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AM3356BZCZA60

Texas Instruments

AM3356BZCZA60 by Texas Instruments

AM3356BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capabilities. With a temperature range from -40 to 105 °C, it offers high performance in compact square package style.

Median Price

$14.615

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,370 parts In-Stock

1+ parts

$14.615

100+ parts

$12.766

1k+ parts

$8.804

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2,370

$14.615

$12.766

$8.804

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Distributors (In-Stock)

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Digiode

USA . 2,534 parts In-Stock

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$13.884

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2,534

$13.884

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TME

Poland . 5,670 parts In-Stock

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$17.040

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5,670

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$17.040

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Vyrian

USA . 4,482 parts In-Stock

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VNN

France . 3,104 parts In-Stock

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Chip Stock

USA . 3,037 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,964 parts In-Stock

1+ parts

$12.420

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1,964

$12.420

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Semicontronic

India . 1,898 parts In-Stock

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$12.420

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$12.110

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$12.047

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1,898

$12.420

$12.110

$12.047

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Corphita

USA . 3,490 parts In-Stock

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$13.154

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3,490

$13.154

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Corohmni

South Africa . 544 parts In-Stock

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$20.978

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$20.978

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AZTECH Wire

Italy . 404 parts In-Stock

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$21.190

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$21.190

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Parana Technologies

USA . 760 parts In-Stock

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$58.403

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760

$58.403

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$61.820

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$58.729

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$58.729

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$61.820

$58.729

$58.729

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DigiPath Technology Company

USA . 96 parts In-Stock

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$64.309

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96

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IDEA Electronic Components Group

UK . 1,571 parts In-Stock

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$65.621

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$62.340

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$59.059

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1,571

$65.621

$62.340

$59.059

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ChromeModa Solutions

Germany . 391 parts In-Stock

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$65.621

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$53.809

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391

$65.621

$53.809

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iodParts Technologies Inc.

India . 8,025 parts In-Stock

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Lixinc

USA . 3,330 parts In-Stock

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Continental Prestige Electronics

USA . 3,239 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,598 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 500 parts In-Stock

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Futuretech Components

Singapore . 480 parts In-Stock

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Perfect Parts

USA . 259 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments AM3356BZCZA60 microprocessor. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microprocessor delivers high-speed processing and low power consumption, setting a new standard in efficiency and functionality. Trust in Texas Instruments to provide top-quality solutions that empower your designs and elevate your projects to new heights. Experience the difference with the AM3356BZCZA60 microprocessor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

With integrated cache, this microprocessor can access frequently used data quickly, improving overall performance and efficiency.

Surface Mount: YES

Being surface mountable, this microprocessor is easy to install on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.144 V

The low maximum supply voltage of 1.144 V ensures energy efficiency and reduces the risk of overheating in the system.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width allows for efficient data processing and storage, enhancing the microprocessor's speed and performance.

Address Bus Width: 28

With a wide address bus width of 28 bits, this microprocessor can access a large memory space, making it suitable for handling complex computing tasks.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easy to integrate this microprocessor into various electronic devices.

Bit Size: 32

The 32-bit architecture of this microprocessor allows for processing larger chunks of data at a time, resulting in faster operation and improved performance.

Power Supplies (V): 0.95/1.1

The multiple power supply options of 0.95V and 1.1V offer flexibility in designing power-efficient systems with this microprocessor.

No. of Terminals: 324

The high number of terminals (324) provides ample connectivity options for peripherals and external devices, expanding the functionality of the microprocessor.

Technical Specifications

Microprocessors AM3356BZCZA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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