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MPC880CVR133

NXP Semiconductors

MPC880CVR133 by NXP Semiconductors

NXP Semiconductors' MPC880CVR133 microprocessor features 32-bit address and external data bus width, operates at 133 rpm speed, with low power mode. Ideal for applications requiring a RISC-based microprocessor with integrated cache, it has a max supply voltage of 1.9 V and package style in grid array format.

Median Price

$42.360

Lifecycle Status

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MPC880CVR133 by NXP Semiconductors
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Rochester

USA . 7 parts In-Stock

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-

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$42.360

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$37.900

10k+ parts

$35.670

7

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$42.360

$37.900

$35.670

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Digiode

USA . 4,810 parts In-Stock

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$44.716

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Nova Conductors

Japan . 450 parts In-Stock

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$45.933

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Vyrian

USA . 4,909 parts In-Stock

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Anansix

USA . 1,217 parts In-Stock

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Flip Electronics

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Chip Stock

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LIBRA Elektronik GmbH

Germany . 40 parts In-Stock

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 744 parts In-Stock

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$6.157

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One Stop Electronics

USA . 67 parts In-Stock

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$40.010

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Semicontronic

India . 67 parts In-Stock

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$40.010

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$39.010

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$38.810

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Ampacity Inc.

Singapore . 47 parts In-Stock

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Corphita

USA . 3,222 parts In-Stock

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$42.363

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Continental Prestige Electronics

USA . 5,165 parts In-Stock

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$45.933

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$45.014

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$45.933

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Netroflash

USA . 1,000 parts In-Stock

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$45.933

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$45.014

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Vigor

Singapore . 322 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Argo Parts USA

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Microchip USA

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UNI Independent Distributors

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the power and efficiency of the NXP Semiconductors MPC880CVR133 microprocessor. With integrated cache, a wide address bus width, and low power mode, this innovative product offers seamless performance for various applications. NXP Semiconductors, known for their high-quality components, ensures reliability and durability in every device. Elevate your projects with the MPC880CVR133 and unlock a world of possibilities with its advanced technology and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache helps improve the performance and efficiency of the microprocessor.

Surface Mount: YES

Allows for easy integration into a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 1.9 V

Operates efficiently within a safe voltage range, reducing the risk of damage.

Address Bus Width: 32

Having a 32-bit address bus width allows for efficient memory addressing and data transfer.

Package Shape: SQUARE

Square package shape is commonly used for microprocessors, providing a good balance of size and thermal performance.

Bit Size: 32

A 32-bit microprocessor can handle larger data sizes and perform more complex operations.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 357

Having a large number of terminals allows for more connections and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers good electrical performance and thermal management.

Minimum Supply Voltage: 1.7 V

Provides flexibility in power supply options while ensuring stable operation.

Terminal Finish: TIN SILVER COPPER

Terminal finish with multiple metals ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for efficient heat dissipation and soldering during assembly.

Maximum Seated Height: 2.52 mm

Compact seated height makes it suitable for applications with tight space constraints.

Width: 25 mm

Moderate width allows for easy integration into various electronic systems.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the microprocessor during development and production.

External Data Bus Width: 32

Having a 32-bit external data bus width allows for efficient data transfer between the microprocessor and other components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for a sufficient duration during the manufacturing process.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C ensures proper soldering without damaging the microprocessor.

Length: 25 mm

Moderate length provides a good balance of size and performance for the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Microprocessor with RISC architecture offers high performance and efficiency for various computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for the microprocessor.

Terminal Form: BALL

Ball terminal form allows for reliable connections and facilitates soldering during assembly.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm enables easy soldering and connection with other components in the circuit.

Format: FIXED POINT

Fixed point format is suitable for numerical calculations and data processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microprocessor can withstand moderate levels of moisture during storage and assembly.

Speed: 133 rpm

Operating speed of 133 rpm provides a good balance of performance and power consumption.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption when the microprocessor is not operating at full capacity.

Technical Specifications

Microprocessors MPC880CVR133 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC880CVR133 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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