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X66AK2H06AAWA24

Texas Instruments

X66AK2H06AAWA24 by Texas Instruments

X66AK2H06AAWA24 by Texas Instruments is a Microprocessor with 24-bit Address Bus, 16-bit External Data Bus, and 156.25 MHz Clock Frequency. It is suitable for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,592 parts In-Stock

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Digiode

USA . 868 parts In-Stock

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868

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Distributors (Availability)

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AZTECH Wire

Italy . 517 parts In-Stock

1+ parts

$9.848

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517

$9.848

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One Stop Electronics

USA . 1,002 parts In-Stock

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$34.000

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$34.000

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Parana Technologies

USA . 338 parts In-Stock

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$46.262

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338

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ChromeModa Solutions

Germany . 3,810 parts In-Stock

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$51.980

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$42.624

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$51.980

$42.624

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IDEA Electronic Components Group

UK . 754 parts In-Stock

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$51.980

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$49.381

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$46.782

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754

$51.980

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$46.782

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Microchip USA

USA . 1,984 parts In-Stock

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DigiPath Technology Company

USA . 1,714 parts In-Stock

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$46.865

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Corphita

USA . 1,656 parts In-Stock

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Overview

Revolutionize your technology with the X66AK2H06AAWA24 by Texas Instruments. Crafted with precision and expertise, this microprocessor offers unparalleled quality and reliability. Ideal for a wide range of applications, this cutting-edge product boasts integrated cache, high-speed clock frequency, and low power mode for enhanced performance. Experience the value and benefits that Texas Instruments brings to the table with the X66AK2H06AAWA24 - it's time to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the components inside, making the product durable and reliable.

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing memory access times and increasing processing speed.

Surface Mount: YES

Surface mount technology makes it easier to install and replace the microprocessor on a circuit board, saving time and effort.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption, making the product energy-efficient and cost-effective to operate.

Address Bus Width: 24

A wider address bus allows for a larger memory address space, enabling the microprocessor to access more data quickly and efficiently.

Package Shape: SQUARE

A square package shape helps optimize space utilization on a circuit board, allowing for efficient placement and routing of components.

No. of Terminals: 1517

Having a high number of terminals enables the microprocessor to interface with multiple external components, expanding its functionality and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and reliability in connecting the microprocessor to the circuit board, ensuring stable electrical connections.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for flexibility in power input requirements and can help improve energy efficiency when operating at lower voltages.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and facilitates better heat dissipation, contributing to better performance and reliability.

Maximum Seated Height: 3.75 mm

The low seated height makes the microprocessor suitable for compact designs where space is limited, enabling integration into small form factor devices.

Width: 40 mm

The compact width of the microprocessor allows for efficient placement on a circuit board, helping to optimize the overall layout and design.

Boundary Scan: YES

Boundary scan support enables easy testing and debugging of the microprocessor during production and maintenance, ensuring reliability and quality control.

External Data Bus Width: 16

A wider external data bus facilitates faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 156.25 MHz

The high maximum clock frequency allows the microprocessor to operate at higher speeds, enabling quick processing of instructions and data.

Length: 40 mm

The length of the microprocessor is optimized for compatibility with standard board sizes, making it easy to integrate into various electronic systems.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for efficient execution of instructions, leading to improved performance and power efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor suitable for energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal form provides reliable connections with the circuit board, ensuring good electrical contact and signal integrity for optimal performance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V strikes a balance between performance and power efficiency, ensuring the microprocessor operates reliably under normal conditions.

Terminal Pitch: 1 mm

The small terminal pitch allows for compact packaging and efficient routing of connections, enabling a more streamlined and space-saving design.

Format: FLOATING POINT

Support for floating-point operations enhances the microprocessor's capabilities in handling complex mathematical calculations with precision and speed.

Speed: 1400 rpm

Operating at a speed of 1400 rpm ensures efficient processing of tasks and delivers high performance in demanding applications that require quick data processing.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate with reduced power consumption when performance demands are lower, saving energy and prolonging battery life.

Technical Specifications

Microprocessors X66AK2H06AAWA24 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1200 GHZ

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06AAWA24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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