into tight spaces on the circuit board, enabling compact and efficient system designs.

Format: FLOATING POINT

Operating in floating-point format allows for precise and efficient handling of decimal numbers and complex mathematical operations.

Speed: 1200 rpm

With a maximum speed of 1200rpm, the microprocessor can handle demanding tasks and computations swiftly, making it ideal for high-performance applications.

Low Power Mode: YES

Having a low power mode option allows the microprocessor to conserve energy when idle or under light load, extending battery life in portable devices.

Technical Specifications

Microprocessors X66AK2H12AAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H12AAW2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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