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AM1806EZCED4

Texas Instruments

AM1806EZCED4 by Texas Instruments

AM1806EZCED4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and high-speed processing. The package style is grid array, making it ideal for compact designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,142 parts In-Stock

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8,142

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Digiode

USA . 2,914 parts In-Stock

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2,914

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Distributors (Availability)

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One Stop Electronics

USA . 1,320 parts In-Stock

1+ parts

$9.000

100+ parts

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1,320

$9.000

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$9.513

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-

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514

$9.513

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Native Components

USA . 134 parts In-Stock

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$9.605

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134

$9.605

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Northwest PG Solutions

USA . 541 parts In-Stock

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$10.565

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$9.509

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541

$10.565

$9.509

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Corohmni

South Africa . 33 parts In-Stock

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$17.663

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33

$17.663

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$33.230

100+ parts

$30.239

1k+ parts

$27.249

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2,000

$33.230

$30.239

$27.249

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Parana Technologies

USA . 2,229 parts In-Stock

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$40.225

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$40.225

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Microchip USA

USA . 449 parts In-Stock

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$43.270

100+ parts

$42.660

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$42.350

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$42.040

449

$43.270

$42.660

$42.350

$42.040

DigiPath Technology Company

USA . 1,441 parts In-Stock

1+ parts

$44.293

100+ parts

$40.750

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1,441

$44.293

$40.750

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ChromeModa Solutions

Germany . 4,609 parts In-Stock

1+ parts

$45.197

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$37.062

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4,609

$45.197

$37.062

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$45.197

100+ parts

$42.937

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$40.677

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2,182

$45.197

$42.937

$40.677

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Corphita

USA . 4,264 parts In-Stock

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4,264

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Overview

Experience unmatched performance and reliability with the AM1806EZCED4 by Texas Instruments, a leading manufacturer of cutting-edge microprocessors. This powerful device offers integrated cache, low power mode, and a wide range of applications in various industries. With its high-quality construction and advanced technology, this microprocessor provides exceptional value, efficiency, and versatility to meet all your computing needs. Discover the endless possibilities with the AM1806EZCED4 and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the overall weight of the product low.

Integrated Cache: YES

The presence of integrated cache helps in improving the performance of the microprocessor by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.35 V

Allows for a higher voltage range, which can be beneficial for applications requiring more power.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and simplifying the manufacturing process.

Address Bus Width: 23

Provides a wide address bus width, allowing for access to a larger memory space.

Bit Size: 32

High bit size allows for processing a larger amount of data at once, improving overall performance.

Maximum Operating Temperature: 90 °C

Can operate efficiently at high temperatures, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers reduced complexity, improved performance, and lower power consumption.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Technical Specifications

Microprocessors AM1806EZCED4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1806EZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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