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AM1806BZWT4

Texas Instruments

AM1806BZWT4 by Texas Instruments

AM1806BZWT4 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 30 MHz. It features an address bus width of 23 and external data bus width of 16, suitable for low power mode applications in various industries. The package style is grid array with a terminal pitch of 0.8 mm, making it ideal for compact designs requiring high processing speeds.

Median Price

$16.530

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 29,080 parts In-Stock

1+ parts

-

100+ parts

$16.530

1k+ parts

-

10k+ parts

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29,080

-

$16.530

-

-

Rochester

USA . 27,815 parts In-Stock

1+ parts

-

100+ parts

$14.300

1k+ parts

$12.790

10k+ parts

$12.040

27,815

-

$14.300

$12.790

$12.040

Verical

USA . 16,050 parts In-Stock

1+ parts

-

100+ parts

$17.875

1k+ parts

$15.988

10k+ parts

$15.050

16,050

-

$17.875

$15.988

$15.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,576 parts In-Stock

1+ parts

$15.096

100+ parts

-

1k+ parts

-

10k+ parts

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4,576

$15.096

-

-

-

Vyrian

USA . 2,177 parts In-Stock

1+ parts

$15.890

100+ parts

-

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-

10k+ parts

-

2,177

$15.890

-

-

-

DigiKey Marketplace

USA . 29,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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29,725

-

-

-

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Cyclops Electronics Ltd

UK . 25 parts In-Stock

1+ parts

-

100+ parts

-

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25

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 28,662 parts In-Stock

1+ parts

$13.510

100+ parts

-

1k+ parts

-

10k+ parts

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28,662

$13.510

-

-

-

Corphita

USA . 4,912 parts In-Stock

1+ parts

$14.301

100+ parts

-

1k+ parts

-

10k+ parts

-

4,912

$14.301

-

-

-

Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

$62.615

100+ parts

-

1k+ parts

-

10k+ parts

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1,317

$62.615

-

-

-

DigiPath Technology Company

USA . 526 parts In-Stock

1+ parts

$68.947

100+ parts

$63.431

1k+ parts

-

10k+ parts

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526

$68.947

$63.431

-

-

ChromeModa Solutions

Germany . 6,151 parts In-Stock

1+ parts

$70.354

100+ parts

$57.690

1k+ parts

-

10k+ parts

-

6,151

$70.354

$57.690

-

-

IDEA Electronic Components Group

UK . 1,489 parts In-Stock

1+ parts

$70.354

100+ parts

$66.836

1k+ parts

$63.319

10k+ parts

-

1,489

$70.354

$66.836

$63.319

-

Microchip USA

USA . 6,284 parts In-Stock

1+ parts

-

100+ parts

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6,284

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QUARKTWIN TECHNOLOGY LTD

USA . 5,229 parts In-Stock

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5,229

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Northwest PG Solutions

USA . 2,246 parts In-Stock

1+ parts

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2,246

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,000

-

-

-

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Native Components

USA . 451 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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451

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Overview

Discover the cutting-edge AM1806BZWT4 microprocessor by Texas Instruments, setting the standard for quality and innovation in the industry. With advanced features like integrated cache and low power mode, this versatile chip is perfect for a variety of applications. From embedded systems to IoT devices, this powerful processor delivers unparalleled performance and efficiency. Trust Texas Instruments to provide top-notch technology that exceeds expectations. Elevate your projects with the AM1806BZWT4 and experience the ultimate in reliability and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by allowing for faster access to frequently used data.

Maximum Supply Voltage: 1.35 V

A higher maximum supply voltage allows for more flexibility in power management and optimization.

Address Bus Width: 23

With a wider address bus width, the microprocessor can handle larger amounts of memory, improving overall performance.

Package Shape: SQUARE

The square package shape allows for easier installation and compatibility with various systems.

Bit Size: 32

A larger bit size allows for more data to be processed at once, leading to improved efficiency.

Power Supplies (V): 1.3, 1.8, 3.3

Having multiple power supply options gives users flexibility in system design and power consumption.

No. of Terminals: 361

With a high number of terminals, the microprocessor can support a variety of connections and peripherals.

Maximum Operating Temperature: 90 °C

A high maximum operating temperature ensures that the microprocessor can perform reliably even under intense conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of environments without risking damage.

Technical Specifications

Microprocessors AM1806BZWT4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806BZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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