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MCIMX6S6AVM08AD

NXP Semiconductors

MCIMX6S6AVM08AD by NXP Semiconductors

MCIMX6S6AVM08AD by NXP Semiconductors is a Microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan feature.

Median Price

$46.640

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 240 parts In-Stock

1+ parts

$46.100

100+ parts

$28.600

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240

$46.100

$28.600

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Arrow

USA . 125 parts In-Stock

1+ parts

$47.180

100+ parts

$32.230

1k+ parts

$32.140

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125

$47.180

$32.230

$32.140

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Mouser Electronics

USA . 275 parts In-Stock

1+ parts

$59.540

100+ parts

$39.040

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275

$59.540

$39.040

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EBV Elektronik

Germany . 3,120 parts In-Stock

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Verical

USA . 240 parts In-Stock

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$40.097

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$39.936

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240

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$40.097

$39.936

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Distributors (In-Stock)

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Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$37.288

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76

$37.288

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Digiode

USA . 3,723 parts In-Stock

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$40.755

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3,723

$40.755

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Vyrian

USA . 3,714 parts In-Stock

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3,714

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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Anansix

USA . 729 parts In-Stock

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729

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 619 parts In-Stock

1+ parts

$35.190

100+ parts

$34.310

1k+ parts

$34.134

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619

$35.190

$34.310

$34.134

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Ampacity Inc.

Singapore . 233 parts In-Stock

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$35.190

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233

$35.190

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Continental Prestige Electronics

USA . 4,469 parts In-Stock

1+ parts

$37.288

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$36.542

4,469

$37.288

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$36.542

Netroflash

USA . 100 parts In-Stock

1+ parts

$37.288

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100

$37.288

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Corohmni

South Africa . 418 parts In-Stock

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$38.238

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418

$38.238

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Corphita

USA . 2,371 parts In-Stock

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$38.610

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2,371

$38.610

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Microchip USA

USA . 1,430 parts In-Stock

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$80.299

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1,430

$80.299

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QUARKTWIN TECHNOLOGY LTD

USA . 19,912 parts In-Stock

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Lixinc

USA . 13,414 parts In-Stock

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13,414

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UNI Independent Distributors

Spain . 6,037 parts In-Stock

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Argo Parts USA

USA . 2,067 parts In-Stock

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Overview

Revolutionize your electronics with the MCIMX6S6AVM08AD by NXP Semiconductors. As a leader in the industry, NXP guarantees top-notch quality and reliability. This microprocessor is perfect for a wide range of applications, offering unmatched performance and efficiency. With features like integrated cache and low power mode, this product provides exceptional value to customers looking for cutting-edge technology. Experience seamless operation and superior functionality with the MCIMX6S6AVM08AD – the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material helps in reducing the overall weight of the product, making it suitable for portable devices.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the microprocessor by reducing the latency in fetching data.

Maximum Supply Voltage: 1.5 V

The maximum supply voltage of 1.5V ensures compatibility with a wide range of power sources, making it versatile for various applications.

Address Bus Width: 16

A wider address bus width allows the microprocessor to access a larger memory space, enabling it to handle complex calculations and data processing tasks efficiently.

Package Shape: SQUARE

The square package shape makes it easier to mount the microprocessor on a circuit board, optimizing space utilization and facilitating efficient heat dissipation.

Speed: 800 rpm

The high speed of 800 rpm ensures fast processing and response times, making it suitable for tasks that require quick data handling and computations.

Technical Specifications

Microprocessors MCIMX6S6AVM08AD attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S6AVM08AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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