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MPC8308VMAGDA

NXP Semiconductors

MPC8308VMAGDA by NXP Semiconductors

The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.

Median Price

$28.715

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,630 parts In-Stock

1+ parts

$36.870

100+ parts

$25.250

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1,630

$36.870

$25.250

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EBV Elektronik

Germany . 252 parts In-Stock

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Rochester

USA . 11 parts In-Stock

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$20.560

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$18.390

10k+ parts

$17.310

11

-

$20.560

$18.390

$17.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,990 parts In-Stock

1+ parts

$21.698

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2,990

$21.698

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Nova Conductors

Japan . 100 parts In-Stock

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$28.069

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100

$28.069

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Anansix

USA . 2,391 parts In-Stock

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2,391

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Chip Stock

USA . 584 parts In-Stock

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584

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Vyrian

USA . 573 parts In-Stock

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573

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Flip Electronics

USA . 168 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 591 parts In-Stock

1+ parts

$19.410

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591

$19.410

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Corphita

USA . 205 parts In-Stock

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$20.556

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$20.556

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Semicontronic

India . 215 parts In-Stock

1+ parts

$24.270

100+ parts

$23.663

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$23.542

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215

$24.270

$23.663

$23.542

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Corohmni

South Africa . 23 parts In-Stock

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$27.510

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23

$27.510

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Aztec Data Supply Inc.

USA . 294 parts In-Stock

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$28.050

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294

$28.050

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Continental Prestige Electronics

USA . 6,559 parts In-Stock

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$28.069

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$27.508

6,559

$28.069

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$27.508

Vigor

Singapore . 565 parts In-Stock

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$32.500

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565

$32.500

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$53.263

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$48.469

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$43.676

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5,000

$53.263

$48.469

$43.676

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Microchip USA

USA . 351 parts In-Stock

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$88.159

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351

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A-Z Elektronik GmbH

Germany . 6,060 parts In-Stock

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Lixinc

USA . 5,330 parts In-Stock

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Argo Parts USA

USA . 4,480 parts In-Stock

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Futuretech Components

Singapore . 800 parts In-Stock

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UNI Independent Distributors

Spain . 505 parts In-Stock

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Kepictronics

USA . 420 parts In-Stock

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420

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Benley Electronics

USA . 276 parts In-Stock

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Overview

Power up your projects with the MPC8308VMAGDA microprocessor from NXP Semiconductors. Designed with cutting-edge technology, this high-quality component offers integrated cache and low power mode for optimal performance in a variety of applications. With a maximum clock frequency of 66.67 MHz, this microprocessor is perfect for demanding tasks while maintaining efficiency. Trust NXP Semiconductors to deliver superior products that exceed expectations. Elevate your designs with the MPC8308VMAGDA and experience unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Maximum Supply Voltage: 1.05 V

Operates efficiently within a safe voltage range to prevent damage to the microprocessor.

Package Shape: SQUARE

Square shape allows for easy alignment and fitting within electronic devices.

No. of Terminals: 473

Higher number of terminals allow for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style of package enables a compact design and efficient heat dissipation.

Minimum Supply Voltage: 0.95 V

Allows for flexibility in power supply options while maintaining optimal performance.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Operates efficiently in a wide range of temperatures for versatile use.

Terminal Finish: TIN SILVER

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and enhances thermal management.

Maximum Seated Height: 1.54 mm

Low profile design allows for compact placement in electronic devices.

Width: 19 mm

Standard width for easy integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability aids in testing, debugging, and maintaining the microprocessor.

Maximum Clock Frequency: 66.67 MHz

Capable of high clock frequencies for swift data processing and performance.

Maximum Time At Peak Reflow Temperature (s): 40

Efficient reflow process time for quick and reliable manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures to ensure proper soldering.

Length: 19 mm

Compact length for efficient placement within electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enhances processing speed and efficiency for enhanced performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: BALL

Ball terminals offer secure and reliable connections for optimal performance.

Nominal Supply Voltage: 1 V

Stable supply voltage for consistent and reliable performance.

No. of Serial I/Os: 2

Multiple serial I/O ports allow for versatile connectivity options.

Terminal Pitch: 0.8 mm

Compact terminal pitch for efficient PCB design and layout.

Format: FLOATING POINT

Floating point format allows for precise and accurate numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the microprocessor can withstand standard moisture exposure levels.

Speed: 400 rpm

Operates at a high speed for rapid data processing and performance.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Technical Specifications

Microprocessors MPC8308VMAGDA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Boundary Scan:

YES

Maximum Clock Frequency:

66.67 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B473

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

473

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA473,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.54 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MPC8308VMAGDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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