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X66AK2H06AAW2

Texas Instruments

X66AK2H06AAW2 by Texas Instruments

X66AK2H06AAW2 by Texas Instruments is a microprocessor with 24-bit address bus, 16-bit external data bus, and max clock frequency of 156.25 MHz. It is ideal for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,810 parts In-Stock

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7,810

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Digiode

USA . 919 parts In-Stock

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919

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Distributors (Availability)

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AZTECH Wire

Italy . 253 parts In-Stock

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$19.740

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253

$19.740

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One Stop Electronics

USA . 1,131 parts In-Stock

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$26.000

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$26.000

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Parana Technologies

USA . 1,342 parts In-Stock

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$63.402

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DigiPath Technology Company

USA . 2,220 parts In-Stock

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$69.813

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2,220

$69.813

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ChromeModa Solutions

Germany . 3,023 parts In-Stock

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$71.238

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$58.415

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3,023

$71.238

$58.415

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IDEA Electronic Components Group

UK . 1,617 parts In-Stock

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$71.238

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$67.676

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$64.114

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1,617

$71.238

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$64.114

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Microchip USA

USA . 2,352 parts In-Stock

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Corphita

USA . 954 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the X66AK2H06AAW2 microprocessor by Texas Instruments. Designed with precision and quality in mind, this processor offers seamless integration, high-speed performance, and energy efficiency. Ideal for a wide range of applications, this microprocessor is perfect for enhancing productivity and driving innovation. Trust in Texas Instruments to deliver top-of-the-line solutions that exceed expectations. Experience the difference with the X66AK2H06AAW2 microprocessor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and resistance to heat, making this product reliable for long-term use.

Integrated Cache: YES

Having integrated cache helps in speeding up data access and improving overall performance of the microprocessor.

Surface Mount: YES

Being surface mountable makes installation easier and allows for a more compact design in electronic devices.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps in reducing power consumption and heat generation.

Address Bus Width: 24

With a wider address bus width of 24, this microprocessor can handle larger amounts of memory and data more efficiently.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into electronic circuits.

No. of Terminals: 1517

Having a high number of terminals provides more connectivity options and flexibility in designing electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure connections and precise alignment during assembly.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microprocessor can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance even in cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and enables better thermal management in electronic systems.

Maximum Seated Height: 3.75 mm

The low maximum seated height of 3.75 mm allows for compact device designs and efficient use of space.

Width: 40 mm

With a width of 40 mm, this microprocessor can be easily integrated into various electronic devices without taking up much space.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the microprocessor during development and production.

External Data Bus Width: 16

A wider external data bus width of 16 enables faster data transfer between the microprocessor and other components, improving overall system performance.

Maximum Clock Frequency: 156.25 MHz

Operating at a maximum clock frequency of 156.25 MHz ensures high-speed data processing and quick response times in computational tasks.

Length: 40 mm

With a length of 40 mm, this microprocessor offers a balanced form factor suitable for a wide range of electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for efficient instruction execution and improved performance in computing tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability in operation, making this microprocessor suitable for a variety of applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy soldering during the assembly process, ensuring robust performance in electronic systems.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V offers a balance between performance and power efficiency in electronic devices.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, this microprocessor allows for precise connections and efficient signal transmission in electronic circuits.

Format: FLOATING POINT

Supporting floating point format enhances the accuracy and speed of mathematical calculations, making this microprocessor suitable for computational tasks.

Speed: 1200 rpm

Operating at a speed of 1200 rpm ensures efficient data processing and quick response times in demanding applications.

Low Power Mode: YES

The availability of low power mode helps in reducing energy consumption and extending battery life in electronic devices, making this microprocessor energy-efficient.

Technical Specifications

Microprocessors X66AK2H06AAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

24

Boundary Scan:

YES

Maximum Clock Frequency:

156.25 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

Length:

40 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

X66AK2H06AAW2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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