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AM1808EZWT4

Texas Instruments

AM1808EZWT4 by Texas Instruments

AM1808EZWT4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in industrial automation and embedded systems. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

Median Price

$18.056

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15 parts In-Stock

1+ parts

$10.670

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-

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15

$10.670

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Verical

USA . 15 parts In-Stock

1+ parts

$10.670

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-

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15

$10.670

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Texas Instruments

USA . 18,307 parts In-Stock

1+ parts

$14.512

100+ parts

$12.676

1k+ parts

$8.742

10k+ parts

-

18,307

$14.512

$12.676

$8.742

-

Chip1Stop

Japan . 386 parts In-Stock

1+ parts

$21.600

100+ parts

$12.100

1k+ parts

$10.900

10k+ parts

-

386

$21.600

$12.100

$10.900

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Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$25.090

100+ parts

$19.120

1k+ parts

$18.520

10k+ parts

-

63

$25.090

$19.120

$18.520

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DigiKey

USA . 30 parts In-Stock

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$25.090

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30

$25.090

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,367 parts In-Stock

1+ parts

$12.262

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-

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1,367

$12.262

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Bristol Electronics

USA . 80 parts In-Stock

1+ parts

$14.246

100+ parts

$10.400

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80

$14.246

$10.400

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Vyrian

USA . 6,265 parts In-Stock

1+ parts

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6,265

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VNN

France . 600 parts In-Stock

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600

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Sensible Micro Corp

USA . 295 parts In-Stock

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295

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Cyclops Electronics Ltd

UK . 295 parts In-Stock

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295

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ComSIT Distribution GmbH

Germany . 221 parts In-Stock

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221

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Dan-Mar Components

USA . 80 parts In-Stock

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80

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,344 parts In-Stock

1+ parts

$7.560

100+ parts

$7.371

1k+ parts

$7.333

10k+ parts

-

4,344

$7.560

$7.371

$7.333

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Corohmni

South Africa . 6 parts In-Stock

1+ parts

$11.208

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6

$11.208

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Corphita

USA . 1,229 parts In-Stock

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$11.616

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1,229

$11.616

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Ampacity Inc.

Singapore . 4,351 parts In-Stock

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$16.450

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4,351

$16.450

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Parana Technologies

USA . 1,330 parts In-Stock

1+ parts

$25.630

100+ parts

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$26.236

10k+ parts

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1,330

$25.630

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$26.236

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DigiPath Technology Company

USA . 568 parts In-Stock

1+ parts

$28.222

100+ parts

$25.964

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568

$28.222

$25.964

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ChromeModa Solutions

Germany . 3,734 parts In-Stock

1+ parts

$28.798

100+ parts

$23.614

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3,734

$28.798

$23.614

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IDEA Electronic Components Group

UK . 2,199 parts In-Stock

1+ parts

$28.798

100+ parts

$27.358

1k+ parts

$25.918

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2,199

$28.798

$27.358

$25.918

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Lixinc

USA . 9,468 parts In-Stock

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9,468

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Continental Prestige Electronics

USA . 5,957 parts In-Stock

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5,957

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Argo Parts USA

USA . 4,802 parts In-Stock

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4,802

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the power of cutting-edge technology with the AM1808EZWT4 microprocessor by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance and reliability in every device they create. Ideal for a wide range of applications, this microprocessor offers seamless integration, high-speed processing, and low power consumption. Unlock new possibilities and enhance your projects with the AM1808EZWT4 - the perfect solution for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the microprocessor, ensuring reliability and longevity.

Integrated Cache: YES

Enhances the processing speed by storing frequently accessed data for quick retrieval, improving overall performance.

Maximum Supply Voltage: 1.35 V

Allows for efficient power usage while maintaining stable operation.

Address Bus Width: 23

Supports a large memory address space, enabling the processor to access and process data from a wide range of sources.

No. of Terminals: 361

Provides ample connectivity options for integrating the microprocessor into various devices and systems.

Minimum Operating Temperature: 0 °C

Ensures reliable operation even in cold environments, making it suitable for a range of applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient processing and optimized performance.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high speed operation.

Technical Specifications

Microprocessors AM1808EZWT4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1808EZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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