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AM5726BABCXA

Texas Instruments

AM5726BABCXA by Texas Instruments

The Texas Instruments AM5726BABCXA microprocessor features a 32-bit external data bus width, operates at a max clock frequency of 38.4 MHz, and has an industrial temperature grade. It is commonly used in applications requiring high-speed processing and low power consumption, such as industrial automation systems and embedded computing devices.

Median Price

$100.340

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 505 parts In-Stock

1+ parts

$72.485

100+ parts

$64.431

1k+ parts

$47.376

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-

505

$72.485

$64.431

$47.376

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DigiKey

USA . 47 parts In-Stock

1+ parts

$100.340

100+ parts

$76.938

1k+ parts

$75.019

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-

47

$100.340

$76.938

$75.019

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Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$100.340

100+ parts

$76.940

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-

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47

$100.340

$76.940

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 5 parts In-Stock

1+ parts

$54.000

100+ parts

-

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5

$54.000

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Nova Conductors

Japan . 50 parts In-Stock

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$66.800

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50

$66.800

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Digiode

USA . 4,581 parts In-Stock

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$68.861

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4,581

$68.861

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VNN

France . 4,455 parts In-Stock

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4,455

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Vyrian

USA . 2,455 parts In-Stock

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2,455

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Chip Stock

USA . 861 parts In-Stock

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Component Sense

UK . 51 parts In-Stock

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51

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$9.856

100+ parts

-

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217

$9.856

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Parana Technologies

USA . 511 parts In-Stock

1+ parts

$22.186

100+ parts

-

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$22.828

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511

$22.186

-

$22.828

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DigiPath Technology Company

USA . 1,225 parts In-Stock

1+ parts

$24.429

100+ parts

$22.475

1k+ parts

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1,225

$24.429

$22.475

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ChromeModa Solutions

Germany . 3,243 parts In-Stock

1+ parts

$24.928

100+ parts

$20.441

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-

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3,243

$24.928

$20.441

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IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$24.928

100+ parts

$23.682

1k+ parts

$22.435

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753

$24.928

$23.682

$22.435

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$60.453

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368

$60.453

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Ampacity Inc.

Singapore . 65 parts In-Stock

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$61.610

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65

$61.610

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Corphita

USA . 2,576 parts In-Stock

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$65.236

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2,576

$65.236

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Microchip USA

USA . 2,721 parts In-Stock

1+ parts

$112.140

100+ parts

$110.190

1k+ parts

$109.210

10k+ parts

$108.240

2,721

$112.140

$110.190

$109.210

$108.240

Lixinc

USA . 7,297 parts In-Stock

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7,297

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iodParts Technologies Inc.

India . 5,415 parts In-Stock

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5,415

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Argo Parts USA

USA . 4,390 parts In-Stock

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4,390

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Futuretech Components

Singapore . 201 parts In-Stock

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201

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Continental Prestige Electronics

USA . 188 parts In-Stock

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Perfect Parts

USA . 65 parts In-Stock

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65

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Overview

Experience the superior quality and reliability of the Texas Instruments AM5726BABCXA microprocessor. As a leader in the industry, Texas Instruments delivers cutting-edge technology that meets the demands of various applications. From industrial automation to consumer electronics, this microprocessor offers high performance and efficiency. Trust Texas Instruments to provide you with a product that exceeds expectations and adds value to your projects. Elevate your designs with the AM5726BABCXA and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microprocessor, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.2 V

Operates efficiently with a low maximum supply voltage, which can lead to energy savings and improved power management.

Address Bus Width: 16

Wide address bus width of 16 allows for efficient data processing and communication between components in the system.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization and allows for easier integration into circuit designs.

No. of Terminals: 760

Large number of terminals provide flexibility and connectivity options for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density mounting and enhances overall performance of the microprocessor.

Minimum Supply Voltage: 1.11 V

Low minimum supply voltage ensures efficient power consumption and helps in extending the battery life of devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stability and reliability under various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for reliable performance in both extreme cold and hot environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and soldering process, making it user-friendly for assembly.

Maximum Seated Height: 2.55 mm

Low seated height helps in reducing the overall profile of the microprocessor, making it suitable for slim and compact designs.

Width: 23 mm

Optimal width dimension allows for easy integration into standard circuit board layouts and facilitates efficient heat dissipation.

Boundary Scan: YES

Boundary scan capability enables testing and debugging of the microprocessor, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

Wide external data bus width of 32 allows for high-speed data transfer and efficient processing of complex computational tasks.

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency ensures fast operation and responsive performance for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Stable performance for up to 30 seconds at peak reflow temperature allows for reliable soldering and assembly processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance ensures durability and reliability during soldering and rework operations.

Length: 23 mm

Optimal length dimension helps in maintaining a balanced form factor for the microprocessor, ensuring compatibility with standard board sizes.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures reliable performance in harsh operating conditions typically found in industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers efficient processing capabilities and high performance for handling complex computing tasks.

Technology: CMOS

CMOS technology provides low power consumption, high speed operation, and reliable performance, making it ideal for a wide range of applications.

Terminal Form: BALL

Ball terminal form allows for easy and reliable soldering connections, ensuring secure attachment to the circuit board.

Nominal Supply Voltage: 1.15 V

Optimal nominal supply voltage ensures stable and efficient operation, improving overall energy efficiency and performance.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm enables high-density mounting and compact design integration, saving space on the circuit board.

Format: FLOATING POINT

Floating point format enables precise mathematical calculations and numerical accuracy, essential for scientific and computational applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures robustness and reliability under varying humidity conditions, enhancing overall durability.

Speed: 1500 rpm

High speed capability of 1500 rpm enables efficient data processing and rapid execution of computational tasks, improving overall performance.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation, extending battery life and reducing overall power consumption in portable devices.

Technical Specifications

Microprocessors AM5726BABCXA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5726BABCXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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