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AM1806EZWTD4

Texas Instruments

AM1806EZWTD4 by Texas Instruments

AM1806EZWTD4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 23-bit address bus width. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and high-speed processing. The package style is grid array, making it ideal for compact designs with a terminal pitch of 0.8 mm.

Median Price

$15.028

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 863 parts In-Stock

1+ parts

$15.028

100+ parts

$13.127

1k+ parts

$9.053

10k+ parts

-

863

$15.028

$13.127

$9.053

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 246 parts In-Stock

1+ parts

$14.277

100+ parts

-

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246

$14.277

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Vyrian

USA . 7,812 parts In-Stock

1+ parts

-

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-

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7,812

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Distributors (Availability)

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Ampacity Inc.

Singapore . 488 parts In-Stock

1+ parts

$12.770

100+ parts

-

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488

$12.770

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Corphita

USA . 2,837 parts In-Stock

1+ parts

$13.525

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-

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2,837

$13.525

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$16.080

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-

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221

$16.080

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Native Components

USA . 902 parts In-Stock

1+ parts

$41.424

100+ parts

-

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10k+ parts

$39.768

902

$41.424

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-

$39.768

Parana Technologies

USA . 2,102 parts In-Stock

1+ parts

$43.838

100+ parts

-

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2,102

$43.838

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Northwest PG Solutions

USA . 1,307 parts In-Stock

1+ parts

$45.567

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1,307

$45.567

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DigiPath Technology Company

USA . 472 parts In-Stock

1+ parts

$48.271

100+ parts

-

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472

$48.271

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ChromeModa Solutions

Germany . 3,806 parts In-Stock

1+ parts

$49.256

100+ parts

$40.390

1k+ parts

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3,806

$49.256

$40.390

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$49.256

100+ parts

$46.793

1k+ parts

$44.330

10k+ parts

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266

$49.256

$46.793

$44.330

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Lixinc

USA . 17,874 parts In-Stock

1+ parts

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17,874

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Component Stockers USA

USA . 1,107 parts In-Stock

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1,107

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Overview

Experience unparalleled performance and reliability with the AM1806EZWTD4 by Texas Instruments, a leading manufacturer in the industry. This microprocessor boasts integrated cache, surface mount capability, and a wide address bus width, making it perfect for a variety of applications. From industrial to consumer electronics, this product offers superior value and benefits to customers seeking cutting-edge technology. Trust in Texas Instruments to deliver top-notch quality and innovation with the AM1806EZWTD4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a balance of strength and flexibility, making the product durable and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the processing speeds and efficiencies of the microprocessor.

Maximum Supply Voltage: 1.35 V

Operating at a relatively low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 23

A wider address bus width allows for larger memory addressing capability, enhancing the overall performance of the microprocessor.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature tolerance ensures the product can withstand varying environmental conditions without performance degradation.

No. of Terminals: 361

Having a high number of terminals allows for a greater degree of connectivity options and functionality in the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture typically leads to faster execution times and improved performance, making it an ideal choice for a microprocessor.

Technology: CMOS

Being based on CMOS technology offers low power consumption and faster switching speeds, contributing to energy efficiency and performance.

Technical Specifications

Microprocessors AM1806EZWTD4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1806EZWTD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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