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MPC8280CZUUPEA

NXP Semiconductors

MPC8280CZUUPEA by NXP Semiconductors

The NXP Semiconductors MPC8280CZUUPEA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 100 MHz, suitable for commercial-grade applications requiring high-speed processing. The package style is grid array, low profile, making it ideal for compact electronic devices.

Median Price

$452.120

Lifecycle Status

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10

In-Stock Inventory

1k+

MPC8280CZUUPEA by NXP Semiconductors
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Rochester

USA . 1 parts In-Stock

1+ parts

$452.120

100+ parts

$424.990

1k+ parts

$384.300

10k+ parts

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1

$452.120

$424.990

$384.300

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Nova Conductors

Japan . 74 parts In-Stock

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$370.734

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$370.734

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Digiode

USA . 467 parts In-Stock

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$429.514

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$429.514

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Vyrian

USA . 4,422 parts In-Stock

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Anansix

USA . 1,594 parts In-Stock

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Touchstone Systems

USA . 320 parts In-Stock

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320

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Chip Stock

USA . 225 parts In-Stock

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Cyclops Electronics Ltd

UK . 115 parts In-Stock

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Flip Electronics

USA . 34 parts In-Stock

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QIE Inc.

USA . 7 parts In-Stock

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AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$18.946

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$18.946

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Continental Prestige Electronics

USA . 1,816 parts In-Stock

1+ parts

$370.734

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$363.319

1,816

$370.734

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$363.319

Argo Parts USA

USA . 1,807 parts In-Stock

1+ parts

$370.734

100+ parts

$367.027

1k+ parts

$363.319

10k+ parts

$359.612

1,807

$370.734

$367.027

$363.319

$359.612

Ampacity Inc.

Singapore . 1 parts In-Stock

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$384.300

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$384.300

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Semicontronic

India . 1 parts In-Stock

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$384.300

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$374.692

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$372.771

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$384.300

$374.692

$372.771

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Corohmni

South Africa . 21 parts In-Stock

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$392.006

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Corphita

USA . 891 parts In-Stock

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$406.908

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891

$406.908

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Vigor

Singapore . 127 parts In-Stock

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$542.025

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One Stop Electronics

USA . 1 parts In-Stock

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$836.420

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Microchip USA

USA . 432 parts In-Stock

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$861.323

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A-Z Elektronik GmbH

Germany . 7,343 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,950 parts In-Stock

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Futuretech Components

Singapore . 899 parts In-Stock

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Kepictronics

USA . 400 parts In-Stock

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GreenTree Electronics

Israel . 160 parts In-Stock

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Perfect Parts

USA . 141 parts In-Stock

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Component Stockers USA

USA . 87 parts In-Stock

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$2,139.540

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Netroflash

USA . 50 parts In-Stock

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$363.319

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$352.197

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$344.783

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$344.783

Speed Components Ltd (Excess)

Israel . 1 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MPC8280CZUUPEA by NXP Semiconductors, a leading manufacturer in the semiconductor industry. This microprocessor boasts integrated cache and a 32-bit address bus width, making it ideal for a wide range of applications. From IoT devices to networking equipment, this versatile product offers customers exceptional value, efficiency, and power. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the MPC8280CZUUPEA today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microprocessor, making it suitable for various environments.

Integrated Cache: YES

Having integrated cache improves the performance and speed of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.6 V

Allows for efficient power management while operating within safe voltage limits.

Address Bus Width: 32

Provides efficient data transfer and address handling capabilities.

Package Shape: SQUARE

Square shape allows for easy integration into various electronic devices and circuit boards.

Bit Size: 32

32-bit architecture enables faster processing and data handling.

Power Supplies (V): 1.5,3.3

Supports multiple power supply options for flexibility in various applications.

No. of Terminals: 480

High number of terminals allow for connectivity with other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array style with low profile design saves space and improves thermal management.

Minimum Supply Voltage: 1.45 V

Ensures stable operation with a minimum voltage requirement.

Maximum Operating Temperature: 70 °C

Capable of operating in moderate to high-temperature environments.

Minimum Operating Temperature: 0 °C

Capable of starting operation at low temperatures, increasing its versatility.

Terminal Finish: TIN LEAD SILVER

Provides a reliable and durable finish for the terminals, ensuring long-term connectivity.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and connection to the circuit board.

Maximum Seated Height: 1.65 mm

Low seated height makes it suitable for slim and compact electronic devices.

Width: 37.5 mm

Compact width enables easy placement and integration in various electronic systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor.

External Data Bus Width: 64

64-bit external data bus width enables fast data transfer and processing capabilities.

Maximum Clock Frequency: 100 MHz

High clock frequency allows for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Capable of withstanding peak reflow temperatures for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during assembly processes.

Length: 37.5 mm

Compact length enables space-saving integration in electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard operating conditions in commercial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for efficient processing and performance in microprocessor operations.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact design and efficient connectivity with other components.

Format: FLOATING POINT

Floating-point format enables efficient handling of decimal numbers and complex calculations.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 ensures safe handling and storage of the microprocessor in various environments.

Speed: 450 rpm

High-speed performance at 450 rpm for swift and responsive operation in demanding applications.

Technical Specifications

Microprocessors MPC8280CZUUPEA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B480

JESD-609 Code:

e0

Length:

37.5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

480

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA480,29X29,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Speed:

450 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

MPC8280CZUUPEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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