Loading...

AM1806BZWTA3

Texas Instruments

AM1806BZWTA3 by Texas Instruments

AM1806BZWTA3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, making it suitable for low power applications in various industries such as automotive and industrial automation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,472

-

-

-

-

Digiode

USA . 1,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,553

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 279 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

279

$7.000

-

-

-

One Stop Electronics

USA . 1,208 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,208

$8.000

-

-

-

Native Components

USA . 935 parts In-Stock

1+ parts

$13.550

100+ parts

-

1k+ parts

-

10k+ parts

-

935

$13.550

-

-

-

AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$14.200

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$14.200

-

-

-

Northwest PG Solutions

USA . 308 parts In-Stock

1+ parts

$14.905

100+ parts

$13.415

1k+ parts

-

10k+ parts

-

308

$14.905

$13.415

-

-

Parana Technologies

USA . 2,240 parts In-Stock

1+ parts

$45.377

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

$45.377

-

-

-

DigiPath Technology Company

USA . 640 parts In-Stock

1+ parts

$49.965

100+ parts

$45.968

1k+ parts

-

10k+ parts

-

640

$49.965

$45.968

-

-

ChromeModa Solutions

Germany . 5,077 parts In-Stock

1+ parts

$50.985

100+ parts

$41.808

1k+ parts

-

10k+ parts

-

5,077

$50.985

$41.808

-

-

IDEA Electronic Components Group

UK . 1,251 parts In-Stock

1+ parts

$50.985

100+ parts

$48.436

1k+ parts

$45.886

10k+ parts

-

1,251

$50.985

$48.436

$45.886

-

Component Stockers USA

USA . 390 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,115

-

-

-

-

Corphita

USA . 1,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

-

-

-

-

Microchip USA

USA . 1,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,393

-

-

-

-

Overview

Experience the exceptional quality and performance of the Texas Instruments AM1806BZWTA3 microprocessor. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology with integrated cache and boundary scan capabilities. Ideal for a variety of applications, this microprocessor offers customers unmatched value and benefits, including low power mode and a maximum clock frequency of 30 MHz. Trust in Texas Instruments to provide you with reliable, high-quality solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microprocessor lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache helps in reducing memory access times, improving overall performance of the microprocessor.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for efficient power consumption while ensuring stable performance.

Address Bus Width: 23

A wider address bus width of 23 allows for efficient handling of memory addresses, improving the overall speed and performance of the microprocessor.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space and facilitates easier integration into electronic devices.

Bit Size: 32

A bit size of 32 enables the microprocessor to handle and process data in 32-bit pieces, enhancing the computational capabilities.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options allows for flexibility in different applications and power requirements.

No. of Terminals: 361

The high number of terminals allows for connection to various external components and peripherals, enhancing the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch provides reliability, compactness, and ease of mounting in electronic circuits.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures operational stability even at lower power levels.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier PCB layout and better heat dissipation.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm enables a slim profile design for devices using the microprocessor.

Width: 16 mm

A width of 16 mm allows for compact placement and efficient use of space in electronic devices.

Boundary Scan: YES

Having boundary scan capability enables easy testing and debugging of the microprocessor during production.

External Data Bus Width: 16

An external data bus width of 16 allows for quick data transfer between the microprocessor and external memory or peripherals.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, the microprocessor can handle high-speed operations and real-time processing tasks.

Length: 16 mm

A length of 16 mm contributes to the compact size and efficient placement of the microprocessor in electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for faster and more efficient processing of instructions, improving overall performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the microprocessor reliable and energy-efficient.

Terminal Form: BALL

Using ball terminal forms simplifies the mounting process and enhances the reliability of the connections.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides a stable operating voltage for the microprocessor, ensuring consistent performance.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for closer spacing of terminals, enabling higher density and more intricate circuit designs.

Format: FIXED POINT

Operating in fixed-point format allows for faster arithmetic operations and more efficient use of computational resources.

Speed: 375 rpm

Having a speed of 375 rpm indicates the processing capability and efficiency of the microprocessor in handling tasks.

Low Power Mode: YES

The availability of a low power mode allows for energy conservation during idle or low-usage periods, enhancing overall power efficiency.

Technical Specifications

Microprocessors AM1806BZWTA3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806BZWTA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19