Loading...

AM1806BZCED4

Texas Instruments

AM1806BZCED4 by Texas Instruments

AM1806BZCED4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, making it suitable for industrial applications requiring low power consumption and high processing speed. With a package style of grid array and terminal finish of tin silver copper, this processor offers reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,309

-

-

-

-

Digiode

USA . 1,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,111 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,111

$1.000

-

-

-

Native Components

USA . 520 parts In-Stock

1+ parts

$7.860

100+ parts

-

1k+ parts

-

10k+ parts

-

520

$7.860

-

-

-

Northwest PG Solutions

USA . 1,201 parts In-Stock

1+ parts

$8.646

100+ parts

$7.781

1k+ parts

-

10k+ parts

-

1,201

$8.646

$7.781

-

-

AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$12.110

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$12.110

-

-

-

Parana Technologies

USA . 98 parts In-Stock

1+ parts

$37.477

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$37.477

-

-

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$41.267

100+ parts

$37.965

1k+ parts

-

10k+ parts

-

1,453

$41.267

$37.965

-

-

ChromeModa Solutions

Germany . 5,753 parts In-Stock

1+ parts

$42.109

100+ parts

$34.529

1k+ parts

-

10k+ parts

-

5,753

$42.109

$34.529

-

-

IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$42.109

100+ parts

$40.004

1k+ parts

$37.898

10k+ parts

-

1,890

$42.109

$40.004

$37.898

-

Corphita

USA . 3,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,965

-

-

-

-

Microchip USA

USA . 453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

453

-

-

-

-

Overview

Experience the next level of performance with the AM1806BZCED4 microprocessor by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this one, featuring integrated cache and low power mode for optimal efficiency. Ideal for industrial applications, this microprocessor offers a wide range of power supplies and a maximum clock frequency of 30 MHz, ensuring smooth operation even in challenging environments. Upgrade your systems with the AM1806BZCED4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing data access times, making it faster and more efficient.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and making the overall design more compact.

Maximum Supply Voltage: 1.35 V

The maximum supply voltage ensures safe operation of the microprocessor within specified limits, preventing damage due to overvoltage.

Address Bus Width: 23

The wide address bus width allows the microprocessor to access a large memory space efficiently, enhancing its capability to handle complex tasks.

Package Shape: SQUARE

The square package shape provides easy handling and installation, making it convenient for integration into various electronic devices.

Bit Size: 32

With a 32-bit architecture, the microprocessor can process and manage data in larger chunks, leading to better performance and faster operation.

Power Supplies (V): 1.3, 1.8, 3.3

Having multiple power supply options allows flexibility in design and operation, enabling compatibility with different power sources and voltage requirements.

No. of Terminals: 361

The high number of terminals provides connectivity options for various inputs and outputs, allowing for versatile use in different electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers a compact design with a fine pitch, making it suitable for high-density mounting on PCBs, saving space and improving overall system performance.

Minimum Supply Voltage: 1.25 V

The minimum supply voltage ensures reliable operation of the microprocessor at lower power levels, optimizing energy efficiency and reducing heat generation.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can withstand harsh environmental conditions, ensuring reliable performance in a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the microprocessor suitable for use in various industrial and automotive applications, where temperature fluctuations can occur.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term durability of the microprocessor.

Terminal Position: BOTTOM

Having the terminals at the bottom facilitates easy soldering and mounting on a PCB, simplifying the assembly process and ensuring proper electrical connections.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for a slim profile and compact design, making the microprocessor suitable for space-constrained applications.

Width: 16 mm

The compact width of the microprocessor enables easy integration into electronic devices with limited space, offering flexibility in design and layout.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 16

The external data bus width of 16 bits allows for efficient data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency enables fast data processing and execution of instructions, making the microprocessor suitable for applications requiring real-time responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and mounting of the microprocessor on a PCB, preventing damage and ensuring reliable operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure and durable soldering of the microprocessor on a PCB, ensuring long-term stability and performance.

Length: 16 mm

The compact length of the microprocessor enables easy integration into electronic devices with limited space, offering flexibility in design and layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation ensures that the microprocessor can operate reliably in harsh industrial environments, withstanding temperature fluctuations and environmental stresses.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction sets and faster execution, making it ideal for high-performance computing and embedded systems.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption and high speed operation, making it energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy assembly, ensuring secure mounting of the microprocessor on a PCB without soldering issues.

Nominal Supply Voltage: 1.3 V

Having a stable nominal supply voltage ensures consistent performance and reliability of the microprocessor, meeting operational requirements without voltage fluctuations.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting of the microprocessor on a PCB, saving space and enabling compact design solutions.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and improves computation efficiency, making the microprocessor suitable for applications requiring precise calculations.

Moisture Sensitivity Level (MSL): 3

The MSL level indicates the microprocessor's sensitivity to moisture during storage and handling, ensuring proper precautions are taken to prevent moisture-related damage.

Speed: 456 rpm

The high speed of the microprocessor enables fast data processing and execution of instructions, making it suitable for high-performance computing tasks.

Low Power Mode: YES

The availability of a low-power mode allows for energy-efficient operation of the microprocessor, reducing power consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors AM1806BZCED4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806BZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19