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LS1012ASE7HKB

NXP Semiconductors

LS1012ASE7HKB by NXP Semiconductors

The NXP LS1012ASE7HKB microprocessor features a 64-bit architecture, 16-bit address and data bus width, and operates at a max clock frequency of 25 MHz. Ideal for low power applications, it is designed for use in microprocessor-based systems requiring high performance with integrated cache memory.

Median Price

$33.100

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 68 parts In-Stock

1+ parts

$33.100

100+ parts

$22.100

1k+ parts

$18.900

10k+ parts

-

68

$33.100

$22.100

$18.900

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DigiKey

USA . 157 parts In-Stock

1+ parts

$36.930

100+ parts

$28.268

1k+ parts

$25.212

10k+ parts

-

157

$36.930

$28.268

$25.212

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Mouser Electronics

USA . 57 parts In-Stock

1+ parts

$39.820

100+ parts

$29.000

1k+ parts

$25.050

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-

57

$39.820

$29.000

$25.050

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Verical

USA . 9,912 parts In-Stock

1+ parts

-

100+ parts

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$20.792

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9,912

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$20.792

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Flip Electronics (Authorized)

USA . 700 parts In-Stock

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700

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Rochester

USA . 18 parts In-Stock

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-

100+ parts

$21.830

1k+ parts

$19.530

10k+ parts

$18.380

18

-

$21.830

$19.530

$18.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,012 parts In-Stock

1+ parts

$19.200

100+ parts

-

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2,012

$19.200

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Maritex

Poland . 168 parts In-Stock

1+ parts

$45.068

100+ parts

$32.639

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168

$45.068

$32.639

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Bristol Electronics

USA . 21,000 parts In-Stock

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21,000

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Vyrian

USA . 8,084 parts In-Stock

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8,084

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PC Components Company LLC

USA . 5,500 parts In-Stock

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5,500

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Anansix

USA . 1,033 parts In-Stock

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1,033

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Flip Electronics

USA . 700 parts In-Stock

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700

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DigiKey Marketplace

USA . 138 parts In-Stock

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138

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$17.180

100+ parts

-

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226

$17.180

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Corphita

USA . 4,886 parts In-Stock

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$18.189

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4,886

$18.189

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Microchip USA

USA . 2,932 parts In-Stock

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$92.460

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2,932

$92.460

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Lixinc

USA . 15,275 parts In-Stock

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15,275

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UNI Independent Distributors

Spain . 129 parts In-Stock

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129

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Overview

Unleash the power of innovation with the LS1012ASE7HKB by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microprocessors that offer unparalleled performance and reliability. With integrated cache, low power mode, and a maximum clock frequency of 25 MHz, this product is perfect for a wide range of applications. From IoT devices to networking equipment, the LS1012ASE7HKB provides the value, benefits, and advantages you need to stay ahead in today's fast-paced technological landscape. Upgrade your projects with NXP Semiconductors and experience the difference.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing latency in accessing frequently used instructions and data.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and enabling automated manufacturing processes.

Maximum Supply Voltage: 0.93 V

Operating at a low maximum supply voltage of 0.93 V helps in reducing power consumption and heat generation, making it energy-efficient.

Address Bus Width: 16

A wide address bus width of 16 allows for efficient memory addressing and data transfer, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square package shape provides uniformity in design and makes it easier for integration into various electronic devices.

Bit Size: 64

With a bit size of 64, the microprocessor can handle complex computations and process larger chunks of data, suitable for demanding computing tasks.

No. of Terminals: 211

Having a higher number of terminals allows for more connectivity options and enhances the functionality of the microprocessor in diverse applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch not only saves space but also enables high-density packaging for improved performance.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage of 0.87 V ensures stable operation while minimizing power consumption, contributing to energy efficiency.

Maximum Operating Temperature: 105 °C

Operating at a high maximum temperature of 105°C ensures reliability and stability even under demanding thermal conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C allows for a wide range of applications in varying environmental conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy integration and soldering onto circuit boards, improving the overall reliability of connections.

Maximum Seated Height: 0.925 mm

The low maximum seated height of 0.925 mm enables compact design implementations and contributes to overall space-saving benefits.

Width: 9.6 mm

With a width of 9.6 mm, the microprocessor can be easily fitted into compact devices without sacrificing performance or functionality.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during manufacturing and maintenance, enhancing the reliability of the product.

External Data Bus Width: 16

An external data bus width of 16 ensures efficient data transfer between the microprocessor and external devices, optimizing performance.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz enables fast processing speeds suitable for a wide range of applications, from basic computing to multimedia tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand a peak reflow temperature for 40 seconds ensures reliable soldering and assembly processes, contributing to long-term product durability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can undergo high-temperature processes without compromising its functionality or reliability.

Length: 9.6 mm

The compact length of 9.6 mm allows for easy integration into various device designs while maintaining a balance between performance and space efficiency.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers efficient and streamlined instruction execution, making it ideal for applications requiring high performance and low power consumption.

Technology: CMOS

Using CMOS technology offers a good balance between performance and power efficiency, making the microprocessor suitable for a wide range of applications.

Terminal Form: NO LEAD

The no-lead terminal form provides reliable electrical connections while also being environmentally friendly, meeting modern industry standards.

Nominal Supply Voltage: 0.9 V

Having a nominal supply voltage of 0.9 V ensures stable and efficient operation, striking a balance between performance and power consumption.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density packaging and efficient connectivity, enhancing the overall performance and reliability of the microprocessor.

Format: FIXED POINT

Operating in fixed-point format allows for precise and fast arithmetic calculations, making the microprocessor suitable for a variety of mathematical operations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during storage and manufacturing processes, ensuring long-term reliability.

Speed: 800 rpm

Operating at a speed of 800 rpm, the microprocessor can deliver fast and efficient performance for a wide range of computing tasks, from basic to complex operations.

Low Power Mode: YES

The low power mode capability allows the microprocessor to operate efficiently while conserving energy, making it suitable for battery-powered devices and energy-conscious applications.

Technical Specifications

Microprocessors LS1012ASE7HKB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XBGA-N211

Length:

9.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

211

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.925 mm

Speed:

800 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9.6 mm

Peripheral IC Type:

Trade Compliance

LS1012ASE7HKB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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