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MCF54416CMJ250

NXP Semiconductors

MCF54416CMJ250 by NXP Semiconductors

The NXP Semiconductors MCF54416CMJ250 is a 32-bit microprocessor with integrated cache and a max clock frequency of 100 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.

Median Price

$16.600

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MCF54416CMJ250 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,098 parts In-Stock

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$16.600

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1,098

$16.600

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Verical

USA . 1,098 parts In-Stock

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$16.600

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1,098

$16.600

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Mouser Electronics

USA . 442 parts In-Stock

1+ parts

$32.530

100+ parts

$24.130

1k+ parts

$23.880

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442

$32.530

$24.130

$23.880

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Flip Electronics (Authorized)

USA . 400 parts In-Stock

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400

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Distributors (In-Stock)

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Digiode

USA . 2,106 parts In-Stock

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$16.669

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2,106

$16.669

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Nova Conductors

Japan . 16 parts In-Stock

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$21.700

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16

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Flip Electronics

USA . 5,420 parts In-Stock

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Anansix

USA . 1,441 parts In-Stock

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TME

Poland . 450 parts In-Stock

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$14.880

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Chip Stock

USA . 285 parts In-Stock

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Vyrian

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Distributors (Availability)

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Corphita

USA . 3,351 parts In-Stock

1+ parts

$15.791

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3,351

$15.791

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$21.266

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$20.415

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2,000

$21.266

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$20.415

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Continental Prestige Electronics

USA . 5,719 parts In-Stock

1+ parts

$21.700

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$21.266

5,719

$21.700

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$21.266

Ampacity Inc.

Singapore . 713 parts In-Stock

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$24.540

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713

$24.540

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Semicontronic

India . 400 parts In-Stock

1+ parts

$24.540

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$23.926

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$23.804

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400

$24.540

$23.926

$23.804

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Vigor

Singapore . 1,845 parts In-Stock

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$24.860

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$24.860

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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$32.340

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$32.340

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Microchip USA

USA . 2,019 parts In-Stock

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$55.474

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2,019

$55.474

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Corohmni

South Africa . 185 parts In-Stock

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$81.859

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QUARKTWIN TECHNOLOGY LTD

USA . 26,297 parts In-Stock

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Lixinc

USA . 9,746 parts In-Stock

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UNI Independent Distributors

Spain . 8,124 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,923 parts In-Stock

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Argo Parts USA

USA . 1,969 parts In-Stock

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Metaverse IC Inc.

Canada . 910 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

USA . 182 parts In-Stock

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Overview

Discover the MCF54416CMJ250, a cutting-edge microprocessor brought to you by NXP Semiconductors. This high-quality chip offers unparalleled performance and reliability for a wide range of applications. With its integrated cache and low power mode, it provides exceptional speed and efficiency while reducing energy consumption. Whether you're working on industrial automation or embedded systems, this product will exceed your expectations. Trust in NXP Semiconductors' expertise and unlock the full potential of your projects with the MCF54416CMJ250.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material ensures durability and protection for the microprocessor, making it a reliable choice.

Integrated Cache:

YES. The integrated cache improves the processor's performance by reducing the time it takes to retrieve data, making it a high-performing option.

Surface Mount:

YES. The surface mount feature allows for easier installation and saves space on the circuit board, making it a convenient choice for compact designs.

Maximum Supply Voltage:

1.32V. This higher voltage enables the microprocessor to handle demanding tasks efficiently, making it suitable for high-performance applications.

Package Shape:

SQUARE. The square shape of the package provides stability during installation and ensures efficient heat dissipation, making it a reliable choice for prolonged use.

Bit Size:

32. With a bit size of 32, this microprocessor can handle a wide range of data processing tasks, making it versatile for various applications.

Power Supplies (V):

1.2, 1.8, 1.8/3.3, 3.3. The multiple power supply options allow for compatibility with different voltage levels, making it flexible for various system requirements.

No. of Terminals:

256. The abundance of terminals enables seamless connectivity and efficient data transfer, making it ideal for complex systems.

Package Style (Meter):

GRID ARRAY. The grid array package style ensures precise alignment and contact between the microprocessor and the circuit board, ensuring reliable performance.

Minimum Supply Voltage:

1.14V. This lower voltage requirement increases energy efficiency and reduces power consumption, making it an energy-saving choice.

Maximum Operating Temperature:

85°C. The high maximum operating temperature allows the microprocessor to work under demanding conditions without compromising performance, ensuring reliability.

Minimum Operating Temperature:

40°Cel. The minimum operating temperature range enables the microprocessor to function in extreme cold environments, making it suitable for various applications.

Terminal Position:

BOTTOM. The bottom terminal position facilitates easier connection and integration with other components, making it convenient for assembly.

Boundary Scan:

YES. The boundary scan feature aids in testing and debugging, ensuring the integrity and reliability of the microprocessor, making it a dependable choice.

Maximum Clock Frequency:

100 MHz. The high clock frequency allows for faster data processing and execution, making it suitable for applications that require quick response times.

Maximum Time At Peak Reflow Temperature (s):

40. With a maximum time at peak reflow temperature of 40 seconds, the microprocessor can withstand heat during manufacturing processes, ensuring reliable production.

Peak Reflow Temperature °C:

260. The high peak reflow temperature allows for proper soldering during the manufacturing process, ensuring secure connections for reliable performance.

Temperature Grade:

INDUSTRIAL. The industrial temperature grade range ensures the microprocessor can operate in harsh environments with extreme temperatures, making it durable and reliable.

Peripheral IC Type:

MICROPROCESSOR. Being a microprocessor, it offers advanced computing power, allowing for complex calculations and handling multiple tasks efficiently, making it a powerful choice.

Technology:

CMOS. The CMOS technology provides low power consumption and allows for high-speed operation, making it an energy-efficient and high-performing option.

Terminal Form:

BALL. The ball terminal form provides a reliable connection and ease of soldering during the assembly process, ensuring a secure and stable microprocessor.

Nominal Supply Voltage:

1.2V. The nominal supply voltage ensures stable and efficient power delivery to the microprocessor, preventing voltage fluctuations and ensuring consistent performance.

Terminal Pitch:

1mm. The small terminal pitch allows for a high density of connections in a compact space, making it suitable for applications with limited board real estate.

Format:

FIXED POINT. The fixed-point format allows the microprocessor to execute mathematical calculations accurately, making it suitable for applications that require precise arithmetic operations.

Moisture Sensitivity Level (MSL):

3. With an MSL of 3, the microprocessor can withstand moderate moisture exposure during handling and assembly, ensuring long-term reliability.

Speed:

250 rpm. The high speed of 250 rpm enables fast data transfer and processing, making it suitable for applications that require quick data analysis and response.

Low Power Mode:

YES. The low power mode feature enhances energy efficiency, reducing power consumption during idle or low-demand periods, making it an economical choice.

Technical Specifications

Microprocessors MCF54416CMJ250 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,1.8/3.3,3.3

Qualification:

Not Qualified

Speed:

250 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MCF54416CMJ250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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