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X66AK2H06AAAWA24

Texas Instruments

X66AK2H06AAAWA24 by Texas Instruments

X66AK2H06AAAWA24 by Texas Instruments is a microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,994 parts In-Stock

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Digiode

USA . 1,307 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 397 parts In-Stock

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$9.543

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$9.543

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Parana Technologies

USA . 861 parts In-Stock

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$13.604

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$14.102

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861

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ChromeModa Solutions

Germany . 1,354 parts In-Stock

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$15.285

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$12.534

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IDEA Electronic Components Group

UK . 591 parts In-Stock

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$15.285

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$14.521

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$13.756

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591

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One Stop Electronics

USA . 834 parts In-Stock

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$31.000

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834

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Corphita

USA . 3,510 parts In-Stock

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Microchip USA

USA . 1,240 parts In-Stock

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DigiPath Technology Company

USA . 1,161 parts In-Stock

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$13.781

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Overview

Upgrade your electronic devices with the powerful X66AK2H06AAAWA24 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality microprocessors that deliver exceptional performance and reliability. Ideal for a wide range of applications, this microprocessor offers integrated cache, low power mode, and a maximum clock frequency of 156.25 MHz. Experience seamless functionality and enhanced efficiency with the X66AK2H06AAAWA24, providing unmatched value and benefits to customers seeking cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microprocessor lightweight and durable.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing latency for frequently accessed data.

Surface Mount: YES

Surface mount capability allows for easy and secure installation of the microprocessor on circuit boards, making it convenient for assembly.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V ensures energy efficiency and helps in reducing power consumption.

Address Bus Width: 24

Having a wider address bus width of 24 enables the microprocessor to access a larger memory space, enhancing overall performance.

Package Shape: SQUARE

The square package shape ensures efficient use of space and makes it easier to mount the microprocessor in various applications.

No. of Terminals: 1517

With a high number of terminals, the microprocessor can support a wide range of functions and interfaces, making it versatile for different uses.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal dissipation and mechanical stability, ensuring the reliability of the microprocessor.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V allows for efficient power management and extends the lifespan of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and improves thermal management, leading to better performance and longevity.

Maximum Seated Height: 3.75 mm

The low maximum seated height of 3.75 mm helps in compact designs and allows for easy integration of the microprocessor in tight spaces.

Width: 40 mm

The compact width of 40 mm enables the microprocessor to fit in various devices without taking up too much space.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the microprocessor, improving overall reliability and maintenance.

External Data Bus Width: 16

The external data bus width of 16 facilitates quick data transfer between the microprocessor and peripherals, enhancing overall system performance.

Maximum Clock Frequency: 156.25 MHz

Operating at a maximum clock frequency of 156.25 MHz ensures fast processing speeds and efficient multitasking capabilities for the microprocessor.

Length: 40 mm

The compact length of 40 mm allows for easy integration of the microprocessor in various devices without compromising on performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enhances processing efficiency and execution speed, making it suitable for complex computing tasks.

Technology: CMOS

Utilizing CMOS technology improves energy efficiency and reduces heat generation, leading to better overall performance and reliability.

Terminal Form: BALL

The ball terminal form provides a reliable connection for the microprocessor, ensuring stable operation and longevity of the device.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V ensures compatibility with standard power sources and efficient energy management.

Terminal Pitch: 1 mm

Having a terminal pitch of 1 mm simplifies the installation process and allows for easy integration of the microprocessor on circuit boards.

Format: FLOATING POINT

The floating point format allows for efficient processing of decimal numbers and enhances the microprocessor's performance in scientific and mathematical applications.

Speed: 1400 rpm

Operating at a speed of 1400 rpm ensures efficient cooling and thermal management, maintaining optimal performance levels for the microprocessor.

Low Power Mode: YES

Having a low power mode enables energy-saving operation and prolongs battery life in portable devices, making the microprocessor an efficient choice.

Technical Specifications

Microprocessors X66AK2H06AAAWA24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1200 GHZ

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06AAAWA24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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