Loading...

AM1806EZWT4

Texas Instruments

AM1806EZWT4 by Texas Instruments

AM1806EZWT4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and industrial automation.

Median Price

$17.622

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 210 parts In-Stock

1+ parts

$13.195

100+ parts

$11.526

1k+ parts

$7.949

10k+ parts

-

210

$13.195

$11.526

$7.949

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$22.050

100+ parts

$13.480

1k+ parts

$13.110

10k+ parts

-

4

$22.050

$13.480

$13.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,928 parts In-Stock

1+ parts

$12.535

100+ parts

-

1k+ parts

-

10k+ parts

-

3,928

$12.535

-

-

-

Vyrian

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,512

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,205 parts In-Stock

1+ parts

$11.876

100+ parts

-

1k+ parts

-

10k+ parts

-

4,205

$11.876

-

-

-

Parana Technologies

USA . 2,197 parts In-Stock

1+ parts

$58.963

100+ parts

-

1k+ parts

-

10k+ parts

-

2,197

$58.963

-

-

-

IDEA Electronic Components Group

UK . 2,019 parts In-Stock

1+ parts

$66.251

100+ parts

$62.938

1k+ parts

$59.626

10k+ parts

-

2,019

$66.251

$62.938

$59.626

-

ChromeModa Solutions

Germany . 1,397 parts In-Stock

1+ parts

$66.251

100+ parts

$54.326

1k+ parts

-

10k+ parts

-

1,397

$66.251

$54.326

-

-

Lixinc

USA . 18,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,792

-

-

-

-

DigiPath Technology Company

USA . 1,366 parts In-Stock

1+ parts

-

100+ parts

$59.732

1k+ parts

-

10k+ parts

-

1,366

-

$59.732

-

-

Northwest PG Solutions

USA . 761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

761

-

-

-

-

Native Components

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Overview

Experience the power of innovation with the AM1806EZWT4 microprocessor by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microprocessor offers integrated cache, low power mode, and a maximum clock frequency of 30 MHz. Unlock the potential of your projects with the AM1806EZWT4 and elevate your designs to the next level. Trust Texas Instruments to provide the solutions you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Improves performance by storing frequently accessed data, reducing access times.

Maximum Supply Voltage: 1.35 V

Allows for efficient power usage while providing enough voltage for optimal performance.

On Chip Data RAM Width: 8

Enables efficient data processing and storage on the chip itself, reducing latency.

Address Bus Width: 23

Supports a wide range of memory addresses, enabling the processor to access more data efficiently.

Package Shape: SQUARE

Optimizes space utilization and allows for easy integration into various devices.

Bit Size: 32

Offers a good balance between performance and power efficiency for a variety of computing tasks.

No. of Terminals: 361

Provides extensive connectivity options for interfacing with external devices and components.

RAM Words: 172032

Ample onboard memory for storing and manipulating data, reducing the need for external memory.

Peripheral IC Type: MICROPROCESSOR, RISC

Uses Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high speed operation.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, increasing reliability in various environments.

Technical Specifications

Microprocessors AM1806EZWT4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806EZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19