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LS1012AXE7KKB

NXP Semiconductors

LS1012AXE7KKB by NXP Semiconductors

LS1012AXE7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. Ideal for industrial applications, it features low power mode and integrated cache, making it suitable for high-speed processing in compact devices.

Median Price

$25.152

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,912 parts In-Stock

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$25.152

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Rochester

USA . 4,382 parts In-Stock

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$22.010

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$19.690

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$18.540

4,382

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$22.010

$19.690

$18.540

Flip Electronics (Authorized)

USA . 467 parts In-Stock

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467

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DigiKey

USA . 21 parts In-Stock

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$27.820

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Distributors (In-Stock)

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Digiode

USA . 2,609 parts In-Stock

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$23.228

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2,609

$23.228

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Nova Conductors

Japan . 21 parts In-Stock

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$32.224

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21

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DigiKey Marketplace

USA . 4,957 parts In-Stock

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$33.490

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4,957

$33.490

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Anansix

USA . 2,668 parts In-Stock

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Vyrian

USA . 1,653 parts In-Stock

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Flip Electronics

USA . 21 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,839 parts In-Stock

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$17.810

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Corphita

USA . 2,002 parts In-Stock

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$22.005

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Continental Prestige Electronics

USA . 3,661 parts In-Stock

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$32.224

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$31.579

3,661

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$31.579

Netroflash

USA . 100 parts In-Stock

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$32.224

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100

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Corohmni

South Africa . 730 parts In-Stock

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$32.676

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$32.676

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Vigor

Singapore . 158 parts In-Stock

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$41.580

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Microchip USA

USA . 1,906 parts In-Stock

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UNI Independent Distributors

Spain . 7,904 parts In-Stock

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Argo Parts USA

USA . 3,978 parts In-Stock

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Perfect Parts

USA . 753 parts In-Stock

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Overview

Unlock the power of innovation with the LS1012AXE7KKB by NXP Semiconductors. This cutting-edge microprocessor offers unparalleled quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications, this product delivers exceptional value to customers seeking high-performance solutions. Experience the benefits of integrated cache, low power mode, and advanced technology in a compact package that exceeds expectations. Elevate your projects with the LS1012AXE7KKB and discover endless possibilities.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve the speed and efficiency of the processor by storing frequently accessed data and instructions for quick access.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the processor onto a circuit board, saving space and facilitating automated manufacturing processes.

Maximum Supply Voltage: 0.93 V

Operating within a low maximum supply voltage range of 0.93 V helps in reducing power consumption and heat generation, making the processor suitable for applications where energy efficiency is a priority.

Address Bus Width: 16

With a wide address bus width of 16, the processor can handle larger amounts of memory and data, enabling it to support complex computing tasks and applications.

Package Shape: SQUARE

The square package shape provides a balanced layout and efficient use of space on the circuit board, making it easier to design and integrate the processor in various electronic devices.

Bit Size: 64

A 64-bit processor can handle larger chunks of data and perform complex calculations more efficiently, making it suitable for high-performance computing tasks and applications.

No. of Terminals: 211

Having a higher number of terminals allows for more connectivity options and interfaces, enabling the processor to interface with a wide range of peripherals and components.

Minimum Supply Voltage: 0.87 V

Operating at a low minimum supply voltage of 0.87 V provides flexibility in power management and helps in reducing energy consumption, making the processor suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the processor can withstand harsh environmental conditions and maintain stable performance even in industrial settings.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures that the processor can function reliably in cold environments without compromising its performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes it easier to mount the processor onto the circuit board and simplifies the assembly process, ensuring secure connections and efficient heat dissipation.

Maximum Seated Height: 0.925 mm

With a low maximum seated height of 0.925 mm, the processor can be incorporated into slim and compact devices without sacrificing performance or functionality.

Width: 9.6 mm

The compact width of 9.6 mm enables the processor to be integrated into space-constrained designs while providing high computational power and connectivity options.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the processor during the manufacturing process, ensuring quality control and reliability in the final product.

External Data Bus Width: 16

With a wide external data bus width of 16, the processor can transfer data to and from external devices more quickly, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz enables the processor to execute instructions and process data at high speed, making it suitable for real-time computing applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The processor can withstand the peak reflow temperature for up to 40 seconds, ensuring reliable soldering and assembly processes during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the processor can undergo soldering processes without damage, ensuring secure connections and long-term reliability.

Length: 9.6 mm

The compact length of 9.6 mm allows for easy integration of the processor into small form factor devices while maintaining high performance and functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures that the processor can operate reliably in demanding environments with varying temperature conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of RISC architecture in the microprocessor allows for efficient execution of instructions and reduced complexity, resulting in high performance and energy efficiency in computing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the processor suitable for energy-efficient and high-performance applications.

Terminal Form: NO LEAD

Having terminals in a no lead form simplifies the assembly process, improves electrical connections, and enhances thermal performance, ensuring long-term reliability and durability.

Nominal Supply Voltage: 0.9 V

Operating at a nominal supply voltage of 0.9 V provides a balance between power efficiency and performance, making the processor suitable for a wide range of battery-powered and portable devices.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5 mm, the processor allows for high-density mounting on the circuit board, saving space and enabling compact designs in electronic devices.

Format: FIXED POINT

The fixed-point format in the processor allows for efficient arithmetic calculations and data processing, making it suitable for embedded computing applications and real-time systems.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the processor can withstand moderate exposure to moisture during storage and handling, ensuring reliability and longevity in use.

Speed: 1000 rpm

Operating at a speed of 1000 revolutions per minute allows the processor to efficiently process instructions and data, enabling quick response times and smooth performance in computing tasks.

Low Power Mode: YES

The low power mode feature enables the processor to reduce power consumption during idle or low workload periods, prolonging battery life and enhancing energy efficiency in mobile devices.

Technical Specifications

Microprocessors LS1012AXE7KKB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XBGA-N211

Length:

9.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

211

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.925 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9.6 mm

Peripheral IC Type:

Trade Compliance

LS1012AXE7KKB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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