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X66AK2E05XABD25

Texas Instruments

X66AK2E05XABD25 by Texas Instruments

X66AK2E05XABD25 by Texas Instruments is a microprocessor with 16-bit address and data bus width, operating at speeds up to 1250 rpm. It features integrated cache, low power mode, and boundary scan support. Ideal for applications requiring high-speed processing in compact devices like smartphones and tablets.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,920 parts In-Stock

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7,920

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Digiode

USA . 3,349 parts In-Stock

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3,349

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LIBRA Elektronik GmbH

Germany . 46 parts In-Stock

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46

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Distributors (Availability)

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One Stop Electronics

USA . 1,491 parts In-Stock

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$1.000

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1,491

$1.000

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AZTECH Wire

Italy . 873 parts In-Stock

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$6.024

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873

$6.024

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Parana Technologies

USA . 1,276 parts In-Stock

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$73.819

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1,276

$73.819

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DigiPath Technology Company

USA . 115 parts In-Stock

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$81.284

100+ parts

$74.781

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115

$81.284

$74.781

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IDEA Electronic Components Group

UK . 1,637 parts In-Stock

1+ parts

$82.943

100+ parts

$78.796

1k+ parts

$74.649

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1,637

$82.943

$78.796

$74.649

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ChromeModa Solutions

Germany . 617 parts In-Stock

1+ parts

$82.943

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$68.013

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617

$82.943

$68.013

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QUARKTWIN TECHNOLOGY LTD

USA . 29,071 parts In-Stock

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29,071

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Corphita

USA . 4,874 parts In-Stock

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Microchip USA

USA . 3,306 parts In-Stock

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3,306

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Overview

Experience unparalleled performance and efficiency with the X66AK2E05XABD25 by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers reliable products that exceed industry standards. This microprocessor is ideal for a wide range of applications, offering superior speed and functionality. Trust in Texas Instruments to provide top-quality solutions for your technological needs, ensuring seamless integration and optimal performance every time. Choose the X66AK2E05XABD25 for unmatched value and innovation in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor package easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps in reducing latency and improving overall performance of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy and quick installation of the microprocessor onto a circuit board, saving time and effort.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation of the microprocessor.

Address Bus Width: 16

Having a wide address bus allows the microprocessor to access a larger amount of memory, enhancing its capabilities.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring reliable connections for the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Speed: 1250 rpm

Operating at a high speed, this microprocessor can quickly perform calculations and process data, leading to improved efficiency.

Technical Specifications

Microprocessors X66AK2E05XABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

X66AK2E05XABD25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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