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MCIMX6U6AVM08AC

NXP Semiconductors

MCIMX6U6AVM08AC by NXP Semiconductors

MCIMX6U6AVM08AC by NXP is a 64-bit microprocessor with 16-bit address bus, operating at max 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, supporting boundary scan technology. With a temp range of -40 to 125 °C, this CMOS processor has a terminal pitch of 0.8 mm and package style in grid array format.

Median Price

$32.930

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Arrow

USA . 40 parts In-Stock

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Verical

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Chip1Stop

Japan . 300 parts In-Stock

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Future Electronics

Canada . 1 parts In-Stock

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Mouser Electronics

USA . 290 parts In-Stock

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DigiKey

USA . 275 parts In-Stock

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$42.373

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Flip Electronics (Authorized)

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Avnet

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Maritex

Poland . 256 parts In-Stock

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$21.145

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$14.645

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Digiode

USA . 1,103 parts In-Stock

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$28.500

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IBS Electronics

USA . 1 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Chip Stock

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J2 Sourcing AB

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Anansix

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Kruse Electronics AG

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Cyclops Electronics Ltd

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Vyrian

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ComSIT Distribution GmbH

Germany . 399 parts In-Stock

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VRG Components

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TME

Poland . 163 parts In-Stock

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Martec Srl

Italy . 24 parts In-Stock

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Ampacity Inc.

Singapore . 354 parts In-Stock

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$12.960

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Corphita

USA . 2,962 parts In-Stock

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Continental Prestige Electronics

USA . 1,357 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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$48.882

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$46.927

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Aztec Data Supply Inc.

USA . 973 parts In-Stock

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Corohmni

South Africa . 403 parts In-Stock

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Microchip USA

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Lixinc

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Argo Parts USA

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Epart123

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iodParts Technologies Inc.

India . 312 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

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Overview

Unleash the power of cutting-edge technology with the MCIMX6U6AVM08AC microprocessor from NXP Semiconductors. This high-quality product offers unmatched performance and reliability, making it ideal for a wide range of applications. With its innovative features and advanced capabilities, this microprocessor delivers exceptional value and benefits to customers looking for top-notch speed, efficiency, and functionality. Upgrade your devices today with the MCIMX6U6AVM08AC and experience the difference that NXP Semiconductors can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the microprocessor, making it ideal for portable devices and applications.

Integrated Cache: YES

Having integrated cache helps in improving the overall speed and performance of the microprocessor by reducing the latency in accessing frequently used data.

Maximum Supply Voltage: 1.5 V

The maximum supply voltage of 1.5V ensures the stability and reliability of the microprocessor while operating under different load conditions.

Address Bus Width: 16

With a wide address bus width of 16, the microprocessor can handle large memory addresses efficiently, making it suitable for applications requiring extensive data processing.

Package Shape: SQUARE

The square package shape helps in optimizing the space utilization on the PCB, making it easier to integrate the microprocessor into compact electronic devices.

Bit Size: 64

With a 64-bit architecture, the microprocessor can handle large amounts of data and perform complex computations, making it suitable for high-performance computing tasks.

No. of Terminals: 624

Having a higher number of terminals allows for a more versatile and efficient connection interface, enabling the microprocessor to communicate with other components effectively.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good conductivity and corrosion resistance, enhancing the longevity and reliability of the microprocessor.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the microprocessor to function reliably even in harsh environments or under heavy workloads without overheating.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC (Reduced Instruction Set Computing) architecture, it offers improved performance and power efficiency for handling complex computational tasks efficiently.

Technical Specifications

Microprocessors MCIMX6U6AVM08AC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U6AVM08AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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