Loading...

AM3351BZCE60

Texas Instruments

AM3351BZCE60 by Texas Instruments

AM3351BZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With 64 DMA channels and boundary scan support, it is ideal for embedded systems requiring high-speed data processing.

Median Price

$9.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,321 parts In-Stock

1+ parts

$10.214

100+ parts

$8.922

1k+ parts

$6.153

10k+ parts

-

3,321

$10.214

$8.922

$6.153

-

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.907

10k+ parts

-

2,400

-

-

$7.907

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 909 parts In-Stock

1+ parts

$9.703

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$9.703

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$12.030

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$12.030

-

-

-

VNN

France . 30,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,757

-

-

-

-

Bristol Electronics

USA . 2,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,993

-

-

-

-

Vyrian

USA . 2,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

-

-

-

-

Chip Stock

USA . 1,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,762 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,762

$6.720

-

-

-

Semicontronic

India . 2,712 parts In-Stock

1+ parts

$6.720

100+ parts

$6.552

1k+ parts

$6.518

10k+ parts

-

2,712

$6.720

$6.552

$6.518

-

Corphita

USA . 4,871 parts In-Stock

1+ parts

$9.193

100+ parts

-

1k+ parts

-

10k+ parts

-

4,871

$9.193

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$11.789

100+ parts

-

1k+ parts

$11.318

10k+ parts

-

100

$11.789

-

$11.318

-

Continental Prestige Electronics

USA . 6,769 parts In-Stock

1+ parts

$12.030

100+ parts

-

1k+ parts

-

10k+ parts

$11.789

6,769

$12.030

-

-

$11.789

AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$19.800

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$19.800

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$36.405

100+ parts

$34.585

1k+ parts

$34.585

10k+ parts

-

40

$36.405

$34.585

$34.585

-

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$45.274

100+ parts

$4,204.406

1k+ parts

$40.747

10k+ parts

-

1,865

$45.274

$4,204.406

$40.747

-

DigiPath Technology Company

USA . 688 parts In-Stock

1+ parts

$49.853

100+ parts

-

1k+ parts

-

10k+ parts

-

688

$49.853

-

-

-

ChromeModa Solutions

Germany . 676 parts In-Stock

1+ parts

$50.870

100+ parts

$41.713

1k+ parts

-

10k+ parts

-

676

$50.870

$41.713

-

-

IDEA Electronic Components Group

UK . 126 parts In-Stock

1+ parts

$50.870

100+ parts

$48.326

1k+ parts

$45.783

10k+ parts

-

126

$50.870

$48.326

$45.783

-

Corohmni

South Africa . 587 parts In-Stock

1+ parts

$61.913

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$61.913

-

-

-

Lixinc

USA . 18,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,100

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,415

-

-

-

-

Alle Elektronik GmbH

Germany . 3,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,610

-

-

-

-

Kepictronics

USA . 3,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,266

-

-

-

-

Argo Parts USA

USA . 1,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,741

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Discover the cutting-edge AM3351BZCE60 microprocessor from Texas Instruments, setting new standards in performance and reliability. With integrated cache and a 32-bit architecture, this device is perfect for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microprocessor delivers unmatched speed and efficiency. Trust Texas Instruments' reputation for quality and innovation to bring value to your projects with the AM3351BZCE60. Upgrade your designs today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the microprocessor, ensuring longevity and reliable performance.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by reducing memory access latency and speeding up data retrieval.

Maximum Supply Voltage: 1.144 V

Operating within a maximum supply voltage of 1.144 V ensures efficient power consumption and helps maintain stable performance.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the microprocessor can efficiently handle and process data, improving overall performance.

Address Bus Width: 16

A wider address bus width of 16 allows the microprocessor to access a larger memory space, enabling it to handle more data and perform complex tasks.

Package Shape: SQUARE

The square package shape provides a compact and space-efficient design, making it suitable for various electronic devices and applications.

Bit Size: 32

A bit size of 32 indicates the processing capability of the microprocessor, allowing it to handle 32 bits of data at a time and perform tasks efficiently.

No. of Terminals: 298

Having a higher number of terminals (298) allows for more connections and better integration with other components, enhancing the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch offers high density and reliability, making it suitable for compact and high-performance electronic devices.

Minimum Supply Voltage: 1.056 V

Operating within a minimum supply voltage of 1.056 V ensures power efficiency and stable performance under low power conditions.

Maximum Operating Temperature: 90 °C

The microprocessor can withstand high operating temperatures of up to 90°C, making it suitable for industrial and harsh environment applications.

Minimum Operating Temperature: 0 °C

The microprocessor can operate at minimum temperatures of 0°C, ensuring reliable performance in a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure mounting of the microprocessor on circuit boards, ensuring stable connections and efficient operation.

Maximum Seated Height: 1.3 mm

With a maximum seated height of 1.3 mm, the microprocessor can be easily integrated into slim and space-constrained devices, maintaining a compact design.

RAM Words: 131072

Having a large RAM capacity of 131072 words allows the microprocessor to store and manipulate a significant amount of data, facilitating multitasking and complex computations.

Width: 13 mm

With a width of 13 mm, the microprocessor offers a compact form factor, making it suitable for small electronic devices and applications where space is a constraint.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring quality control and reliability during the manufacturing process.

External Data Bus Width: 16

An external data bus width of 16 enables high-speed data transfer between the microprocessor and external components, improving overall system performance.

Maximum Clock Frequency: 26 MHz

With a maximum clock frequency of 26 MHz, the microprocessor can perform operations at a high speed, enabling quick data processing and efficient task execution.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for up to 30 seconds, providing durability and reliability during the soldering process.

Peak Reflow Temperature °C: 260

The microprocessor can handle peak reflow temperatures of 260°C, ensuring proper soldering and connection integrity during manufacturing.

Length: 13 mm

With a length of 13 mm, the microprocessor maintains a compact size, making it suitable for various electronic applications where space is limited.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture, it offers high performance, energy efficiency, and scalability, making it a good choice for embedded systems and IoT devices.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption, high speed, and reliable performance, making it ideal for battery-operated and portable devices.

Terminal Form: BALL

The ball terminal form facilitates secure connections and soldering on the circuit board, ensuring stable operation and reliable performance of the microprocessor.

Maximum Supply Current: 400 mA

Operating within a maximum supply current of 400 mA ensures efficient power consumption and stable performance in various electronic devices and applications.

Nominal Supply Voltage: 1.1 V

With a nominal supply voltage of 1.1 V, the microprocessor operates efficiently and ensures stable performance under standard operating conditions.

No. of DMA Channels: 64

Having 64 DMA channels allows the microprocessor to efficiently transfer data between peripherals and memory, improving overall system performance and responsiveness.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, the microprocessor offers precise and reliable connections, ensuring smooth communication and data transfer in the system.

Format: FIXED POINT

Using fixed-point format allows the microprocessor to perform arithmetic and logical operations with high precision, making it suitable for applications requiring accurate calculations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microprocessor can withstand moderate exposure to moisture during manufacturing and storage, ensuring long-term reliability and performance.

Speed: 600 rpm

Operating at a speed of 600 rpm, the microprocessor can process instructions and data efficiently, contributing to the overall performance and responsiveness of the system.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy and reduce power consumption when idle, extending battery life and enhancing efficiency.

Technical Specifications

Microprocessors AM3351BZCE60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3351BZCE60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20