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AM1802EZCED3

Texas Instruments

AM1802EZCED3 by Texas Instruments

AM1802EZCED3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array with 361 terminals, making it ideal for compact designs in harsh environments.

Median Price

$12.551

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,327 parts In-Stock

1+ parts

$12.052

100+ parts

$10.527

1k+ parts

$7.260

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-

12,327

$12.052

$10.527

$7.260

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Rochester

USA . 73,355 parts In-Stock

1+ parts

-

100+ parts

$10.440

1k+ parts

$9.340

10k+ parts

$8.790

73,355

-

$10.440

$9.340

$8.790

DigiKey

USA . 73,355 parts In-Stock

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-

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$13.740

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73,355

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$13.740

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Verical

USA . 62,038 parts In-Stock

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100+ parts

$13.050

1k+ parts

$11.675

10k+ parts

$10.988

62,038

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$13.050

$11.675

$10.988

Distributors (In-Stock)

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Digiode

USA . 1,284 parts In-Stock

1+ parts

$9.576

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1,284

$9.576

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Vyrian

USA . 1,973 parts In-Stock

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$10.080

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1,973

$10.080

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VNN

France . 1,240 parts In-Stock

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1,240

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Elcom Components

USA . 449 parts In-Stock

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449

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 55,170 parts In-Stock

1+ parts

$8.570

100+ parts

-

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55,170

$8.570

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Semicontronic

India . 54,950 parts In-Stock

1+ parts

$8.570

100+ parts

$8.356

1k+ parts

$8.313

10k+ parts

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54,950

$8.570

$8.356

$8.313

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Corphita

USA . 4,854 parts In-Stock

1+ parts

$9.072

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4,854

$9.072

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Corohmni

South Africa . 119 parts In-Stock

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$9.990

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119

$9.990

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Parana Technologies

USA . 1,141 parts In-Stock

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$54.278

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1,141

$54.278

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DigiPath Technology Company

USA . 84 parts In-Stock

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$59.766

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84

$59.766

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ChromeModa Solutions

Germany . 3,422 parts In-Stock

1+ parts

$60.986

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$50.009

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3,422

$60.986

$50.009

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IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$60.986

100+ parts

$57.937

1k+ parts

$54.887

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180

$60.986

$57.937

$54.887

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QUARKTWIN TECHNOLOGY LTD

USA . 7,992 parts In-Stock

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Continental Prestige Electronics

USA . 3,038 parts In-Stock

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3,038

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Argo Parts USA

USA . 2,406 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Emar International I/E

Canada . 277 parts In-Stock

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277

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Overview

Elevate your projects with the AM1802EZCED3 by Texas Instruments, a top-of-the-line microprocessor that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this chip is designed to meet the demands of a wide range of applications. With integrated cache, low power mode, and an industrial temperature grade, this microprocessor delivers exceptional performance and efficiency. Say goodbye to limitations and hello to endless possibilities with the AM1802EZCED3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microprocessor packages for its durability and cost-effectiveness.

Integrated Cache: YES

Having integrated cache helps improve the performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power management and regulation for different use cases.

On Chip Data RAM Width: 8

Having a wide data RAM width enables the microprocessor to handle larger chunks of data efficiently.

Address Bus Width: 23

A wider address bus width allows the microprocessor to access a larger memory space, enhancing its capability to handle complex tasks.

Package Shape: SQUARE

The square package shape is conducive to efficient layout and placement on circuit boards, optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, this microprocessor is capable of handling data in 32-bit chunks, which is advantageous for processing speed and efficiency.

No. of Terminals: 361

The high number of terminals allows for robust connectivity and communication with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style enables a compact design, low profile for space-constrained applications, and fine pitch for high-density interconnectivity.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and enhancing energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for the microprocessor to function effectively in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy mounting and soldering onto the circuit board.

Maximum Seated Height: 1.3 mm

The low maximum seated height is beneficial for applications where space constraints are a concern.

RAM Words: 172032

The large RAM capacity enables the microprocessor to store and access a significant amount of data simultaneously, enhancing overall performance.

Width: 13 mm

The compact width of the microprocessor makes it suitable for integration into compact electronic devices.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process.

External Data Bus Width: 16

The wide external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency enables the microprocessor to execute instructions at a faster rate, improving overall processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

The short time duration at peak reflow temperature minimizes the risk of thermal damage during assembly and rework processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the reliability of the microprocessor during the manufacturing process.

Length: 13 mm

The compact length of the microprocessor contributes to its versatility and suitability for a wide range of electronic applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade means that this microprocessor is designed to operate reliably in harsh industrial environments with extended temperature ranges.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of this microprocessor enhances its processing efficiency and speed for various computing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making this microprocessor energy-efficient and versatile.

Terminal Form: BALL

Having ball terminals facilitates easy and reliable connections during surface mounting onto the circuit board.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable performance of the microprocessor under normal operating conditions.

No. of DMA Channels: 80

The high number of DMA channels allows for efficient data transfer and processing between the microprocessor and peripheral devices, improving system performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch enables high-density mounting on the circuit board, optimizing space utilization and connectivity.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances overall computational efficiency of the microprocessor.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this microprocessor has a moderate level of moisture sensitivity during storage and handling, requiring standard precautions in manufacturing processes.

Speed: 300 rpm

The high speed capability of the microprocessor facilitates quick data processing and execution of instructions, leading to improved system performance.

Low Power Mode: YES

The availability of a low-power mode enhances energy efficiency and extends battery life in mobile and portable electronic devices powered by this microprocessor.

Technical Specifications

Microprocessors AM1802EZCED3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.3 mm

Speed:

300 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1802EZCED3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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