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AM5706BCBDJA

Texas Instruments

AM5706BCBDJA by Texas Instruments

AM5706BCBDJA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It is suitable for industrial applications requiring low power mode, operating at a max clock frequency of 38.4 MHz. The package style is grid array with 538 terminals in a square shape measuring 17mm x 17mm.

Median Price

$49.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 588 parts In-Stock

1+ parts

$38.299

100+ parts

$34.044

1k+ parts

$25.032

10k+ parts

-

588

$38.299

$34.044

$25.032

-

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$60.920

100+ parts

$44.630

1k+ parts

-

10k+ parts

-

10

$60.920

$44.630

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 956 parts In-Stock

1+ parts

$36.384

100+ parts

-

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10k+ parts

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956

$36.384

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-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$37.875

100+ parts

-

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200

$37.875

-

-

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Vyrian

USA . 8,017 parts In-Stock

1+ parts

-

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8,017

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Chip Stock

USA . 3,016 parts In-Stock

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3,016

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VNN

France . 1,782 parts In-Stock

1+ parts

-

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1,782

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$11.057

100+ parts

-

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-

10k+ parts

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588

$11.057

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-

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Ampacity Inc.

Singapore . 163 parts In-Stock

1+ parts

$32.550

100+ parts

-

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163

$32.550

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-

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Corphita

USA . 4,277 parts In-Stock

1+ parts

$34.469

100+ parts

-

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4,277

$34.469

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Continental Prestige Electronics

USA . 185 parts In-Stock

1+ parts

$37.875

100+ parts

-

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10k+ parts

$37.117

185

$37.875

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-

$37.117

Parana Technologies

USA . 29 parts In-Stock

1+ parts

$63.680

100+ parts

-

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29

$63.680

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-

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ChromeModa Solutions

Germany . 4,848 parts In-Stock

1+ parts

$71.551

100+ parts

$58.672

1k+ parts

-

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4,848

$71.551

$58.672

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IDEA Electronic Components Group

UK . 465 parts In-Stock

1+ parts

$71.551

100+ parts

$67.973

1k+ parts

$64.396

10k+ parts

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465

$71.551

$67.973

$64.396

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Microchip USA

USA . 2,310 parts In-Stock

1+ parts

$76.220

100+ parts

$74.900

1k+ parts

$74.230

10k+ parts

$73.570

2,310

$76.220

$74.900

$74.230

$73.570

Lixinc

USA . 8,845 parts In-Stock

1+ parts

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8,845

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Argo Parts USA

USA . 2,153 parts In-Stock

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2,153

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DigiPath Technology Company

USA . 1,505 parts In-Stock

1+ parts

-

100+ parts

$64.510

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-

10k+ parts

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1,505

-

$64.510

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$37.117

1k+ parts

$35.981

10k+ parts

$35.223

100

-

$37.117

$35.981

$35.223

Overview

Unleash the power of cutting-edge technology with the AM5706BCBDJA by Texas Instruments! As a leader in the industry, Texas Instruments ensures top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, offering seamless performance and efficiency. Experience the value and benefits of this product, from its integrated cache to its low power mode, providing customers with a competitive edge in their projects. Upgrade your systems with the best - choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microprocessor a good choice for various applications.

Integrated Cache: YES

The integrated cache improves the speed and efficiency of the microprocessor, making it suitable for high-performance tasks.

Surface Mount: YES

The surface mount feature allows for easy and secure installation, making the microprocessor ideal for compact and space-constrained designs.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage reduces power consumption and heat generation, making the microprocessor energy-efficient.

Address Bus Width: 16

The wide address bus width enables the microprocessor to handle large amounts of data efficiently, making it suitable for complex computational tasks.

Package Shape: SQUARE

The square shape of the package allows for efficient PCB layout and assembly, making the microprocessor a convenient choice for designers.

No. of Terminals: 538

The high number of terminals provides flexibility in connecting external components, enhancing the microprocessor's versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style ensures reliable connections and efficient heat dissipation, making the microprocessor reliable and durable.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage allows for stable operation at low power levels, making the microprocessor suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the microprocessor can withstand harsh environmental conditions, enhancing its reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microprocessor to function in extreme cold environments, making it versatile for various applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making the microprocessor easy to integrate into electronic designs.

Maximum Seated Height: 1.298 mm

The low maximum seated height allows for compact device designs, making the microprocessor suitable for slim form factor applications.

Width: 17 mm

The moderate width of the microprocessor allows for efficient PCB layout and space utilization, making it a versatile choice for compact designs.

Technical Specifications

Microprocessors AM5706BCBDJA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

538

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.298 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM5706BCBDJA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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