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ATSAMA5D27C-LD2G-CUR22

Microchip Technology

ATSAMA5D27C-LD2G-CUR22 by Microchip Technology

ATSAMA5D27C-LD2G-CUR22 by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 51 DMA channels. It is used in applications requiring high-speed processing, such as industrial automation and robotics due to its low power mode and floating-point format support.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,202 parts In-Stock

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VNN

France . 776 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 1,294 parts In-Stock

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$5.000

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$4.875

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$4.850

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$5.000

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$4.850

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AZTECH Wire

Italy . 708 parts In-Stock

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$15.091

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Corohmni

South Africa . 1,022 parts In-Stock

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Ampacity Inc.

Singapore . 595 parts In-Stock

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$31.000

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Aztec Data Supply Inc.

USA . 3,065 parts In-Stock

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$84.130

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NIA Electronics

USA . 7,026 parts In-Stock

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Continental Prestige Electronics

USA . 4,803 parts In-Stock

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Montano Global Distributors

Canada . 4,666 parts In-Stock

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Ledger Components

France . 2,920 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,302 parts In-Stock

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Argo Parts USA

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LMD Electronica

Estonia . 1,258 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$0.090

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$0.090

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the cutting-edge technology of the ATSAMA5D27C-LD2G-CUR22 by Microchip Technology. This high-quality microprocessor offers unparalleled performance and efficiency, making it ideal for a wide range of applications. With its integrated cache and low power mode, this product provides exceptional value and benefits to customers looking for reliable and advanced solutions. From industrial automation to consumer electronics, trust Microchip Technology to deliver top-of-the-line products that meet your needs. Elevate your projects with the ATSAMA5D27C-LD2G-CUR22 and experience the advantages of superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and heat resistance, making the product reliable for extended use.

Integrated Cache: YES

Integrated cache helps in improving the speed and efficiency of the processor by storing frequently accessed data close to the processing unit.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for better performance and stability under heavy workloads.

On Chip Data RAM Width: 8

Wider on-chip data RAM width enables faster data processing and multitasking capabilities.

Address Bus Width: 26

Having a wider address bus allows the processor to access larger memory spaces efficiently.

Package Shape: SQUARE

Square package shape allows for efficient packaging and space utilization in compact devices.

Bit Size: 32

32-bit architecture provides a balance between performance and compatibility with a wide range of software applications.

No. of Terminals: 361

Higher number of terminals allow for more connectivity options and features to be integrated with the processor.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal management and electrical performance compared to other package styles.

Minimum Supply Voltage: 1.1 V

Lower minimum supply voltage helps in reducing power consumption and heat generation during operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the processor to function reliably in cold environments without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more secure mounting and soldering on the circuit board.

RAM Words: 131072

Higher number of RAM words provide ample memory space for storing and processing data efficiently.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the processor during manufacturing and maintenance.

External Data Bus Width: 16

Wider external data bus width facilitates faster data transfer between the processor and external devices.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency enables fast data processing and execution of instructions, suitable for real-time applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the peripheral IC type provides efficient and optimized processing of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the processor suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form allows for easy and reliable connections with the circuit board, ensuring good electrical contact.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and reliability of the processor under different operating conditions.

No. of DMA Channels: 51

Higher number of DMA channels enable efficient data transfer and communication between peripherals and the processor.

No. of Serial I/Os: 7

Having multiple serial I/Os allows for versatile connectivity options and communication with external devices.

Format: FLOATING POINT

Floating-point format enables high-precision calculations, essential for complex mathematical operations and scientific applications.

Speed: 500 rpm

High speed of 500 rpm ensures quick response time and efficient data processing, suitable for high-performance computing tasks.

Low Power Mode: YES

Low power mode enhances energy efficiency and extends battery life for mobile devices or applications with power constraints.

Technical Specifications

Microprocessors ATSAMA5D27C-LD2G-CUR22 attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

Low Power Mode:

YES

No. of DMA Channels:

51

No. of External Interrupts:

1

No. of Serial I/Os:

7

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Words:

131072

Speed:

500 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

ATSAMA5D27C-LD2G-CUR22 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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