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AM1806EZCEA3

Texas Instruments

AM1806EZCEA3 by Texas Instruments

AM1806EZCEA3 by Texas Instruments is a 32-bit microprocessor with integrated cache, 23-bit address bus width, and 16-bit external data bus width. It is used in industrial applications for its low power mode, max clock frequency of 30 MHz, and boundary scan capability.

Median Price

$14.532

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,242 parts In-Stock

1+ parts

$14.884

100+ parts

$13.001

1k+ parts

$8.966

10k+ parts

-

2,242

$14.884

$13.001

$8.966

-

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$14.180

1k+ parts

$12.690

10k+ parts

$11.940

3

-

$14.180

$12.690

$11.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,317 parts In-Stock

1+ parts

$11.828

100+ parts

-

1k+ parts

-

10k+ parts

-

4,317

$11.828

-

-

-

Vyrian

USA . 7,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,675

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,652 parts In-Stock

1+ parts

$11.205

100+ parts

-

1k+ parts

-

10k+ parts

-

4,652

$11.205

-

-

-

Corohmni

South Africa . 205 parts In-Stock

1+ parts

$12.992

100+ parts

-

1k+ parts

-

10k+ parts

-

205

$12.992

-

-

-

AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$15.070

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$15.070

-

-

-

Advanced Electronics

New Zealand . 32 parts In-Stock

1+ parts

$17.458

100+ parts

$15.887

1k+ parts

$14.316

10k+ parts

-

32

$17.458

$15.887

$14.316

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Native Components

USA . 775 parts In-Stock

1+ parts

$23.832

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$23.832

-

-

-

Northwest PG Solutions

USA . 153 parts In-Stock

1+ parts

$26.215

100+ parts

$23.594

1k+ parts

-

10k+ parts

-

153

$26.215

$23.594

-

-

Parana Technologies

USA . 36 parts In-Stock

1+ parts

$35.142

100+ parts

$3,263.435

1k+ parts

$31.627

10k+ parts

-

36

$35.142

$3,263.435

$31.627

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$38.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,837

$38.695

-

-

-

ChromeModa Solutions

Germany . 3,688 parts In-Stock

1+ parts

$39.485

100+ parts

$32.378

1k+ parts

-

10k+ parts

-

3,688

$39.485

$32.378

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-

IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$39.485

100+ parts

$37.511

1k+ parts

$35.536

10k+ parts

-

456

$39.485

$37.511

$35.536

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Overview

Experience the cutting-edge technology of Texas Instruments with the AM1806EZCEA3 microprocessor. This high-quality product boasts integrated cache, a wide address bus width, and low power mode, making it perfect for a variety of industrial applications. With a maximum clock frequency of 30 MHz and a compact package style, this microprocessor offers superior performance and efficiency. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Elevate your projects with the AM1806EZCEA3 microprocessor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage ensures stable operation and performance of the microprocessor within safe limits.

Surface Mount: YES

Being surface mountable makes the microprocessor easy to mount on circuit boards, saving space and facilitating mass production.

Address Bus Width: 23

A wider address bus width allows the microprocessor to access a larger memory space, enhancing its processing capabilities.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency ensures fast data processing and execution of instructions, making the microprocessor efficient for various tasks.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the microprocessor in a wide range of temperature conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term operation.

Technical Specifications

Microprocessors AM1806EZCEA3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

172032

Maximum Seated Height:

1.3 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1806EZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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